3794 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3804 Bauteilen · Seite 76/238)

Zeige 1201–1216 von 3804 Bauteilen

TSSOP-8 · 8P

AT24C01C-XHM-T (TSSOP-8) - 3D-Modell (TSSOP-8)

AT24C01C-XHM-T

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm1.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

UDFN-6-EP(2x2) · 7P

MIC2008YML-TR (UDFN-6-EP(2x2)) - 3D-Modell (UDFN-6-EP(2x2))

MIC2008YML-TR

MICROCHIP·UDFN-6-EP(2x2)

READY

7P2.0×2.0×0.85mmP=0.65mm2.5V - 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20 · 20P

PIC16F818-I/SS (SSOP-20) - 3D-Modell (SSOP-20)

PIC16F818-I/SS

MICROCHIP·SSOP-20

READY

20P6.5×4.4×1.10mmP=0.65mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-6 · 6P

MCP9510CT-E/CH (SOT-23-6) - 3D-Modell (SOT-23-6)

MCP9510CT-E/CH

MICROCHIP·SOT-23-6

READY

6P2.9×1.6×1.10mmP=0.95mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

UDFN-8-EP(2x3) · 9P

ATECC508A-MAHDA-S (UDFN-8-EP(2x3)) - 3D-Modell (UDFN-8-EP(2x3))

ATECC508A-MAHDA-S

MICROCHIP·UDFN-8-EP(2x3)

READY

9P3.0×2.0×0.85mmP=0.5mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DIP-40 · 40P

PIC16F917-I/P (DIP-40) - 3D-Modell (DIP-40)

PIC16F917-I/P

MICROCHIP·DIP-40

READY

40P50.3×13.7×4.00mmP=2.54mm2.0V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-14 · 14P

PIC16LF1825-I/ST (TSSOP-14) - 3D-Modell (TSSOP-14)

PIC16LF1825-I/ST

MICROCHIP·TSSOP-14

READY

14P5.0×4.4×1.00mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

TQFP-100(12x12) · 100P

PIC24FJ128GA010-I/PT (TQFP-100(12x12)) - 3D-Modell (TQFP-100(12x12))

PIC24FJ128GA010-I/PT

MICROCHIP·TQFP-100(12x12)

READY

100P12.0×12.0×1.20mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-6 · 6P

MIC280-2BM6 (SOT-23-6) - 3D-Modell (SOT-23-6)

MIC280-2BM6

MICROCHIP·SOT-23-6

READY

6P2.9×1.6×1.10mmP=0.95mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

WLCSP-55 · 55P

ATWILC1000B-UU-T (WLCSP-55) - 3D-Modell (WLCSP-55)

ATWILC1000B-UU-T

MICROCHIP·WLCSP-55

READY

55P3.2×3.2×0.55mmP=0.35mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39VF801C-70-4I-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39VF801C-70-4I-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF1601-70-4C-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF1601-70-4C-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF1602-70-4I-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF1602-70-4I-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD3225-6P · 6P

DSC1123CI2-100.0000 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1123CI2-100.0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm2.25V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

SMD-35P · 36P

RN41-I/RM (SMD-35P) - 3D-Modell (SMD-35P)

RN41-I/RM

MICROCHIP·SMD-35P

READY

36P25.8×13.2×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD1612-4P · 4P

DSC6013HI2A-000.0000T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6013HI2A-000.0000T

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

Entdecken Bauteile Gehäuse Hersteller Upload