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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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SMD,16.6x13.2mm · 53P

ESP8684-MINI-1-H2X (SMD,16.6x13.2mm) - Pinbelegung (53P)

ESP8684-MINI-1-H2X

ESPRESSIF·SMD,16.6x13.2mm

READY

53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD · 53P

ESP8684-MINI-1-H4 (SMD) - Pinbelegung (53P)

ESP8684-MINI-1-H4

READY

53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-61 · 53P

ESP8684-MINI-1-H4X (SMD-61) - Pinbelegung (53P)

ESP8684-MINI-1-H4X

ESPRESSIF·SMD-61

READY

53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

ASOP-6 · 8P

KP22315WGA (ASOP-6) - Pinbelegung (8P)

KP22315WGA

Kiwi Instruments·ASOP-6

READY

8P6.2×3.9×1.65mmP=1.3mm10 to 35 V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

MCP1316MT-46GE/OT (SOT-23-5) - Pinbelegung (5P)

MCP1316MT-46GE/OT

MICROCHIP·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm2.0V to 4.7V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23 · 3P

MCP1700T-3302E/TT(MS) (SOT-23) - Pinbelegung (3P)

MCP1700T-3302E/TT(MS)

MSKSEMI·SOT-23

READY

3P2.9×1.3×1.10mmP=1.9mm

Standard-Elektronik- & Steckverbinderbauteil

DIP-8 · 8P

NE555P (DIP-8) - Pinbelegung (8P)

NE555P

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Schnittstellen-Bridge & Takt-/Timer-IC

SMD-49P · 49P

RN171-I/RM481 (SMD-49P) - Pinbelegung (49P)

RN171-I/RM481

MICROCHIP·SMD-49P

READY

49P17.8×26.7×3.18mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SMD-35P · 36P

RN41-I/RM (SMD-35P) - Pinbelegung (36P)

RN41-I/RM

MICROCHIP·SMD-35P

READY

36P25.8×13.2×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

- · 36P

RN41-I/RM630 (-) - Pinbelegung (36P)

RN41-I/RM630

READY

36P25.8×13.2×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-35P · 36P

RN42-I/RM (SMD-35P) - Pinbelegung (36P)

RN42-I/RM

MICROCHIP·SMD-35P

READY

36P25.8×13.4×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

- · 36P

RN42APL-I/RM550 (-) - Pinbelegung (36P)

RN42APL-I/RM550

READY

36P25.8×13.4×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

- · 36P

RN42HID-I/RM (-) - Pinbelegung (36P)

RN42HID-I/RM

READY

36P25.8×13.4×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

UFQFPN-28(4x4) · 28P

STM32C031G6U6TR (UFQFPN-28(4x4)) - Pinbelegung (28P)

STM32C031G6U6TR

ST·UFQFPN-28(4x4)

READY

28P4.0×4.0×0.55mmP=0.5mm1.62 V - 3.6 V

Eingebetteter Mikrocontroller (MCU)

UFQFPN-48(7x7) · 49P

STM32C091CCU6 (UFQFPN-48(7x7)) - Pinbelegung (49P)

STM32C091CCU6

ST·UFQFPN-48(7x7)

READY

49P7.0×7.0×0.55mmP=0.5mm2.0 V to 3.6 V

Eingebetteter Mikrocontroller (MCU)

WLCSP-24 · 24P

STM32C091ECY6TR (WLCSP-24) - Pinbelegung (24P)

STM32C091ECY6TR

READY

24P2.6×1.7×0.55mmP=0.31mm2.0 V to 3.6 V

Eingebetteter Mikrocontroller (MCU)

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