PIC16C56A-04/P (PDIP-18) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of PIC16C56A-04/P (PDIP-18)?

Manufactured by MICROCHIP, the PIC16C56A-04/P is housed in a PDIP-18 package with 18 pins and a 2.54 mm lead pitch, supporting a VCC supply range of 2.0V to 6.25V. Key pins include: 1 (RA2: Multiplexed I/O & Peripheral Pin RA2 (General)), 2 (RA3: Multiplexed I/O & Peripheral Pin RA3 (General)), 3 (T0CKI: Multiplexed I/O & Peripheral Pin T0CKI (General)), 4 (#MCLR/VPP: Multiplexed I/O & Peripheral Pin #MCLR/VPP (General)), 5 (VSS: Ground Reference Pin (VSS)), 6 (RB0: Multiplexed I/O & Peripheral Pin RB0 (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for PIC16C56A-04/P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16C56A-04/P (PDIP-18) has a nominal body envelope of 6.35 × 22.32 mm, pitch e = 2.54 mm, and 18 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16C56A-04/P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16C56A-04/P (MICROCHIP, PDIP-18) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 6.35mm × 22.32mm · Pitch: 2.54mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (18/18)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	RA2	I/O	Multiplexed I/O & Peripheral Pin RA2 (General)
2	RA3	I/O	Multiplexed I/O & Peripheral Pin RA3 (General)
3	T0CKI	I/O	Multiplexed I/O & Peripheral Pin T0CKI (General)
4	#MCLR/VPP	I/O	Multiplexed I/O & Peripheral Pin #MCLR/VPP (General)
5	VSS	GND	Ground Reference Pin (VSS)
6	RB0	I/O	Multiplexed I/O & Peripheral Pin RB0 (General)
7	RB1	I/O	Multiplexed I/O & Peripheral Pin RB1 (General)
8	RB2	I/O	Multiplexed I/O & Peripheral Pin RB2 (General)
9	RB3	I/O	Multiplexed I/O & Peripheral Pin RB3 (General)
10	RB4	I/O	Multiplexed I/O & Peripheral Pin RB4 (General)
11	RB5	I/O	Multiplexed I/O & Peripheral Pin RB5 (General)
12	RB6	I/O	Multiplexed I/O & Peripheral Pin RB6 (General)
13	RB7	I/O	Multiplexed I/O & Peripheral Pin RB7 (General)
14	VDD	Power	Power Supply Input (VDD — 2.0V to 6.25V)
15	OSC2/CLKOUT	I/O	Multiplexed I/O & Peripheral Pin OSC2/CLKOUT (RTC/CLK)
16	OSC1/CLKIN	I/O	Multiplexed I/O & Peripheral Pin OSC1/CLKIN (RTC/CLK)
17	RA0	I/O	Multiplexed I/O & Peripheral Pin RA0 (General)
18	RA1	I/O	Multiplexed I/O & Peripheral Pin RA1 (General)

PIN 1 RA2

I/O

Multiplexed I/O & Peripheral Pin RA2 (General)

Design note: Signal terminal RA2 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

PIC16C56A-04/P (PDIP-18) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

PIC16C56A-04/P (PDIP-18) - 2. Standard Pinout (Top View)

True package pinout (18 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

PIC16C56A-04/P (PDIP-18) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

PIC16C56A-04/P (PDIP-18) - 4. Package Dimensions (D×E×A)

PDIP-18 · 6.35×22.32mm · Pitch 2.54mmExpand ›

5. Recommended Land PatternLAND PATTERN

PIC16C56A-04/P (PDIP-18) - 5. Recommended Land Pattern

IPC-7351B Footprint (18 Pads)Expand ›

6. Application SchematicSCHEMATIC

PIC16C56A-04/P (PDIP-18) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)

Showing 1–10 of 10 uncropped original figures for PIC16C56A / PIC16C56AT

P2 · p02_fig01P2

Datasheet Page 2 (p02_fig01)

