전자 부품 카탈로그 — 회로도 기호, IPC-7351B 풋프린트 & 3D STEP/GLB (패키지 MLF · 페이지 244)

SMD-38P · 39P

ESP32-WROOM-32E(M113EH6400PH3Q0)

ESPRESSIF·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi / Bluetooth LE 무선 SoC 모듈

DIP-8 · 8P

NE555P

TI·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

인터페이스 브리지 및 클럭/타이머 IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

임베디드 마이크로컨트롤러 (MCU)

PDIP-18 · 8P

PIC16C56A-04/P

MICROCHIP(美国微芯)·PDIP-18

READY

8P

PIC16C56A-04/P

QFN-20-EP(4x4) · 8P

ATTINY24-20MU

MICROCHIP(美国微芯)·QFN-20-EP(4x4)

READY

8P

ATTINY24-20MU

QFN-28-EP(6x6) · 8P

PIC16F767-I/ML

MICROCHIP(美国微芯)·QFN-28-EP(6x6)

READY

8P

PIC16F767-I/ML

SOIC-28-300mil · 8P

PIC18LF2480-I/SO

MICROCHIP(美国微芯)·SOIC-28-300mil

READY

8P

PIC18LF2480-I/SO

TQFP-48(7x7) · 8P

PIC32MM0256GPM048-I/PT

MICROCHIP(美国微芯)·TQFP-48(7x7)

READY

8P

PIC32MM0256GPM048-I/PT

SOIC-28-300mil · 8P

PIC16LF876A-I/SO

MICROCHIP(美国微芯)·SOIC-28-300mil

READY

8P

PIC16LF876A-I/SO

PDIP-40 · 8P

PIC16F877-04/P

MICROCHIP(美国微芯)·PDIP-40

READY

8P

PIC16F877-04/P

DFN-8-EP(2x2) · 8P

SY58604UMG-TR

MICROCHIP(美国微芯)·DFN-8-EP(2x2)

READY

8P

SY58604UMG-TR

TSSOP-20 · 8P

ATF16LV8C-10XU

MICROCHIP(美国微芯)·TSSOP-20

READY

8P

ATF16LV8C-10XU

PDIP-28 · 8P

ATMEGA48-20PU

MICROCHIP(美国微芯)·PDIP-28

READY

8P

ATMEGA48-20PU

QFN-44-EP(8x8) · 8P

PIC32MX250F128D-50I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

8P

MIPS32 M4K 32 Bit 50MHz QFN-44-EP(8x8) Microcontrollers RoHS

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

부품 카탈로그 (3904 개 부품 중 · 페이지 244/244)