TC32MCDB (SOT-223) — Symbol, Footprint IPC-7351B & 3D STEP Model

TC32MCDB

MICROCHIPSOT-223 · 4 Pins · Pitch 2.30mmDISCREPANCY REVIEW REQUIRED5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · TC32MCDB (SOT-223)1GND2VDD4VDD3RSGrid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.210.25.10-5.1-10.2mm
2. 2D FOOTPRINT
1234E=6.50mm · Pitch e=2.30mmD=3.50mm-5-4-3-2-10123456543210-1-2-3-4-5-6mm
3. 3D CAD MODEL
Package Body: 6.50mm × 3.50mm · Pitch: 2.30mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (4/4)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1GNDGNDGround Reference Pin (GND)
2VDDPowerPower Supply Input (VDD — 4.5V to 5.5V)
3RSI/OMultiplexed I/O & Peripheral Pin RS (General)
4VDDPowerPower Supply Input (VDD — 4.5V to 5.5V)
PIN 1 GND
GND
Ground Reference Pin (GND)
Design note: Ground .
IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 8 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
1. Realistic 3D PackageREPRESENTATIVE
TC32MCDB (SOT-223) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
TC32MCDB (SOT-223) - 2. Standard Pinout (Top View)
True package pinout (4 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
TC32MCDB (SOT-223) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
TC32MCDB (SOT-223) - 4. Package Dimensions (D×E×A)
SOT-223 · 6.50×3.50mm · Pitch 2.30mmExpand ›
5. Recommended Land PatternLAND PATTERN
TC32MCDB (SOT-223) - 5. Recommended Land Pattern
IPC-7351B Footprint (4 Pads)Expand ›
6. Application SchematicSCHEMATIC
TC32MCDB (SOT-223) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)
Showing 1–8 of 8 uncropped original figures for TC32MCDB
P1 · p01_fig01EXACT PACKAGE
TC32MCDB (SOT-223) — TC32MEZB TO-92 -40°C to +85°C
TC32MEZB TO-92 -40°C to +85°C
P7 · p07_fig01EXACT PACKAGE
TC32MCDB (SOT-223) — 4.0 PACKAGING INFORMATION
4.0 PACKAGING INFORMATION
P1 · p01_fig01P1
TC32MCDB (SOT-223) — Datasheet Page 1 (p01_fig01)
Datasheet Page 1 (p01_fig01)
P2 · p02_fig01867×721px
TC32MCDB (SOT-223) — TC32M
TC32M
P2 · p02_fig02867×662px
TC32MCDB (SOT-223) — Functional Block Diagram Typical Operating Circuit | 5V | R1, 10 kΩ | R2, 10 kΩ | RS TC32M | Microcontroller | Reset | PO.1 | Reset
Functional Block Diagram Typical Operating Circuit | 5V | R1, 10 kΩ | R2, 10 kΩ | RS TC32M | Microcontroller | Reset | PO.1 | Reset
P7 · p07_fig01P7
TC32MCDB (SOT-223) — Datasheet Page 7 (p07_fig01)
Datasheet Page 7 (p07_fig01)
P8 · p08_fig011260×1106px
TC32MCDB (SOT-223) — 4.3 Package Dimensions
4.3 Package Dimensions
P8 · p08_fig021777×983px
TC32MCDB (SOT-223) — DS21402D-page 8  2001-2012 Microchip Technology Inc. | .105 (2.67) .095 (2.41) | .018 (0.46) .015 (0.38) | .135 (3.43) | Min. | .500 (12.70) | Min. .210 (5.33) .170 (4.32) | .205 (5.21) .175 (4.45) | .165 (4.19) .125 (3.18) | .105 (2.67) .
DS21402D-page 8  2001-2012 Microchip Technology Inc. | .105 (2.67) .095 (2.41) | .018 (0.46) .015 (0.38) | .135 (3.43) | Min. | .500 (12.70) | Min. .210 (5.33) .170 (4.32) | .205 (5.21) .175 (4.45) | .165 (4.19) .125 (3.18) | .105 (2.67) .

Technical Specifications & Part Details (TC32MCDB)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Low-Dropout Linear Voltage Regulator (LDO)
Detailed Overview:TC32MCDB (SOT-223) is a 4-pin low-dropout linear voltage regulator (ldo) featuring a 6.50 × 3.50 × 1.60 mm mechanical envelope (lead pitch e = 2.30 mm). Rated for 4.5V to 5.5V supply operation across 0°C to +70°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
4.5V to 5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
0°C to +70°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
6.50 × 3.50 × 1.60 mm (A1=0.06 mm)
Package family: SOT223 (SOT-223)
Pin Count & Lead PitchN / e
4 Pins | Pitch e = 2.30 mm (90.6 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol4 auto-grouped pins
OK
IPC-7351B Land Pattern4 pads · Pitch 2.30mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOT-223)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
6.50 × 3.50 mm
Height (A) & Pitch (e)IPC-7351B
A=1.60mm · e=2.30mm
Pad Size (W × L)Level B
0.95 × 2.00 mm
Pins / Total PadsTopology
4P / 4Pad (SOT_TAB)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOT-223
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — TC32MCDB (SOT-223)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of TC32MCDB (SOT-223)?

Manufactured by MICROCHIP, the TC32MCDB is housed in a SOT-223 package with 4 pins and a 2.30 mm lead pitch, supporting a VCC supply range of 4.5V to 5.5V. Key pins include: 1 (GND: Ground Reference Pin (GND)), 2 (VDD: Power Supply Input (VDD — 4.5V to 5.5V)), 3 (RS: Multiplexed I/O & Peripheral Pin RS (General)), 4 (VDD: Power Supply Input (VDD — 4.5V to 5.5V)).

What are the IPC-7351B PCB Footprint dimensions for TC32MCDB?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), TC32MCDB (SOT-223) has a nominal body envelope of 3.50 × 6.50 mm, pitch e = 2.30 mm, and 4 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for TC32MCDB?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for TC32MCDB (MICROCHIP, SOT-223) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (4 pins) & TC32MCDB Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
2VDDPower_InPrimary positive power supply input (VDD) operating in the 4.5V to 5.5V domain (Max rating: 5.5V).
3RSDigital_IOSignal terminal RS (I/O, 4.5V to 5.5V domain). Multiplexed alternate functions: RS. Supported peripheral buses: General.
4VDDPower_InPrimary positive power supply input (VDD) operating in the 4.5V to 5.5V domain (Max rating: 5.5V).