P37 · p37_fig011514×523px

FIGURE 8-1: TIMER0 BLOCK DIAGRAM

P37 · p37_fig02794×489px

FIGURE 8-2: ELECTRICAL STRUCTURE OF T0CKI PIN

P173 · p173_fig011441×1808px

PIC16C56A-04/P (PDIP-18) — 15 10 5 15 10 5  Mold Draft Angle Bottom | 15 10 5 15 10 5  Mold Draft Angle Top | 10.92 9.40 7.87 .430 .370 .310 eB Overall Row Spacing § | 0.56 0.46 0.36 .022 .018 .014 B Lower Lead Width | 1.78 1.46 1.14 .070 .058 .045 B1 Upper Lead Wi

15 10 5 15 10 5  Mold Draft Angle Bottom | 15 10 5 15 10 5  Mold Draft Angle Top | 10.92 9.40 7.87 .430 .370 .310 eB Overall Row Spacing § | 0.56 0.46 0.36 .022 .018 .014 B Lower Lead Width | 1.78 1.46 1.14 .070 .058 .045 B1 Upper Lead Wi

P173 · p173_fig01P173

Datasheet Page 173 (p173_fig01)

P180 · p180_fig011441×1729px

PIC16C56A-04/P (PDIP-18) — 3.30 3.56 3.81 5.33 5.08 4.83 .210 .200 .190 W2 Window Length | .150 .140 .130 W1 Window Width | 10.80 9.78 8.76 .425 .385 .345 eB Overall Row Spacing § | 0.53 0.47 0.41 .021 .019 .016 B Lower Lead Width | 1.52 1.40 1.27 .060 .055 .050 B1 U

3.30 3.56 3.81 5.33 5.08 4.83 .210 .200 .190 W2 Window Length | .150 .140 .130 W1 Window Width | 10.80 9.78 8.76 .425 .385 .345 eB Overall Row Spacing § | 0.53 0.47 0.41 .021 .019 .016 B Lower Lead Width | 1.52 1.40 1.27 .060 .055 .050 B1 U

P2 · p02_fig01All Packages in PDF

PIC16C56A-04/P (PDIP-18) — PIC16C5X | Pin Diagrams | Device Differences | Device Voltage | Range | Oscillator | Selection (Program) | Oscillator | Process Technology | (Microns) | ROM Equivalent | MCLR | Filter | PDIP, SOIC, Windowed CERDIP | PIC16CR54 | PIC16C58 PIC

P2 · p02_fig02All Packages in PDF

Process Technology

P176 · p176_fig011441×1806px

PACKAGE_DIMENSIONS — PIC16C56AT-20/SS (SSOP-20-5.2mm)

P171 · p171_fig01All Packages in PDF

PACKAGE_DIMENSIONS — PIC16C56AT-20/SS (SSOP-20-5.2mm)

Technical Specifications & Part Details (PIC16C56A-04/P)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:PIC16C56A-04/P (PDIP-18) is a 18-pin standard electronic & interconnect component featuring a 22.32 × 6.35 × 3.50 mm mechanical envelope (lead pitch e = 2.54 mm). Rated for 2.0V to 6.25V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated RTC/CLK interfaces.

Operating Supply VoltageV_CC / V_DD

2.0V to 6.25V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C ~ +85°C (Industrial Grade)

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

40 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

22.32 × 6.35 × 3.50 mm (A1=0.51 mm)

Package family: DIP (PDIP-18)

Pin Count & Lead PitchN / e

18 Pins | Pitch e = 2.54 mm (100.0 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

RTC/CLK

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol18 auto-grouped pins

IPC-7351B Land Pattern18 pads · Pitch 2.54mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

IPC-7351B

Family Variants & Same Datasheet Chips — PIC16C56A / PIC16C56AT (2)

Select package variant or sibling MPN sharing this datasheet

PDIP-18 · 18P

PIC16C56A-04/P

MICROCHIP·PDIP-18

IPC-7351B

18P22.3×6.3×3.50mmP=2.54mm

PIC16C56A / PIC16C56AT (PDIP-18)

