PIC12F1822-I/P (DIP-8) — Symbol, Footprint IPC-7351B & 3D STEP Model

PIC12F1822-I/P

MICROCHIPID: C9783DIP-8 · 8 Pins · Pitch 2.54mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · PIC12F1822-I/P (DIP-8)1VDD2RA53RA44RA3/MCLR/VPP8VSS7RA0/ICSPDAT6RA1/ICSPCLK5RA2Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
12345678E=3.00mm · Pitch e=2.54mmD=3.00mm-7-5-3-113577531-1-3-5-7mm
3. 3D CAD MODEL
Package Body: 3.00mm × 3.00mm · Pitch: 2.54mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (8/8)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1VDDPowerPower Supply Input (VDD — 1.8V-3.6V)
2RA5I/OMultiplexed I/O & Peripheral Pin RA5 (General)
3RA4I/OMultiplexed I/O & Peripheral Pin RA4 (General)
4RA3/MCLR/VPPI/OMultiplexed I/O & Peripheral Pin RA3/MCLR/VPP (General)
5RA2I/OMultiplexed I/O & Peripheral Pin RA2 (General)
6RA1/ICSPCLKI/OMultiplexed I/O & Peripheral Pin RA1/ICSPCLK (General)
7RA0/ICSPDATI/OMultiplexed I/O & Peripheral Pin RA0/ICSPDAT (General)
8VSSGNDGround Reference Pin (VSS)
PIN 1 VDD
Power
Power Supply Input (VDD — 1.8V-3.6V)
Design note: VDD
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 16 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: PIC12F1822-I/P (MICROCHIP · DIP-8)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
PIC12F1822-I/P (DIP-8) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
PIC12F1822-I/P (DIP-8) - 2. Standard Pinout (Top View)
True package pinout (8 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
PIC12F1822-I/P (DIP-8) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
PIC12F1822-I/P (DIP-8) - 4. Package Dimensions (D×E×A)
DIP-8 · 3.00×3.00mm · Pitch 2.54mmExpand ›
5. Recommended Land PatternLAND PATTERN
PIC12F1822-I/P (DIP-8) - 5. Recommended Land Pattern
IPC-7351B Footprint (8 Pads)Expand ›
6. Application SchematicSCHEMATIC
PIC12F1822-I/P (DIP-8) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (16 figures · Page 1/2)
Showing 1–12 of 16 uncropped original figures for PIC12F1822
P371 · p371_fig01EXACT PACKAGE
PIC12F1822-I/P (DIP-8) — PIC12F/LF1822/16F/LF1823
PIC12F/LF1822/16F/LF1823
P2 · p02_fig011777×1640px
PIC12F1822-I/P (DIP-8) — DS41413A-page 2 Preliminary  2010 Microchip Technology Inc. | Trademarks | FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Te
DS41413A-page 2 Preliminary  2010 Microchip Technology Inc. | Trademarks | FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Te
P2 · p02_fig02782×281px
PIC12F1822-I/P (DIP-8) — ISBN: 978-1-60932-051-5
ISBN: 978-1-60932-051-5
P127 · p127_fig011582×803px
PIC12F1822-I/P (DIP-8) — FIGURE 13-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM
FIGURE 13-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM
P200 · p200_fig011753×534px
PIC12F1822-I/P (DIP-8) — FIGURE 23-1: CAPTURE MODE OPERATION BLOCK DIAGRAM
FIGURE 23-1: CAPTURE MODE OPERATION BLOCK DIAGRAM
P202 · p202_fig011766×890px
PIC12F1822-I/P (DIP-8) — FIGURE 23-2: COMPARE MODE OPERATION BLOCK DIAGRAM
FIGURE 23-2: COMPARE MODE OPERATION BLOCK DIAGRAM
P202 · p202_fig021628×255px
PIC12F1822-I/P (DIP-8) — DS41413A-page 202 Preliminary  2010 Microchip Technology Inc.
DS41413A-page 202 Preliminary  2010 Microchip Technology Inc.
P219 · p219_fig011698×565px
PIC12F1822-I/P (DIP-8) — FIGURE 23-19: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STR1SYNC = 0)
FIGURE 23-19: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STR1SYNC = 0)
P219 · p219_fig021777×721px
PIC12F1822-I/P (DIP-8) — FIGURE 23-20: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION (STR1SYNC = 1)
FIGURE 23-20: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION (STR1SYNC = 1)
P317 · p317_fig011416×1013px
PIC12F1822-I/P (DIP-8) — FIGURE 27-4: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING
FIGURE 27-4: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING
P317 · p317_fig01P317
PIC12F1822-I/P (DIP-8) — Datasheet Page 317 (p317_fig01)
Datasheet Page 317 (p317_fig01)
P340 · p340_fig011797×2127px
PIC12F1822-I/P (DIP-8) — PIC12F/LF1822/16F/LF1823
PIC12F/LF1822/16F/LF1823
Page 1 / 2 (16 extracted figures)

