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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4004 Bauteilen · Seite 75/251)

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SOT-223 · 4P

MIC5239-1.8YS (SOT-223) - 3D-Modell (SOT-223)

MIC5239-1.8YS

MICROCHIP·SOT-223

READY

4P6.5×3.5×1.60mmP=2.3mm2.3V to 30V

Low-Dropout-Linearspannungsregler (LDO)

PLCC-32(11.4x14) · 32P

SST39SF040-70-4I-NHE (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

SST39SF040-70-4I-NHE

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-52-EP(8x8.5) · 51P

MIC45116-2YMP-TR (QFN-52-EP(8x8.5)) - 3D-Modell (QFN-52-EP(8x8.5))

MIC45116-2YMP-TR

MICROCHIP·QFN-52-EP(8x8.5)

READY

51P8.5×8.0×0.90mmP=0.5mm4.75V to 20V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

MTCH6301-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

MTCH6301-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×0.90mmP=0.65mm2.4V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

PIC24FJ64GB004-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

PIC24FJ64GB004-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×0.90mmP=0.65mm2.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC18F23K22-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18F23K22-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC24F32KA302-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC24F32KA302-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

WLCSP-49(2.8x2.8) · 49P

ATSAMG55G19B-UUT (WLCSP-49(2.8x2.8)) - 3D-Modell (WLCSP-49(2.8x2.8))

ATSAMG55G19B-UUT

MICROCHIP·WLCSP-49(2.8x2.8)

READY

49P2.8×2.8×0.50mmP=0.4mm1.62V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PLCC-44(16.6x16.6) · 44P

PIC16F877-20I/L (PLCC-44(16.6x16.6)) - 3D-Modell (PLCC-44(16.6x16.6))

PIC16F877-20I/L

MICROCHIP·PLCC-44(16.6x16.6)

READY

44P16.6×16.6×1.15mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PLCC-28(11.5x11.5) · 28P

SY10E107JC-TR (PLCC-28(11.5x11.5)) - 3D-Modell (PLCC-28(11.5x11.5))

SY10E107JC-TR

MICROCHIP·PLCC-28(11.5x11.5)

READY

28P11.5×11.5×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-28(11.5x11.5) · 28P

SY100S301JC-TR (PLCC-28(11.5x11.5)) - 3D-Modell (PLCC-28(11.5x11.5))

SY100S301JC-TR

MICROCHIP·PLCC-28(11.5x11.5)

READY

28P11.5×11.5×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

PIC16F689-I/SO (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

PIC16F689-I/SO

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.70mmP=1.27mm2.0V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-44(10x10) · 44P

PIC16F74-I/PT (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

PIC16F74-I/PT

MICROCHIP·TQFP-44(10x10)

READY

44P10.0×10.0×1.20mmP=0.8mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

LFBGA-217 · 217P

AT91SAM9G20B-CU (LFBGA-217) - 3D-Modell (LFBGA-217)

AT91SAM9G20B-CU

MICROCHIP·LFBGA-217

READY

217P15.0×15.0×1.10mmP=0.8mm9V to 1.1V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

PIC16F631-I/SO (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

PIC16F631-I/SO

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.70mmP=1.27mm2.0V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-144(13x13) · 144P

A3P250-1FGG144 (FPBGA-144(13x13)) - 3D-Modell (FPBGA-144(13x13))

A3P250-1FGG144

MICROCHIP·FPBGA-144(13x13)

READY

144P13.0×13.0×1.35mmP=1mm2.7 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

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