4022 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4024 Bauteilen · Seite 88/252)

Zeige 1393–1408 von 4024 Bauteilen

DIP-8 · 8P

AT24C04-10PC-2.7 (DIP-8) - 3D-Modell (DIP-8)

AT24C04-10PC-2.7

MICROCHIP·DIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-8 · 8P

AT24C16B-TH-B (TSSOP-8) - 3D-Modell (TSSOP-8)

AT24C16B-TH-B

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

AT25040A-10PU-2.7 (PDIP-8) - 3D-Modell (PDIP-8)

AT25040A-10PU-2.7

MICROCHIP·PDIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-64(9x9) · 65P

DSPIC33CK128MC506-E/MR (QFN-64(9x9)) - 3D-Modell (QFN-64(9x9))

DSPIC33CK128MC506-E/MR

MICROCHIP·QFN-64(9x9)

READY

65P9.0×9.0×0.90mmP=0.5mm3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

24FC16HT-I/OT (SOT-23-5) - 3D-Modell (SOT-23-5)

24FC16HT-I/OT

MICROCHIP·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm1.7V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSOP-32_L8.1-W12.5-P0.50-LS14.2-TL · 32P

C19483404 (TSOP-32_L8.1-W12.5-P0.50-LS14.2-TL) - 3D-Modell (TSOP-32_L8.1-W12.5-P0.50-LS14.2-TL)

C19483404

Generic·TSOP-32_L8.1-W12.5-P0.50-LS14.2-TL

READY

32P8.1×12.5×2.45mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

SY100EL16VBZG-TR (SOIC-8) - 3D-Modell (SOIC-8)

SY100EL16VBZG-TR

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

TO-263-5 · 6P

MIC37302WU-TR (TO-263-5) - 3D-Modell (TO-263-5)

MIC37302WU-TR

MICROCHIP·TO-263-5

READY

6P10.1×9.0×4.50mmP=1.7mm3.0V to 2.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(4x4) · 29P

PIC16F15356T-I/MV (QFN-28-EP(4x4)) - 3D-Modell (QFN-28-EP(4x4))

PIC16F15356T-I/MV

MICROCHIP·QFN-28-EP(4x4)

READY

29P4.0×4.0×1.00mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MIC38HC43YM-TR (SOIC-8) - 3D-Modell (SOIC-8)

MIC38HC43YM-TR

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SC-70-5 · 5P

MIC5365-1.2YC5-TR (SC-70-5) - 3D-Modell (SC-70-5)

MIC5365-1.2YC5-TR

MICROCHIP·SC-70-5

READY

5P2.0×1.2×0.95mmP=0.65mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-44(10x10) · 44P

ATF1502AS-7AX44 (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

ATF1502AS-7AX44

MICROCHIP·TQFP-44(10x10)

READY

44P10.0×10.0×1.00mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-16(4x4) · 17P

EQCO62X20C1-I/8EX (QFN-16(4x4)) - 3D-Modell (QFN-16(4x4))

EQCO62X20C1-I/8EX

MICROCHIP·QFN-16(4x4)

READY

17P4.0×4.0×0.90mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole · 2P

1N4097 (Through Hole) - 3D-Modell (Through Hole)

1N4097

MICROCHIP·Through Hole

READY

2P2.0×2.0×0.75mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8-208mil · 8P

PIC12C509A-04I/SM (SOIC-8-208mil) - 3D-Modell (SOIC-8-208mil)

PIC12C509A-04I/SM

MICROCHIP·SOIC-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

DIP-14 · 14P

PIC16C505-04I/P (DIP-14) - 3D-Modell (DIP-14)

PIC16C505-04I/P

MICROCHIP·DIP-14

READY

14P17.2×6.3×3.50mmP=2.54mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

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