SSOP-20-5.2mm · 20P

PIC16C56AT-20/SS

MICROCHIP·SSOP-20-5.2mm

IPC-7351B

20P7.2×5.3×2.00mmP=0.65mm

PIC16C56A / PIC16C56AT (SSOP-20-5.2mm)

Mechanical Dimensions & Land Pattern (PDIP-18)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

22.32 × 6.35 mm

Height (A) & Pitch (e)IPC-7351B

A=3.50mm · e=2.54mm

Pad Size (W × L)Level B

1.60 × 1.60 mm

Pins / Total PadsTopology

18P / 18Pad (THT_DIP)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit PDIP-18	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC16C56A-04/P (PDIP-18)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC16C56A-04/P (PDIP-18)?

Manufactured by MICROCHIP, the PIC16C56A-04/P is housed in a PDIP-18 package with 18 pins and a 2.54 mm lead pitch, supporting a VCC supply range of 2.0V to 6.25V. Key pins include: 1 (RA2: Multiplexed I/O & Peripheral Pin RA2 (General)), 2 (RA3: Multiplexed I/O & Peripheral Pin RA3 (General)), 3 (T0CKI: Multiplexed I/O & Peripheral Pin T0CKI (General)), 4 (#MCLR/VPP: Multiplexed I/O & Peripheral Pin #MCLR/VPP (General)), 5 (VSS: Ground Reference Pin (VSS)), 6 (RB0: Multiplexed I/O & Peripheral Pin RB0 (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC16C56A-04/P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16C56A-04/P (PDIP-18) has a nominal body envelope of 6.35 × 22.32 mm, pitch e = 2.54 mm, and 18 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16C56A-04/P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16C56A-04/P (MICROCHIP, PDIP-18) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (18 pins) & PIC16C56A / PIC16C56AT Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	RA2	Digital_IO	Signal terminal RA2 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.
2	RA3	Digital_IO	Signal terminal RA3 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA3. Supported peripheral buses: General.
3	T0CKI	Digital_IO	Signal terminal T0CKI (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: T0CKI. Supported peripheral buses: General.
4	#MCLR/VPP	Digital_IO	Signal terminal #MCLR/VPP (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: #MCLR/VPP. Supported peripheral buses: General.
5	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
6	RB0	Digital_IO	Signal terminal RB0 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB0. Supported peripheral buses: General.
7	RB1	Digital_IO	Signal terminal RB1 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB1. Supported peripheral buses: General.
8	RB2	Digital_IO	Signal terminal RB2 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB2. Supported peripheral buses: General.
9	RB3	Digital_IO	Signal terminal RB3 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB3. Supported peripheral buses: General.
10	RB4	Digital_IO	Signal terminal RB4 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB4. Supported peripheral buses: General.
11	RB5	Digital_IO	Signal terminal RB5 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB5. Supported peripheral buses: General.
12	RB6	Digital_IO	Signal terminal RB6 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB6. Supported peripheral buses: General.
13	RB7	Digital_IO	Signal terminal RB7 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB7. Supported peripheral buses: General.
14	VDD	Power_In	Primary positive power supply input (VDD) operating in the 2.0V to 6.25V domain (Max rating: 6.25V).
15	OSC2/CLKOUT	Digital_IO	Signal terminal OSC2/CLKOUT (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: OSC2/CLKOUT. Supported peripheral buses: RTC/CLK.
16	OSC1/CLKIN	Digital_IO	Signal terminal OSC1/CLKIN (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: OSC1/CLKIN. Supported peripheral buses: RTC/CLK.
17	RA0	Digital_IO	Signal terminal RA0 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA0. Supported peripheral buses: General.
18	RA1	Digital_IO	Signal terminal RA1 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA1. Supported peripheral buses: General.

4D Studio: PIC16C56A-04/P Permalink: /part/C220559 MICROCHIP PDIP-18 All Packages All Manufacturers