4110 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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DFN-8-EP(3x3) · 9P

MCP1602T-180I/MF (DFN-8-EP(3x3)) - 3D-Modell (DFN-8-EP(3x3))

MCP1602T-180I/MF

MICROCHIP·DFN-8-EP(3x3)

READY

9P3.0×3.0×0.90mmP=0.65mm8V to 4.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC18LF13K50T-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC18LF13K50T-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm1.8V-3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

PIC18F45K20T-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

PIC18F45K20T-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×1.00mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TDFN-4(1x1) · 5P

MIC5504-3.1YMT-TR

MICROCHIP·TDFN-4(1x1)

READY

5P1.0×1.0×0.85mmP=0.57mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28 · 28P

AT27C256R-45RI (SOIC-28) - 3D-Modell (SOIC-28)

AT27C256R-45RI

MICROCHIP·SOIC-28

READY

28P18.3×8.6×2.50mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C256R-15JI (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C256R-15JI

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C256R-90JC (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C256R-90JC

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

TSOP-28 · 28P

AT27C256R-45TU (TSOP-28) - 3D-Modell (TSOP-28)

AT27C256R-45TU

MICROCHIP·TSOP-28

READY

28P11.8×8.0×2.50mmP=0.55mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C256R-70JI (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C256R-70JI

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

0402 · 2P

MPP4205-206/TR (0402) - 3D-Modell (0402)

MPP4205-206/TR

MICROCHIP·0402

READY

2P1.0×0.5×0.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC16F873-04/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC16F873-04/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.50mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

UQFN-40-EP(5x5) · 41P

PIC18LF47K40-E/MV (UQFN-40-EP(5x5)) - 3D-Modell (UQFN-40-EP(5x5))

PIC18LF47K40-E/MV

MICROCHIP·UQFN-40-EP(5x5)

READY

41P5.0×5.0×0.50mmP=0.4mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC24F16KL402-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC24F16KL402-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PQFP-44(10x10) · 44P

HV5622PG-G (PQFP-44(10x10)) - 3D-Modell (PQFP-44(10x10))

HV5622PG-G

MICROCHIP·PQFP-44(10x10)

READY

44P10.0×10.0×2.20mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

SMD · 12P

MRF89XAM9A-I/RM (SMD) - 3D-Modell (SMD)

MRF89XAM9A-I/RM

READY

12P28.2×19.8×3.10mm2.1–3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

PDIP-40 · 40P

PIC16F871-I/P (PDIP-40) - 3D-Modell (PDIP-40)

PIC16F871-I/P

MICROCHIP·PDIP-40

READY

40P50.3×13.7×4.20mmP=2.54mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

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