PIC18F258T-I/SO (SOIC-28-300mil) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of PIC18F258T-I/SO (SOIC-28-300mil)?

Manufactured by MICROCHIP, the PIC18F258T-I/SO is housed in a SOIC-28-300mil package with 28 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 2.0V to 5.5V. Key pins include: 1 (MCLR#/VPP: Multiplexed I/O & Peripheral Pin MCLR#/VPP (General)), 2 (RA0/AN0/CVREF: Multiplexed I/O & Peripheral Pin RA0/AN0/CVREF (General)), 3 (RA1/AN1: Multiplexed I/O & Peripheral Pin RA1/AN1 (General)), 4 (RA2/AN2/VREF-: Multiplexed I/O & Peripheral Pin RA2/AN2/VREF- (General)), 5 (RA3/AN3/VREF+: Multiplexed I/O & Peripheral Pin RA3/AN3/VREF+ (General)), 6 (RA4/T0CKI: Multiplexed I/O & Peripheral Pin RA4/T0CKI (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for PIC18F258T-I/SO?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC18F258T-I/SO (SOIC-28-300mil) has a nominal body envelope of 7.50 × 17.90 mm, pitch e = 1.27 mm, and 28 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC18F258T-I/SO?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC18F258T-I/SO (MICROCHIP, SOIC-28-300mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 7.50mm × 17.90mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (28/28)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	MCLR#/VPP	I/O	Multiplexed I/O & Peripheral Pin MCLR#/VPP (General)
2	RA0/AN0/CVREF	Analog	Multiplexed I/O & Peripheral Pin RA0/AN0/CVREF (General)
3	RA1/AN1	I/O	Multiplexed I/O & Peripheral Pin RA1/AN1 (General)
4	RA2/AN2/VREF-	Analog	Multiplexed I/O & Peripheral Pin RA2/AN2/VREF- (General)
5	RA3/AN3/VREF+	Analog	Multiplexed I/O & Peripheral Pin RA3/AN3/VREF+ (General)
6	RA4/T0CKI	I/O	Multiplexed I/O & Peripheral Pin RA4/T0CKI (General)
7	RA5/AN4/SS#/LVDIN	I/O	Multiplexed I/O & Peripheral Pin RA5/AN4/SS#/LVDIN (General)
8	VSS	GND	Ground Reference Pin (VSS)
9	OSC1/CLKI	I/O	Multiplexed I/O & Peripheral Pin OSC1/CLKI (RTC/CLK)
10	OSC2/CLKO/RA6	I/O	Multiplexed I/O & Peripheral Pin OSC2/CLKO/RA6 (RTC/CLK)
11	RC0/T1OSO/T1CKI	I/O	Multiplexed I/O & Peripheral Pin RC0/T1OSO/T1CKI (General)
12	RC1/T1OSI	I/O	Multiplexed I/O & Peripheral Pin RC1/T1OSI (General)
13	RC2/CCP1	I/O	Multiplexed I/O & Peripheral Pin RC2/CCP1 (General)
14	RC3/SCK/SCL	I/O	Multiplexed I/O & Peripheral Pin RC3/SCK/SCL (SPI, I2C)
15	RC4/SDI/SDA	I/O	Multiplexed I/O & Peripheral Pin RC4/SDI/SDA (I2C)
16	RC5/SDO	I/O	Multiplexed I/O & Peripheral Pin RC5/SDO (General)
17	RC6/TX/CK	I/O	Multiplexed I/O & Peripheral Pin RC6/TX/CK (General)
18	RC7/RX/DT	I/O	Multiplexed I/O & Peripheral Pin RC7/RX/DT (General)
19	VSS	GND	Ground Reference Pin (VSS)
20	VDD	Power	Power Supply Input (VDD — 2.0V to 5.5V)
21	RB0/INT0	I/O	Multiplexed I/O & Peripheral Pin RB0/INT0 (General)
22	RB1/INT1	I/O	Multiplexed I/O & Peripheral Pin RB1/INT1 (General)
23	RB2/CANTX/INT2	I/O	Multiplexed I/O & Peripheral Pin RB2/CANTX/INT2 (CAN)
24	RB3/CANRX	I/O	Multiplexed I/O & Peripheral Pin RB3/CANRX (CAN)
25	RB4	I/O	Multiplexed I/O & Peripheral Pin RB4 (General)
26	RB5/PGM	I/O	Multiplexed I/O & Peripheral Pin RB5/PGM (General)
27	RB6/PGC	I/O	Multiplexed I/O & Peripheral Pin RB6/PGC (General)
28	RB7/PGD	I/O	Multiplexed I/O & Peripheral Pin RB7/PGD (General)

