4114 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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SOIC-8 · 8P

MIC5013YM-TR (SOIC-8) - 3D-Modell (SOIC-8)

MIC5013YM-TR

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm7 –0.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MICRF022YM-FS12-TR (SOIC-8) - 3D-Modell (SOIC-8)

MICRF022YM-FS12-TR

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

MSOP-10-EP · 11P

MIC61150YMME-TR (MSOP-10-EP) - 3D-Modell (MSOP-10-EP)

MIC61150YMME-TR

MICROCHIP·MSOP-10-EP

READY

11P3.0×3.0×1.10mmP=0.5mm1.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-10 · 10P

MIC5163YMM-TR (MSOP-10) - 3D-Modell (MSOP-10)

MIC5163YMM-TR

MICROCHIP·MSOP-10

READY

10P3.0×3.0×1.10mmP=0.5mm75V to 6V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

TC4426VUA713 (MSOP-8) - 3D-Modell (MSOP-8)

TC4426VUA713

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm4.5V to 18V

Standard-Elektronik- & Steckverbinderbauteil

VQFN-32(5x5) · 33P

ATMEGA88PA-MUR (VQFN-32(5x5)) - 3D-Modell (VQFN-32(5x5))

ATMEGA88PA-MUR

MICROCHIP·VQFN-32(5x5)

READY

33P5.0×5.0×0.55mmP=0.5mm2.7V to 5.5V

Eingebetteter Mikrocontroller (MCU)

QFN-32-EP(5x5) · 33P

AT86RF233-ZUR (QFN-32-EP(5x5)) - 3D-Modell (QFN-32-EP(5x5))

AT86RF233-ZUR

MICROCHIP·QFN-32-EP(5x5)

READY

33P5.0×5.0×0.85mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-3 · 3P

TCM809LENB713 (SOT-23-3) - 3D-Modell (SOT-23-3)

TCM809LENB713

MICROCHIP·SOT-23-3

READY

3P2.9×1.3×1.10mmP=1.9mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

24LC21A-I/SN (SOIC-8) - 3D-Modell (SOIC-8)

24LC21A-I/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PDIL-40 · 40P

AT89C51RB2-3CSUL (PDIL-40) - 3D-Modell (PDIL-40)

AT89C51RB2-3CSUL

MICROCHIP·PDIL-40

READY

40P50.3×13.9×4.20mmP=2.54mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-56-EP(8x8) · 57P

ZL30266LDF1 (QFN-56-EP(8x8)) - 3D-Modell (QFN-56-EP(8x8))

ZL30266LDF1

MICROCHIP·QFN-56-EP(8x8)

READY

57P8.0×8.0×0.90mmP=0.5mm1.5V to 3.3V

Standard-Elektronik- & Steckverbinderbauteil

QFN-56-EP(8x8) · 57P

ZL30265LDF1 (QFN-56-EP(8x8)) - 3D-Modell (QFN-56-EP(8x8))

ZL30265LDF1

MICROCHIP·QFN-56-EP(8x8)

READY

57P8.0×8.0×0.90mmP=0.5mm1.5V to 3.3V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

PIC16F1829T-I/SO (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

PIC16F1829T-I/SO

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.50mmP=1.27mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC16F1709T-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC16F1709T-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC18F25K50T-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18F25K50T-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC18F258T-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18F258T-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

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