PIC16C56AT-20/SS (SSOP-20-5.2mm) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of PIC16C56AT-20/SS (SSOP-20-5.2mm)?

Manufactured by MICROCHIP, the PIC16C56AT-20/SS is housed in a SSOP-20-5.2mm package with 20 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2.0V to 6.25V. Key pins include: 1 (RA2: Multiplexed I/O & Peripheral Pin RA2 (General)), 2 (RA3: Multiplexed I/O & Peripheral Pin RA3 (General)), 3 (T0CKI: Multiplexed I/O & Peripheral Pin T0CKI (General)), 4 (#MCLR/VPP: Multiplexed I/O & Peripheral Pin #MCLR/VPP (General)), 5 (VSS: Ground Reference Pin (VSS)), 6 (VSS: Ground Reference Pin (VSS)).

Q: What are the IPC-7351B PCB Footprint dimensions for PIC16C56AT-20/SS?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16C56AT-20/SS (SSOP-20-5.2mm) has a nominal body envelope of 5.30 × 7.20 mm, pitch e = 0.65 mm, and 20 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16C56AT-20/SS?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16C56AT-20/SS (MICROCHIP, SSOP-20-5.2mm) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 5.30mm × 7.20mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (20/20)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	RA2	I/O	Multiplexed I/O & Peripheral Pin RA2 (General)
2	RA3	I/O	Multiplexed I/O & Peripheral Pin RA3 (General)
3	T0CKI	I/O	Multiplexed I/O & Peripheral Pin T0CKI (General)
4	#MCLR/VPP	I/O	Multiplexed I/O & Peripheral Pin #MCLR/VPP (General)
5	VSS	GND	Ground Reference Pin (VSS)
6	VSS	GND	Ground Reference Pin (VSS)
7	RB0	I/O	Multiplexed I/O & Peripheral Pin RB0 (General)
8	RB1	I/O	Multiplexed I/O & Peripheral Pin RB1 (General)
9	RB2	I/O	Multiplexed I/O & Peripheral Pin RB2 (General)
10	RB3	I/O	Multiplexed I/O & Peripheral Pin RB3 (General)
11	RB4	I/O	Multiplexed I/O & Peripheral Pin RB4 (General)
12	RB5	I/O	Multiplexed I/O & Peripheral Pin RB5 (General)
13	RB6	I/O	Multiplexed I/O & Peripheral Pin RB6 (General)
14	RB7	I/O	Multiplexed I/O & Peripheral Pin RB7 (General)
15	VDD	Power	Power Supply Input (VDD — 2.0V to 6.25V)
16	VDD	Power	Power Supply Input (VDD — 2.0V to 6.25V)
17	OSC2/CLKOUT	I/O	Multiplexed I/O & Peripheral Pin OSC2/CLKOUT (RTC/CLK)
18	OSC1/CLKIN	I/O	Multiplexed I/O & Peripheral Pin OSC1/CLKIN (RTC/CLK)
19	RA0	I/O	Multiplexed I/O & Peripheral Pin RA0 (General)
20	RA1	I/O	Multiplexed I/O & Peripheral Pin RA1 (General)

PIN 1 RA2

I/O

Multiplexed I/O & Peripheral Pin RA2 (General)

Design note: Signal terminal RA2 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 8 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

PIC16C56AT-20/SS (SSOP-20-5.2mm) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

PIC16C56AT-20/SS (SSOP-20-5.2mm) - 2. Standard Pinout (Top View)

True package pinout (20 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

PIC16C56AT-20/SS (SSOP-20-5.2mm) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

PIC16C56AT-20/SS (SSOP-20-5.2mm) - 4. Package Dimensions (D×E×A)

SSOP-20-5.2mm · 5.30×7.20mm · Pitch 0.65mmExpand ›

5. Recommended Land PatternLAND PATTERN

PIC16C56AT-20/SS (SSOP-20-5.2mm) - 5. Recommended Land Pattern

IPC-7351B Footprint (20 Pads)Expand ›

6. Application SchematicSCHEMATIC

PIC16C56AT-20/SS (SSOP-20-5.2mm) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)

Showing 1–8 of 8 uncropped original figures for PIC16C56A / PIC16C56AT

P2 · p02_fig01P2

Datasheet Page 2 (p02_fig01)

P37 · p37_fig011514×523px

FIGURE 8-1: TIMER0 BLOCK DIAGRAM

P37 · p37_fig02794×489px

FIGURE 8-2: ELECTRICAL STRUCTURE OF T0CKI PIN

P176 · p176_fig011441×1806px

PIC16C56AT-20/SS (SSOP-20-5.2mm) — Foot Angle  0 4 8 0 4 8 | 15 12 0 15 12 0  Mold Draft Angle Bottom | 15 12 0 15 12 0  Mold Draft Angle Top | 0.51 0.42 0.36 .020 .017 .014 B Lead Width | 0.30 0.27 0.23 .012 .011 .009 c Lead Thickness | 1.27 0.84 0.41 .050 .033 .016 L Fo

P176 · p176_fig01P176

Datasheet Page 176 (p176_fig01)

P2 · p02_fig01All Packages in PDF

PIC16C56AT-20/SS (SSOP-20-5.2mm) — PIC16C5X | Pin Diagrams | Device Differences | Device Voltage | Range | Oscillator | Selection (Program) | Oscillator | Process Technology | (Microns) | ROM Equivalent | MCLR | Filter | PDIP, SOIC, Windowed CERDIP | PIC16CR54 | PIC16C58 PIC