PIN 1 MCLR#/VPP

I/O

Multiplexed I/O & Peripheral Pin MCLR#/VPP (General)

Design note: Signal terminal MCLR#/VPP (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: MCLR#/VPP. Supported peripheral buses: General.

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 15 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

PIC18F258T-I/SO (SOIC-28-300mil) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

PIC18F258T-I/SO (SOIC-28-300mil) - 2. Standard Pinout (Top View)

True package pinout (28 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

PIC18F258T-I/SO (SOIC-28-300mil) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

PIC18F258T-I/SO (SOIC-28-300mil) - 4. Package Dimensions (D×E×A)

SOIC-28-300mil · 7.50×17.90mm · Pitch 1.27mmExpand ›

5. Recommended Land PatternLAND PATTERN

PIC18F258T-I/SO (SOIC-28-300mil) - 5. Recommended Land Pattern

IPC-7351B Footprint (28 Pads)Expand ›

6. Application SchematicSCHEMATIC

PIC18F258T-I/SO (SOIC-28-300mil) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (15 figures · Page 1/2)

Showing 1–12 of 15 uncropped original figures for PIC18F258T / PIC18LF458

P2 · p02_fig011777×1636px

PIC18F258T-I/SO (SOIC-28-300mil) — DS41159E-page ii © 2006 Microchip Technology Inc. | Trademarks | AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporat

DS41159E-page ii © 2006 Microchip Technology Inc. | Trademarks | AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporat

P2 · p02_fig02783×282px

PIC18F258T-I/SO (SOIC-28-300mil) — DS41159E-page ii © 2006 Microchip Technology Inc.

P126 · p126_fig011772×557px

PIC18F258T-I/SO (SOIC-28-300mil) — In Capture mode, CCPR1H:CCPR1L captures the 16- bit value of the TMR1 or TMR3 register when an event occurs on pin RC2/CCP1. An event is defined as:

In Capture mode, CCPR1H:CCPR1L captures the 16- bit value of the TMR1 or TMR3 register when an event occurs on pin RC2/CCP1. An event is defined as:

P126 · p126_fig01P126

Datasheet Page 126 (p126_fig01)

P128 · p128_fig011509×540px

FIGURE 15-2: COMPARE MODE OPERATION BLOCK DIAGRAM

P134 · p134_fig01869×374px

TABLE 16-2: INTERACTION OF CCP1 AND ECCP1 MODULES

P149 · p149_fig011777×937px

FIGURE 17-2: SPI™ MASTER/SLAVE CONNECTION

P152 · p152_fig011777×1059px

FIGURE 17-5: SPI™ MODE WAVEFORM (SLAVE MODE WITH CKE = 0) SS Optional SCK (CKP = 0 SCK (CKP = 1 CKE = 0)

P152 · p152_fig021777×1097px

FIGURE 17-6: SPI™ MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SS SCK (CKP = 0 CKE = 1) SCK (CKP = 1 CKE = 1)

P152 · p152_fig01P152

Datasheet Page 152 (p152_fig01)

