MIC5282-3.3YMM-TR (MSOP-8-EP) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC5282-3.3YMM-TR (MSOP-8-EP)?

Manufactured by MICROCHIP, the MIC5282-3.3YMM-TR is housed in a MSOP-8-EP package with 9 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 6V to 120V. Key pins include: 1 (VIN: Power Supply Input (VIN — 6V to 120V)), 2 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 3 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 4 (CPSRR: Multiplexed I/O & Peripheral Pin CPSRR (General)), 5 (GND: Ground Reference Pin (GND)), 6 (FB: Multiplexed I/O & Peripheral Pin FB (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC5282-3.3YMM-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5282-3.3YMM-TR (MSOP-8-EP) has a nominal body envelope of 3.90 × 4.90 mm, pitch e = 1.27 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 2.40 × 3.10 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5282-3.3YMM-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5282-3.3YMM-TR (MICROCHIP, MSOP-8-EP) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 3.90mm × 4.90mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (9/9)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	VIN	Power	Power Supply Input (VIN — 6V to 120V)
2	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
3	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
4	CPSRR	I/O	Multiplexed I/O & Peripheral Pin CPSRR (General)
5	GND	GND	Ground Reference Pin (GND)
6	FB	I/O	Multiplexed I/O & Peripheral Pin FB (General)
7	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
8	VOUT	Power	Regulated Power Output (VOUT — 6V to 120V)
9	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 VIN

Power

Power Supply Input (VIN — 6V to 120V)

Design note: SupplyVoltageInput Connect1µF . capacitorfromVINtoGND .

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 16 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC5282-3.3YMM-TR (MSOP-8-EP) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC5282-3.3YMM-TR (MSOP-8-EP) - 2. Standard Pinout (Top View)

True package pinout (9 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC5282-3.3YMM-TR (MSOP-8-EP) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC5282-3.3YMM-TR (MSOP-8-EP) - 4. Package Dimensions (D×E×A)

MSOP-8-EP · 3.90×4.90mm · Pitch 1.27mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC5282-3.3YMM-TR (MSOP-8-EP) - 5. Recommended Land Pattern

IPC-7351B Footprint (9 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC5282-3.3YMM-TR (MSOP-8-EP) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (16 figures · Page 1/2)

Showing 1–12 of 16 uncropped original figures for MIC5282

P1 · p01_fig011067×729px

Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com

P1 · p01_fig02720×744px

Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com

P1 · p01_fig01P1

Datasheet Page 1 (p01_fig01)

P2 · p02_fig01751×410px

8-Pin ePAD MSOP MIC5282-x.xYMME

P2 · p02_fig02755×406px

8-Pin MSOP MIC5282-x.xYMM

P2 · p02_fig03741×404px

(TOP VIEW)

P2 · p02_fig04755×402px

(TOP VIEW)

P2 · p02_fig01P2

Datasheet Page 2 (p02_fig01)

P14 · p14_fig01612×999px

Top Layer Silk Screen

P14 · p14_fig02576×948px

Top Layer Traces

P15 · p15_fig01608×1002px

Bottom Layer Traces

P15 · p15_fig02596×970px

Bottom Layer Silk Screen

Page 1 / 2 (16 extracted figures)

Technical Specifications & Part Details (MIC5282-3.3YMM-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC5282-3.3YMM-TR (MSOP-8-EP) is a 8-pin standard electronic & interconnect component featuring a 4.90 × 3.90 × 1.10 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 6V to 120V supply operation across 40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

6V to 120V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

10kHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

50mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

4.90 × 3.90 × 1.10 mm (A1=0.05 mm)

Package family: TSSOP (MSOP-8-EP)

Pin Count & Lead PitchN / e

8 Pins | Pitch e = 1.27 mm (50.0 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol9 auto-grouped pins

IPC-7351B Land Pattern9 pads · Pitch 1.27mm

IPC-7525 60% Solder PasteEPAD 2.40×3.10mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MSOP-8-EP)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

4.90 × 3.90 mm

Height (A) & Pitch (e)IPC-7351B

A=1.10mm · e=1.27mm

Pad Size (W × L)Level B

0.60 × 1.55 mm

Pins / Total PadsTopology

9P / 9Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit MSOP-8-EP	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC5282-3.3YMM-TR (MSOP-8-EP)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC5282-3.3YMM-TR (MSOP-8-EP)?

Manufactured by MICROCHIP, the MIC5282-3.3YMM-TR is housed in a MSOP-8-EP package with 9 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 6V to 120V. Key pins include: 1 (VIN: Power Supply Input (VIN — 6V to 120V)), 2 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 3 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 4 (CPSRR: Multiplexed I/O & Peripheral Pin CPSRR (General)), 5 (GND: Ground Reference Pin (GND)), 6 (FB: Multiplexed I/O & Peripheral Pin FB (General)).

What are the IPC-7351B PCB Footprint dimensions for MIC5282-3.3YMM-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5282-3.3YMM-TR (MSOP-8-EP) has a nominal body envelope of 3.90 × 4.90 mm, pitch e = 1.27 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 2.40 × 3.10 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5282-3.3YMM-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5282-3.3YMM-TR (MICROCHIP, MSOP-8-EP) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (9 pins) & MIC5282 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	VIN	Power_In	Primary positive power supply input (VIN) operating in the 6V to 120V domain (Max rating: 120.0V).
2	NC	NC	Signal terminal NC (I/O, 6V to 120V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
3	NC	NC	Signal terminal NC (I/O, 6V to 120V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
4	CPSRR	Digital_IO	Signal terminal CPSRR (I/O, 6V to 120V domain). Multiplexed alternate functions: CPSRR. Supported peripheral buses: General.
5	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
6	FB	Digital_IO	Signal terminal FB (I/O, 6V to 120V domain). Multiplexed alternate functions: FB. Supported peripheral buses: General.
7	NC	NC	Signal terminal NC (I/O, 6V to 120V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
8	VOUT	Power_Out	Regulated power output rail (VOUT) operating in the 6V to 120V domain (Max rating: 120.0V).
9	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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