3744 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3747 Bauteilen · Seite 199/235)

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QFN-32(4x4) · 33P

CH338F (QFN-32(4x4)) - 3D-Modell (QFN-32(4x4))

CH338F

WCH·QFN-32(4x4)

READY

33P4.0×4.0×0.85mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-48(5x5) · 49P

CH583M (QFN-48(5x5)) - 3D-Modell (QFN-48(5x5))

CH583M

WCH·QFN-48(5x5)

READY

49P5.0×5.0×0.85mmP=0.35mm

Standard-Elektronik- & Steckverbinderbauteil

LQFP-64M(10x10) · 64P

CH395A (LQFP-64M(10x10)) - 3D-Modell (LQFP-64M(10x10))

CH395A

WCH·LQFP-64M(10x10)

READY

64P10.0×10.0×1.40mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-28(4X4) · 29P

CH32X035G8U6 (QFN-28(4X4)) - 3D-Modell (QFN-28(4X4))

CH32X035G8U6

WCH·QFN-28(4X4)

READY

29P4.0×4.0×0.85mmP=0.4mm2V~5.5V

Standard-Elektronik- & Steckverbinderbauteil

LQFP-100(14x14) · 100P

CH32F207VCT6 (LQFP-100(14x14)) - 3D-Modell (LQFP-100(14x14))

CH32F207VCT6

WCH·LQFP-100(14x14)

READY

100P14.0×14.0×1.40mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

ESSOP-10-150mil-1mm · 11P

CH9340K (ESSOP-10-150mil-1mm) - 3D-Modell (ESSOP-10-150mil-1mm)

CH9340K

WCH·ESSOP-10-150mil-1mm

READY

11P4.9×3.9×1.10mmP=1mm3.3V to 5V

Standard-Elektronik- & Steckverbinderbauteil

LQFP-100(14x14) · 100P

CH32V303VCT6 (LQFP-100(14x14)) - 3D-Modell (LQFP-100(14x14))

CH32V303VCT6

WCH·LQFP-100(14x14)

READY

100P14.0×14.0×1.60mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

QFN-16(3x3) · 17P

CH334P (QFN-16(3x3)) - 3D-Modell (QFN-16(3x3))

CH334P

WCH·QFN-16(3x3)

READY

17P3.0×3.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-32(4x4) · 33P

CH9438F (QFN-32(4x4)) - 3D-Modell (QFN-32(4x4))

CH9438F

WCH·QFN-32(4x4)

READY

33P4.0×4.0×0.85mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-32(4x4) · 33P

CH32M030K9U7 (QFN-32(4x4)) - 3D-Modell (QFN-32(4x4))

CH32M030K9U7

WCH·QFN-32(4x4)

READY

33P4.0×4.0×0.85mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-20 · 21P

CH32V006F8U7 (QFN-20) - 3D-Modell (QFN-20)

CH32V006F8U7

READY

21P3.0×3.0×0.85mmP=0.4mm

Eingebetteter Mikrocontroller (MCU)

QFN-68(8x8) · 69P

CH32H417WEU6 (QFN-68(8x8)) - 3D-Modell (QFN-68(8x8))

CH32H417WEU6

WCH·QFN-68(8x8)

READY

69P8.0×8.0×0.90mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-24(4x4) · 25P

CH449F (QFN-24(4x4)) - 3D-Modell (QFN-24(4x4))

CH449F

WCH·QFN-24(4x4)

READY

25P4.0×4.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

LQFP-64(7x7) · 64P

CH32V205RCT6 (LQFP-64(7x7)) - 3D-Modell (LQFP-64(7x7))

CH32V205RCT6

WCH·LQFP-64(7x7)

READY

64P7.0×7.0×1.60mmP=0.4mm1.8V~3.6V

Eingebetteter Mikrocontroller (MCU)

QFN-16(2x2) · 16P

CH9441C (QFN-16(2x2)) - 3D-Modell (QFN-16(2x2))

CH9441C

WCH·QFN-16(2x2)

READY

16P2.0×2.0×0.85mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

QFN26C(3x3) · 26P

CH32M007E8U7 (QFN26C(3x3)) - 3D-Modell (QFN26C(3x3))

CH32M007E8U7

WCH·QFN26C(3x3)

READY

26P3.0×3.0×0.90mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

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