P379 · p379_fig011553×1166px

29.1 Package Marking Information

P379 · p379_fig021777×902px

PIC18F258T-I/SO (SOIC-28-300mil) — © 2006 Microchip Technology Inc. DS41159E-page 377 | Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-spe

© 2006 Microchip Technology Inc. DS41159E-page 377 | Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-spe

Page 1 / 2 (15 extracted figures)

Technical Specifications & Part Details (PIC18F258T-I/SO)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:PIC18F258T-I/SO (SOIC-28-300mil) is a 28-pin standard electronic & interconnect component featuring a 17.90 × 7.50 × 2.70 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 2.0V to 5.5V supply operation across -40°C to +85°C with integrated UART, SPI, I2C, PWM, CAN, RTC/CLK interfaces.

Operating Supply VoltageV_CC / V_DD

2.0V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to +85°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

40 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

17.90 × 7.50 × 2.70 mm (A1=0.20 mm)

Package family: SOIC (SOIC-28-300mil)

Pin Count & Lead PitchN / e

28 Pins | Pitch e = 1.27 mm (50.0 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

UART, SPI, I2C, PWM, CAN, RTC/CLK

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol28 auto-grouped pins

IPC-7351B Land Pattern28 pads · Pitch 1.27mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

IPC-7351B

Family Variants & Same Datasheet Chips — PIC18F258T / PIC18LF458 (2)

Select package variant or sibling MPN sharing this datasheet

SOIC-28-300mil · 28P

PIC18F258T-I/SO

MICROCHIP·SOIC-28-300mil

IPC-7351B

28P17.9×7.5×2.70mmP=1.27mm

PIC18F258T / PIC18LF458 (SOIC-28-300mil)

TQFP-44(10x10) · 44P

PIC18LF458-I/PT

MICROCHIP·TQFP-44(10x10)

IPC-7351B

44P10.0×10.0×1.00mmP=0.8mm

PIC18F258T / PIC18LF458 (TQFP-44(10x10))

Mechanical Dimensions & Land Pattern (SOIC-28-300mil)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

17.90 × 7.50 mm

Height (A) & Pitch (e)IPC-7351B

A=2.70mm · e=1.27mm

Pad Size (W × L)Level B

0.60 × 1.90 mm

Pins / Total PadsTopology

28P / 28Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit SOIC-28-300mil	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC18F258T-I/SO (SOIC-28-300mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC18F258T-I/SO (SOIC-28-300mil)?

