3954 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3964 Bauteilen · Seite 5/248)

Zeige 65–80 von 3964 Bauteilen

QFN-36-EP(6x6) · 37P

USB2241-AEZG-06 (QFN-36-EP(6x6)) - 3D-Modell (QFN-36-EP(6x6))

USB2241-AEZG-06

MICROCHIP·QFN-36-EP(6x6)

READY

37P6.0×6.0×0.90mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

MIC5317-1.0YM5-T5 (SOT-23-5) - 3D-Modell (SOT-23-5)

MIC5317-1.0YM5-T5

MICROCHIP·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm2.5V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-100(14x14) · 100P

ATXMEGA128B1-AU (TQFP-100(14x14)) - 3D-Modell (TQFP-100(14x14))

ATXMEGA128B1-AU

MICROCHIP·TQFP-100(14x14)

READY

100P14.0×14.0×1.20mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC32MX170F256B-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC32MX170F256B-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm2.3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

UDFN-4-EP(1.2x1.6) · 5P

MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) - 3D-Modell (UDFN-4-EP(1.2x1.6))

MIC5303-2.5YMT-TR

MICROCHIP·UDFN-4-EP(1.2x1.6)

READY

5P1.6×1.2×0.85mmP=0.5mm2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-64(10x10) · 64P

PIC18F67J50-I/PT (TQFP-64(10x10)) - 3D-Modell (TQFP-64(10x10))

PIC18F67J50-I/PT

MICROCHIP·TQFP-64(10x10)

READY

64P10.0×10.0×1.20mmP=0.5mm2.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MIC5239-5.0YM (SOIC-8) - 3D-Modell (SOIC-8)

MIC5239-5.0YM

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.3V to 30V

Standard-Elektronik- & Steckverbinderbauteil

WDFN-8-EP(2x2) · 9P

MCP1501T-18E/RW (WDFN-8-EP(2x2)) - 3D-Modell (WDFN-8-EP(2x2))

MCP1501T-18E/RW

MICROCHIP·WDFN-8-EP(2x2)

READY

9P2.0×2.0×0.80mmP=0.5mm1.024V - 1.250V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

HV9930LG-G (SOIC-8) - 3D-Modell (SOIC-8)

HV9930LG-G

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm7V to 10V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

HV830LG-G (SOIC-8) - 3D-Modell (SOIC-8)

HV830LG-G

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.0 to 9.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC16F1828T-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC16F1828T-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC16C715T-20I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC16C715T-20I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm2.5V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-5.2mm · 20P

PIC16C56AT-20/SS (SSOP-20-5.2mm) - 3D-Modell (SSOP-20-5.2mm)

PIC16C56AT-20/SS

MICROCHIP·SSOP-20-5.2mm

READY

20P7.2×5.3×2.00mmP=0.65mm2.0V to 6.25V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

dsPIC33EV32GM002T-I/MM (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

dsPIC33EV32GM002T-I/MM

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.5mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TFSOP-32 · 32P

AT27LV040A-12VI (TFSOP-32) - 3D-Modell (TFSOP-32)

AT27LV040A-12VI

MICROCHIP·TFSOP-32

READY

32P12.4×8.0×2.45mmP=0.5mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6001HI2A-032.0000T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6001HI2A-032.0000T

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.40mmP=0.8mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

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