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PIC16C505-04I/P (DIP-14) — Symbol, Footprint IPC-7351B & 3D STEP Model

PIC16C505-04I/P

MICROCHIPID: C9770DIP-14 · 14 Pins · Pitch 2.54mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · PIC16C505-04I/P (DIP-14)1VDD2RB5/OSC1/CLK3RB4/OSC2/CLK4RB3/MCLR/VPP5RC5/T0CKI6RC47RC314VSS13RB012RB111RB210RC09RC18RC2Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.815.210.25.10-5.1-10.2-15.2mm
2. 2D FOOTPRINT
1234567891011121314E=6.35mm · Pitch e=2.54mmD=17.24mm-9-7-5-3-113579131197531-1-3-5-7-9-11-13mm
3. 3D CAD MODEL
Package Body: 6.35mm × 17.24mm · Pitch: 2.54mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (14/14)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1VDDPowerPower Supply Input (VDD — 2.5V to 5.5V)
2RB5/OSC1/CLKINI/OMultiplexed I/O & Peripheral Pin RB5/OSC1/CLKIN (RTC/CLK)
3RB4/OSC2/CLKOUTI/OMultiplexed I/O & Peripheral Pin RB4/OSC2/CLKOUT (CAN, RTC/CLK)
4RB3/MCLR/VPPI/OMultiplexed I/O & Peripheral Pin RB3/MCLR/VPP (CAN)
5RC5/T0CKII/OMultiplexed I/O & Peripheral Pin RC5/T0CKI (CAN)
6RC4I/OMultiplexed I/O & Peripheral Pin RC4 (General)
7RC3I/OMultiplexed I/O & Peripheral Pin RC3 (General)
8RC2I/OMultiplexed I/O & Peripheral Pin RC2 (General)
9RC1I/OMultiplexed I/O & Peripheral Pin RC1 (General)
10RC0I/OMultiplexed I/O & Peripheral Pin RC0 (General)
11RB2I/OMultiplexed I/O & Peripheral Pin RB2 (General)
12RB1I/OMultiplexed I/O & Peripheral Pin RB1 (CAN)
13RB0I/OMultiplexed I/O & Peripheral Pin RB0 (CAN)
14VSSGNDGround Reference Pin (VSS)
PIN 1 VDD
Power
Power Supply Input (VDD — 2.5V to 5.5V)
Design note: PositivesupplyforlogicandI/Opins
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 7 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: PIC16C505-04I/P (MICROCHIP · DIP-14)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
PIC16C505-04I/P (DIP-14) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
PIC16C505-04I/P (DIP-14) - 2. Standard Pinout (Top View)
True package pinout (14 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
PIC16C505-04I/P (DIP-14) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
PIC16C505-04I/P (DIP-14) - 4. Package Dimensions (D×E×A)
DIP-14 · 6.35×17.24mm · Pitch 2.54mmExpand ›
5. Recommended Land PatternLAND PATTERN
PIC16C505-04I/P (DIP-14) - 5. Recommended Land Pattern
IPC-7351B Footprint (14 Pads)Expand ›
6. Application SchematicSCHEMATIC
PIC16C505-04I/P (DIP-14) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (7 figures · Page 1/1)
Showing 1–7 of 7 uncropped original figures for PIC16C505
P38 · p38_fig01728×739px
PIC16C505-04I/P (DIP-14) — FIGURE 7-15: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION
FIGURE 7-15: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION
P38 · p38_fig01P38
PIC16C505-04I/P (DIP-14) — Datasheet Page 38 (p38_fig01)
Datasheet Page 38 (p38_fig01)
P39 · p39_fig01625×856px
PIC16C505-04I/P (DIP-14) — FIGURE 8-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 11 6 5 4 0
FIGURE 8-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 11 6 5 4 0
P70 · p70_fig011144×946px
PIC16C505-04I/P (DIP-14) — Package Type: K04-005 14-Lead Plastic Dual In-line (P) - 300 mil
Package Type: K04-005 14-Lead Plastic Dual In-line (P) - 300 mil
P70 · p70_fig01P70
PIC16C505-04I/P (DIP-14) — Datasheet Page 70 (p70_fig01)
Datasheet Page 70 (p70_fig01)
P71 · p71_fig011245×1346px
PIC16C505-04I/P (DIP-14) — L
L
P1 · p01_fig01All Packages in PDF
PIC16C505-04I/P (DIP-14) — FIGURE 1: PIN DIAGRAM:
FIGURE 1: PIN DIAGRAM:

Technical Specifications & Part Details (PIC16C505-04I/P)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:PIC16C505-04I/P (DIP-14) is a 14-pin standard electronic & interconnect component featuring a 17.24 × 6.35 × 3.50 mm mechanical envelope (lead pitch e = 2.54 mm). Rated for 2.5V to 5.5V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated CAN, RTC/CLK interfaces.
Operating Supply VoltageV_CC / V_DD
2.5V to 5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
20 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
17.24 × 6.35 × 3.50 mm (A1=0.51 mm)
Package family: DIP (DIP-14)
Pin Count & Lead PitchN / e
14 Pins | Pitch e = 2.54 mm (100.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
CAN, RTC/CLK
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol14 auto-grouped pins
OK
IPC-7351B Land Pattern14 pads · Pitch 2.54mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DIP-14)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
17.24 × 6.35 mm
Height (A) & Pitch (e)IPC-7351B
A=3.50mm · e=2.54mm
Pad Size (W × L)Level B
1.60 × 1.60 mm
Pins / Total PadsTopology
14P / 14Pad (THT_DIP)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
DIP-14
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC16C505-04I/P (DIP-14)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC16C505-04I/P (DIP-14)?

Manufactured by MICROCHIP, the PIC16C505-04I/P is housed in a DIP-14 package with 14 pins and a 2.54 mm lead pitch, supporting a VCC supply range of 2.5V to 5.5V. Key pins include: 1 (VDD: Power Supply Input (VDD — 2.5V to 5.5V)), 2 (RB5/OSC1/CLKIN: Multiplexed I/O & Peripheral Pin RB5/OSC1/CLKIN (RTC/CLK)), 3 (RB4/OSC2/CLKOUT: Multiplexed I/O & Peripheral Pin RB4/OSC2/CLKOUT (CAN, RTC/CLK)), 4 (RB3/MCLR/VPP: Multiplexed I/O & Peripheral Pin RB3/MCLR/VPP (CAN)), 5 (RC5/T0CKI: Multiplexed I/O & Peripheral Pin RC5/T0CKI (CAN)), 6 (RC4: Multiplexed I/O & Peripheral Pin RC4 (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC16C505-04I/P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16C505-04I/P (DIP-14) has a nominal body envelope of 6.35 × 17.24 mm, pitch e = 2.54 mm, and 14 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16C505-04I/P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16C505-04I/P (MICROCHIP, DIP-14) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (14 pins) & PIC16C505 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1VDDPower_InPrimary positive power supply input (VDD) operating in the 2.5V to 5.5V domain (Max rating: 5.5V).
2RB5/OSC1/CLKINDigital_IOSignal terminal RB5/OSC1/CLKIN (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RB5/OSC1/CLKIN. Supported peripheral buses: RTC/CLK.
3RB4/OSC2/CLKOUTDigital_IOSignal terminal RB4/OSC2/CLKOUT (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RB4/OSC2/CLKOUT. Supported peripheral buses: CAN, RTC/CLK.
4RB3/MCLR/VPPDigital_IOSignal terminal RB3/MCLR/VPP (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RB3/MCLR/VPP. Supported peripheral buses: CAN.
5RC5/T0CKIDigital_IOSignal terminal RC5/T0CKI (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RC5/T0CKI. Supported peripheral buses: CAN.
6RC4Digital_IOSignal terminal RC4 (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RC4. Supported peripheral buses: General.
7RC3Digital_IOSignal terminal RC3 (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RC3. Supported peripheral buses: General.
8RC2Digital_IOSignal terminal RC2 (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RC2. Supported peripheral buses: General.
9RC1Digital_IOSignal terminal RC1 (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RC1. Supported peripheral buses: General.
10RC0Digital_IOSignal terminal RC0 (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RC0. Supported peripheral buses: General.
11RB2Digital_IOSignal terminal RB2 (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RB2. Supported peripheral buses: General.
12RB1Digital_IOSignal terminal RB1 (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RB1. Supported peripheral buses: CAN.
13RB0Digital_IOSignal terminal RB0 (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: RB0. Supported peripheral buses: CAN.
14VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
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