Manufactured by MICROCHIP, the PIC18F258T-I/SO is housed in a SOIC-28-300mil package with 28 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 2.0V to 5.5V. Key pins include: 1 (MCLR#/VPP: Multiplexed I/O & Peripheral Pin MCLR#/VPP (General)), 2 (RA0/AN0/CVREF: Multiplexed I/O & Peripheral Pin RA0/AN0/CVREF (General)), 3 (RA1/AN1: Multiplexed I/O & Peripheral Pin RA1/AN1 (General)), 4 (RA2/AN2/VREF-: Multiplexed I/O & Peripheral Pin RA2/AN2/VREF- (General)), 5 (RA3/AN3/VREF+: Multiplexed I/O & Peripheral Pin RA3/AN3/VREF+ (General)), 6 (RA4/T0CKI: Multiplexed I/O & Peripheral Pin RA4/T0CKI (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC18F258T-I/SO?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC18F258T-I/SO (SOIC-28-300mil) has a nominal body envelope of 7.50 × 17.90 mm, pitch e = 1.27 mm, and 28 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC18F258T-I/SO?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC18F258T-I/SO (MICROCHIP, SOIC-28-300mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (28 pins) & PIC18F258T / PIC18LF458 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	MCLR#/VPP	Digital_IO	Signal terminal MCLR#/VPP (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: MCLR#/VPP. Supported peripheral buses: General.
2	RA0/AN0/CVREF	Analog	Signal terminal RA0/AN0/CVREF (Analog, 2.0V to 5.5V domain). Multiplexed alternate functions: RA0/AN0/CVREF. Supported peripheral buses: General.
3	RA1/AN1	Digital_IO	Signal terminal RA1/AN1 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA1/AN1. Supported peripheral buses: General.
4	RA2/AN2/VREF-	Analog	Signal terminal RA2/AN2/VREF- (Analog, 2.0V to 5.5V domain). Multiplexed alternate functions: RA2/AN2/VREF-. Supported peripheral buses: General.
5	RA3/AN3/VREF+	Analog	Signal terminal RA3/AN3/VREF+ (Analog, 2.0V to 5.5V domain). Multiplexed alternate functions: RA3/AN3/VREF+. Supported peripheral buses: General.
6	RA4/T0CKI	Digital_IO	Signal terminal RA4/T0CKI (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA4/T0CKI. Supported peripheral buses: General.
7	RA5/AN4/SS#/LVDIN	Digital_IO	Signal terminal RA5/AN4/SS#/LVDIN (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA5/AN4/SS#/LVDIN. Supported peripheral buses: General.
8	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
9	OSC1/CLKI	Digital_IO	Signal terminal OSC1/CLKI (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: OSC1/CLKI. Supported peripheral buses: RTC/CLK.
10	OSC2/CLKO/RA6	Digital_IO	Signal terminal OSC2/CLKO/RA6 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: OSC2/CLKO/RA6. Supported peripheral buses: RTC/CLK.
11	RC0/T1OSO/T1CKI	Digital_IO	Signal terminal RC0/T1OSO/T1CKI (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC0/T1OSO/T1CKI. Supported peripheral buses: General.
12	RC1/T1OSI	Digital_IO	Signal terminal RC1/T1OSI (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC1/T1OSI. Supported peripheral buses: General.
13	RC2/CCP1	Digital_IO	Signal terminal RC2/CCP1 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC2/CCP1. Supported peripheral buses: General.
14	RC3/SCK/SCL	Digital_IO	Signal terminal RC3/SCK/SCL (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC3/SCK/SCL. Supported peripheral buses: SPI, I2C.
15	RC4/SDI/SDA	Digital_IO	Signal terminal RC4/SDI/SDA (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC4/SDI/SDA. Supported peripheral buses: I2C.
16	RC5/SDO	Digital_IO	Signal terminal RC5/SDO (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC5/SDO. Supported peripheral buses: General.
17	RC6/TX/CK	Digital_IO	Signal terminal RC6/TX/CK (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC6/TX/CK. Supported peripheral buses: General.
18	RC7/RX/DT	Digital_IO	Signal terminal RC7/RX/DT (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC7/RX/DT. Supported peripheral buses: General.
19	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
20	VDD	Power_In	Primary positive power supply input (VDD) operating in the 2.0V to 5.5V domain (Max rating: 5.5V).
21	RB0/INT0	Digital_IO	Signal terminal RB0/INT0 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB0/INT0. Supported peripheral buses: General.
22	RB1/INT1	Digital_IO	Signal terminal RB1/INT1 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB1/INT1. Supported peripheral buses: General.
23	RB2/CANTX/INT2	RF_50Ohm	Signal terminal RB2/CANTX/INT2 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB2/CANTX/INT2. Supported peripheral buses: CAN.
24	RB3/CANRX	Digital_IO	Signal terminal RB3/CANRX (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB3/CANRX. Supported peripheral buses: CAN.
25	RB4	Digital_IO	Signal terminal RB4 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB4. Supported peripheral buses: General.
26	RB5/PGM	Digital_IO	Signal terminal RB5/PGM (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB5/PGM. Supported peripheral buses: General.
27	RB6/PGC	Digital_IO	Signal terminal RB6/PGC (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB6/PGC. Supported peripheral buses: General.
28	RB7/PGD	Digital_IO	Signal terminal RB7/PGD (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB7/PGD. Supported peripheral buses: General.

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