Technical Specifications & Part Details (PIC12F1822-I/P)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:PIC12F1822-I/P (DIP-8) is a 8-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 3.50 mm mechanical envelope (lead pitch e = 2.54 mm). Rated for 1.8V-3.6V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated UART, SPI, I2C, ADC, DAC, PWM interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V-3.6V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
32 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 3.00 × 3.50 mm (A1=0.51 mm)
Package family: DIP (DIP-8)
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 2.54 mm (100.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
UART, SPI, I2C, ADC, DAC, PWM
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol8 auto-grouped pins
OK
IPC-7351B Land Pattern8 pads · Pitch 2.54mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DIP-8)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.00 × 3.00 mm
Height (A) & Pitch (e)IPC-7351B
A=3.50mm · e=2.54mm
Pad Size (W × L)Level B
1.60 × 1.60 mm
Pins / Total PadsTopology
8P / 8Pad (THT_DIP)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
DIP-8
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC12F1822-I/P (DIP-8)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC12F1822-I/P (DIP-8)?

Manufactured by MICROCHIP, the PIC12F1822-I/P is housed in a DIP-8 package with 8 pins and a 2.54 mm lead pitch, supporting a VCC supply range of 1.8V-3.6V. Key pins include: 1 (VDD: Power Supply Input (VDD — 1.8V-3.6V)), 2 (RA5: Multiplexed I/O & Peripheral Pin RA5 (General)), 3 (RA4: Multiplexed I/O & Peripheral Pin RA4 (General)), 4 (RA3/MCLR/VPP: Multiplexed I/O & Peripheral Pin RA3/MCLR/VPP (General)), 5 (RA2: Multiplexed I/O & Peripheral Pin RA2 (General)), 6 (RA1/ICSPCLK: Multiplexed I/O & Peripheral Pin RA1/ICSPCLK (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC12F1822-I/P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC12F1822-I/P (DIP-8) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 2.54 mm, and 8 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC12F1822-I/P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC12F1822-I/P (MICROCHIP, DIP-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (8 pins) & PIC12F1822 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1VDDPower_InPrimary positive power supply input (VDD) operating in the 1.8V-3.6V domain (Max rating: 3.6V).
2RA5Digital_IOSignal terminal RA5 (I/O, 1.8V-3.6V domain). Multiplexed alternate functions: RA5. Supported peripheral buses: General.
3RA4Digital_IOSignal terminal RA4 (I/O, 1.8V-3.6V domain). Multiplexed alternate functions: RA4. Supported peripheral buses: General.
4RA3/MCLR/VPPDigital_IOSignal terminal RA3/MCLR/VPP (I/O, 1.8V-3.6V domain). Multiplexed alternate functions: RA3/MCLR/VPP. Supported peripheral buses: General.
5RA2Digital_IOSignal terminal RA2 (I/O, 1.8V-3.6V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.
6RA1/ICSPCLKDigital_IOSignal terminal RA1/ICSPCLK (I/O, 1.8V-3.6V domain). Multiplexed alternate functions: RA1/ICSPCLK. Supported peripheral buses: General.
7RA0/ICSPDATDigital_IOSignal terminal RA0/ICSPDAT (I/O, 1.8V-3.6V domain). Multiplexed alternate functions: RA0/ICSPDAT. Supported peripheral buses: General.
8VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.