P2 · p02_fig02All Packages in PDF

Process Technology

P171 · p171_fig01All Packages in PDF

PIC16C56AT-20/SS (SSOP-20-5.2mm) —  1997-2013 Microchip Technology Inc. Preliminary DS30453E-page 171 | PIC16C5X | 21.0 PACKAGING INFORMATION | 21.1 Package Marketing Information | XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX | YYWWNNN | 18-Lead PDIP | 28-Lead Skinny PDIP (.300") |

Technical Specifications & Part Details (PIC16C56AT-20/SS)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:PIC16C56AT-20/SS (SSOP-20-5.2mm) is a 20-pin standard electronic & interconnect component featuring a 7.20 × 5.30 × 2.00 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 2.0V to 6.25V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated RTC/CLK interfaces.

Operating Supply VoltageV_CC / V_DD

2.0V to 6.25V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C ~ +85°C (Industrial Grade)

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

40 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

7.20 × 5.30 × 2.00 mm (A1=0.15 mm)

Package family: TSSOP (SSOP-20-5.2mm)

Pin Count & Lead PitchN / e

20 Pins | Pitch e = 0.65 mm (25.6 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

RTC/CLK

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol20 auto-grouped pins

IPC-7351B Land Pattern20 pads · Pitch 0.65mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SSOP-20-5.2mm)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

7.20 × 5.30 mm

Height (A) & Pitch (e)IPC-7351B

A=2.00mm · e=0.65mm

Pad Size (W × L)Level B

0.42 × 1.60 mm

Pins / Total PadsTopology

20P / 20Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit SSOP-20-5.2mm	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC16C56AT-20/SS (SSOP-20-5.2mm)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC16C56AT-20/SS (SSOP-20-5.2mm)?

Manufactured by MICROCHIP, the PIC16C56AT-20/SS is housed in a SSOP-20-5.2mm package with 20 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2.0V to 6.25V. Key pins include: 1 (RA2: Multiplexed I/O & Peripheral Pin RA2 (General)), 2 (RA3: Multiplexed I/O & Peripheral Pin RA3 (General)), 3 (T0CKI: Multiplexed I/O & Peripheral Pin T0CKI (General)), 4 (#MCLR/VPP: Multiplexed I/O & Peripheral Pin #MCLR/VPP (General)), 5 (VSS: Ground Reference Pin (VSS)), 6 (VSS: Ground Reference Pin (VSS)).

What are the IPC-7351B PCB Footprint dimensions for PIC16C56AT-20/SS?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16C56AT-20/SS (SSOP-20-5.2mm) has a nominal body envelope of 5.30 × 7.20 mm, pitch e = 0.65 mm, and 20 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16C56AT-20/SS?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16C56AT-20/SS (MICROCHIP, SSOP-20-5.2mm) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (20 pins) & PIC16C56A / PIC16C56AT Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	RA2	Digital_IO	Signal terminal RA2 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.
2	RA3	Digital_IO	Signal terminal RA3 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA3. Supported peripheral buses: General.
3	T0CKI	Digital_IO	Signal terminal T0CKI (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: T0CKI. Supported peripheral buses: General.
4	#MCLR/VPP	Digital_IO	Signal terminal #MCLR/VPP (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: #MCLR/VPP. Supported peripheral buses: General.
5	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
6	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
7	RB0	Digital_IO	Signal terminal RB0 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB0. Supported peripheral buses: General.
8	RB1	Digital_IO	Signal terminal RB1 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB1. Supported peripheral buses: General.
9	RB2	Digital_IO	Signal terminal RB2 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB2. Supported peripheral buses: General.
10	RB3	Digital_IO	Signal terminal RB3 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB3. Supported peripheral buses: General.
11	RB4	Digital_IO	Signal terminal RB4 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB4. Supported peripheral buses: General.
12	RB5	Digital_IO	Signal terminal RB5 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB5. Supported peripheral buses: General.
13	RB6	Digital_IO	Signal terminal RB6 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB6. Supported peripheral buses: General.
14	RB7	Digital_IO	Signal terminal RB7 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RB7. Supported peripheral buses: General.
15	VDD	Power_In	Primary positive power supply input (VDD) operating in the 2.0V to 6.25V domain (Max rating: 6.25V).
16	VDD	Power_In	Primary positive power supply input (VDD) operating in the 2.0V to 6.25V domain (Max rating: 6.25V).
17	OSC2/CLKOUT	Digital_IO	Signal terminal OSC2/CLKOUT (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: OSC2/CLKOUT. Supported peripheral buses: RTC/CLK.
18	OSC1/CLKIN	Digital_IO	Signal terminal OSC1/CLKIN (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: OSC1/CLKIN. Supported peripheral buses: RTC/CLK.
19	RA0	Digital_IO	Signal terminal RA0 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA0. Supported peripheral buses: General.
20	RA1	Digital_IO	Signal terminal RA1 (I/O, 2.0V to 6.25V domain). Multiplexed alternate functions: RA1. Supported peripheral buses: General.

4D Studio: PIC16C56AT-20/SS Permalink: /part/C629476 MICROCHIP SSOP-20-5.2mm All Packages All Manufacturers