4002 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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SOIC-8 · 8P

PIC12F617-I/SN (SOIC-8) - 3D-Modell (SOIC-8)

PIC12F617-I/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x3) · 9P

MCP1703AT-5002E/MC (DFN-8-EP(2x3)) - 3D-Modell (DFN-8-EP(2x3))

MCP1703AT-5002E/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.80mmP=0.5mm2.7V to16.0V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x3) · 9P

MCP6241-E/MC (DFN-8-EP(2x3)) - 3D-Modell (DFN-8-EP(2x3))

MCP6241-E/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.80mmP=0.5mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

MIC5206-3.3YM5-TR (SOT-23-5) - 3D-Modell (SOT-23-5)

MIC5206-3.3YM5-TR

MICROCHIP·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm1V to 16V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-24 · 24P

MCP3909-I/SS (SSOP-24) - 3D-Modell (SSOP-24)

MCP3909-I/SS

MICROCHIP·SSOP-24

READY

24P8.2×5.3×1.85mmP=0.65mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

MIC3975-3.3YMM (MSOP-8) - 3D-Modell (MSOP-8)

MIC3975-3.3YMM

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm5V to 3.3V

Standard-Elektronik- & Steckverbinderbauteil

TO-92-3 · 3P

MCP101-450DI/TO (TO-92-3) - 3D-Modell (TO-92-3)

MCP101-450DI/TO

MICROCHIP·TO-92-3

READY

3P4.9×3.7×4.60mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SPDIP-28 · 28P

DSPIC30F3010-30I/SP (SPDIP-28) - 3D-Modell (SPDIP-28)

DSPIC30F3010-30I/SP

MICROCHIP·SPDIP-28

READY

28P34.7×7.2×2.00mm

Standard-Elektronik- & Steckverbinderbauteil

DIP-8 · 8P

25AA256-I/P (DIP-8) - 3D-Modell (DIP-8)

25AA256-I/P

MICROCHIP·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-80(14x14) · 80P

DSPIC30F6014-30I/PF (TQFP-80(14x14)) - 3D-Modell (TQFP-80(14x14))

DSPIC30F6014-30I/PF

MICROCHIP·TQFP-80(14x14)

READY

80P14.0×14.0×1.20mmP=0.65mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SPDIP-28 · 28P

PIC16F723-I/SP (SPDIP-28) - 3D-Modell (SPDIP-28)

PIC16F723-I/SP

MICROCHIP·SPDIP-28

READY

28P35.0×6.3×4.20mmP=2.54mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

MCP3918A1-E/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

MCP3918A1-E/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm2.7V – 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

ATTINY261V-10SU (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

ATTINY261V-10SU

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.70mmP=1.27mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

FQFN-24-EP(3x4) · 27P

MIC28513-2YFL-T5 (FQFN-24-EP(3x4)) - 3D-Modell (FQFN-24-EP(3x4))

MIC28513-2YFL-T5

MICROCHIP·FQFN-24-EP(3x4)

READY

27P3.0×4.0×0.85mmP=0.5mm4.6V to 45V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC16F18344T-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC16F18344T-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

PIC16F15313-I/P (PDIP-8) - 3D-Modell (PDIP-8)

PIC16F15313-I/P

MICROCHIP·PDIP-8

READY

8P3.0×3.0×4.50mmP=2.54mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

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