3834 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3844 Bauteilen · Seite 67/241)

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DIP-8 · 8P

25AA256-I/P (DIP-8) - 3D-Modell (DIP-8)

25AA256-I/P

MICROCHIP·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-80(14x14) · 80P

DSPIC30F6014-30I/PF (TQFP-80(14x14)) - 3D-Modell (TQFP-80(14x14))

DSPIC30F6014-30I/PF

MICROCHIP·TQFP-80(14x14)

READY

80P14.0×14.0×1.20mmP=0.65mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SPDIP-28 · 28P

PIC16F723-I/SP (SPDIP-28) - 3D-Modell (SPDIP-28)

PIC16F723-I/SP

MICROCHIP·SPDIP-28

READY

28P35.0×6.3×4.20mmP=2.54mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

MCP3918A1-E/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

MCP3918A1-E/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm2.7V – 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

ATTINY261V-10SU (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

ATTINY261V-10SU

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.70mmP=1.27mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

FQFN-24-EP(3x4) · 27P

MIC28513-2YFL-T5 (FQFN-24-EP(3x4)) - 3D-Modell (FQFN-24-EP(3x4))

MIC28513-2YFL-T5

MICROCHIP·FQFN-24-EP(3x4)

READY

27P3.0×4.0×0.85mmP=0.5mm4.6V to 45V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC16F18344T-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC16F18344T-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

PIC16F15313-I/P (PDIP-8) - 3D-Modell (PDIP-8)

PIC16F15313-I/P

MICROCHIP·PDIP-8

READY

8P3.0×3.0×4.50mmP=2.54mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TO-92-3 · 3P

MCP1702-3002E/TO (TO-92-3) - 3D-Modell (TO-92-3)

MCP1702-3002E/TO

MICROCHIP·TO-92-3

READY

3P4.9×3.7×4.60mmP=1.27mm2.7V to 13.2V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

DSPIC30F2010-30I/MM (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

DSPIC30F2010-30I/MM

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-40-EP(5x5) · 41P

PIC16LF18877-I/MV (QFN-40-EP(5x5)) - 3D-Modell (QFN-40-EP(5x5))

PIC16LF18877-I/MV

MICROCHIP·QFN-40-EP(5x5)

READY

41P5.0×5.0×0.85mmP=0.4mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-3 · 3P

MCP1810T-33I/TT (SOT-23-3) - 3D-Modell (SOT-23-3)

MCP1810T-33I/TT

MICROCHIP·SOT-23-3

READY

3P2.9×1.3×1.10mmP=1.9mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-28-208mil · 28P

PIC16LF1933T-I/SS (SSOP-28-208mil) - 3D-Modell (SSOP-28-208mil)

PIC16LF1933T-I/SS

MICROCHIP·SSOP-28-208mil

READY

28P10.2×5.3×2.00mmP=0.65mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-6 · 6P

MIC281-1YM6 (SOT-23-6) - 3D-Modell (SOT-23-6)

MIC281-1YM6

MICROCHIP·SOT-23-6

READY

6P2.9×1.6×1.10mmP=0.95mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-56-EP(8x8) · 57P

ZL30263LDF1 (QFN-56-EP(8x8)) - 3D-Modell (QFN-56-EP(8x8))

ZL30263LDF1

MICROCHIP·QFN-56-EP(8x8)

READY

57P8.0×8.0×0.90mmP=0.5mm1.5V to 3.3V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8-150mil · 8P

ATA663254-GAQW-VAO (SOIC-8-150mil) - 3D-Modell (SOIC-8-150mil)

ATA663254-GAQW-VAO

MICROCHIP·SOIC-8-150mil

READY

8P4.9×3.9×1.75mmP=1.27mm5V to 28V

Standard-Elektronik- & Steckverbinderbauteil

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