3982 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3984 Bauteilen · Seite 102/249)

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TFBGA-144 · 144P

PIC32MZ1024EFK144-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ1024EFK144-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44(5x5) · 45P

ATMEGA324A-MCHR (QFN-44(5x5)) - 3D-Modell (QFN-44(5x5))

ATMEGA324A-MCHR

MICROCHIP·QFN-44(5x5)

READY

45P5.0×5.0×1.35mmP=0.53mm1.8V - 5.5V

Eingebetteter Mikrocontroller (MCU)

SMD3225-6P · 6P

DSC1101CM1-075.0000 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1101CM1-075.0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

AMPMGEB-24.545454T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

AMPMGEB-24.545454T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF800B-70-4I-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF800B-70-4I-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

UDFN-6-EP(2x2) · 7P

MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) - 3D-Modell (UDFN-6-EP(2x2))

MIC2033-08BYMT-T5

MICROCHIP·UDFN-6-EP(2x2)

READY

7P2.0×2.0×0.85mmP=0.65mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSOP-28-10.1mm · 28P

AT28HC256-90TU-T (TSOP-28-10.1mm) - 3D-Modell (TSOP-28-10.1mm)

AT28HC256-90TU-T

MICROCHIP·TSOP-28-10.1mm

READY

28P18.3×10.1×2.50mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39VF801C-70-4C-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39VF801C-70-4C-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD3225-6P · 6P

DSC1121CE1-025.0012 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1121CE1-025.0012

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

AMPMGEB-11.2896T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

AMPMGEB-11.2896T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6331HI2AA-031.9488 (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6331HI2AA-031.9488

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V ~ 3.63V

Standard-Elektronik- & Steckverbinderbauteil

SMD · 29P

ATWINC1510-MR210UB (SMD) - 3D-Modell (SMD)

ATWINC1510-MR210UB

READY

29P21.8×14.8×2.40mmP=1.02mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-36P · 37P

ATWINC3400-MR210CA142 (SMD-36P) - 3D-Modell (SMD-36P)

ATWINC3400-MR210CA142

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

UFBGA-88(6x6) · 88P

ATMXT640U-CCU023 (UFBGA-88(6x6)) - 3D-Modell (UFBGA-88(6x6))

ATMXT640U-CCU023

MICROCHIP·UFBGA-88(6x6)

READY

88P6.0×6.0×0.60mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX · 324P

C20297164 (PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX) - 3D-Modell (PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX)

C20297164

Generic·PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX

READY

324P23.0×23.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFM144T-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFM144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

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