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MRF24WN0MB-I/RM100 (SMD-37P) — Symbol, Footprint IPC-7351B & 3D STEP Model

MRF24WN0MB-I/RM100

MICROCHIPID: C641379SMD-37P · 37 Pins · Pitch 1.27mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MRF24WN0MB-I/RM100 (SMD-37P)1GND2TEST3GND4VDD5NC6NC7NC8NC9NC10NC11NC12NC13SPI_CLK14SPI_MISO15VDD16GND17TEST18TEST19HIBERNATE37GND36GND35VDD34GND33NC32NC31NC30NC29NC28NC27GND26NC25NC24GND23SPI CS/MODE122SPI_MOSI21MODE020SPI_INTGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.830.525.420.315.210.25.10-5.1-10.2-15.2-20.3-25.4-30.5mm
2. 2D FOOTPRINT
ANTENNA KEEPOUT (5.5mm)12373635343332313029282726252423222120191817161514131211109876543E=17.78mm · Pitch e=1.27mmD=26.67mm-17-15-13-11-9-7-5-3-1135791113151720181614121086420-2-4-6-8-10-12-14-16-18-20mm
3. 3D CAD MODEL
Package Body: 17.78mm × 26.67mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (37/37)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1GNDGNDGround Reference Pin (GND)
2TESTI/OMultiplexed I/O & Peripheral Pin TEST (General)
3GNDGNDGround Reference Pin (GND)
4VDDPowerPower Supply Input (VDD — 3.15V to 3.45V)
5NCI/OMultiplexed I/O & Peripheral Pin NC (General)
6NCI/OMultiplexed I/O & Peripheral Pin NC (General)
7NCI/OMultiplexed I/O & Peripheral Pin NC (General)
8NCI/OMultiplexed I/O & Peripheral Pin NC (General)
9NCI/OMultiplexed I/O & Peripheral Pin NC (General)
10NCI/OMultiplexed I/O & Peripheral Pin NC (General)
11NCI/OMultiplexed I/O & Peripheral Pin NC (General)
12NCI/OMultiplexed I/O & Peripheral Pin NC (General)
13SPI_CLKI/OMultiplexed I/O & Peripheral Pin SPI_CLK (SPI)
14SPI_MISOI/OMultiplexed I/O & Peripheral Pin SPI_MISO (SPI)
15VDDPowerPower Supply Input (VDD — 3.15V to 3.45V)
16GNDGNDGround Reference Pin (GND)
17TESTI/OMultiplexed I/O & Peripheral Pin TEST (General)
18TESTI/OMultiplexed I/O & Peripheral Pin TEST (General)
19HIBERNATEI/OMultiplexed I/O & Peripheral Pin HIBERNATE (General)
20SPI_INTI/OMultiplexed I/O & Peripheral Pin SPI_INT (SPI)
21MODE0I/OMultiplexed I/O & Peripheral Pin MODE0 (General)
22SPI_MOSII/OMultiplexed I/O & Peripheral Pin SPI_MOSI (SPI)
23SPI CS/MODE1_I/OMultiplexed I/O & Peripheral Pin SPI CS/MODE1_ (SPI)
24GNDGNDGround Reference Pin (GND)
25NCI/OMultiplexed I/O & Peripheral Pin NC (General)
26NCI/OMultiplexed I/O & Peripheral Pin NC (General)
27GNDGNDGround Reference Pin (GND)
28NCI/OMultiplexed I/O & Peripheral Pin NC (General)
29NCI/OMultiplexed I/O & Peripheral Pin NC (General)
30NCI/OMultiplexed I/O & Peripheral Pin NC (General)
31NCI/OMultiplexed I/O & Peripheral Pin NC (General)
32NCI/OMultiplexed I/O & Peripheral Pin NC (General)
33NCI/OMultiplexed I/O & Peripheral Pin NC (General)
34GNDGNDGround Reference Pin (GND)
35VDDPowerPower Supply Input (VDD — 3.15V to 3.45V)
36GNDGNDGround Reference Pin (GND)
37GNDGNDGround Reference Pin (GND)
PIN 1 GND
GND
Ground Reference Pin (GND)
Design note: —
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 12 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MRF24WN0MB-I/RM100 (MICROCHIP · SMD-37P)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MRF24WN0MB-I/RM100 (SMD-37P) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MRF24WN0MB-I/RM100 (SMD-37P) - 2. Standard Pinout (Top View)
True package pinout (37 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MRF24WN0MB-I/RM100 (SMD-37P) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MRF24WN0MB-I/RM100 (SMD-37P) - 4. Package Dimensions (D×E×A)
SMD-37P · 17.78×26.67mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
MRF24WN0MB-I/RM100 (SMD-37P) - 5. Recommended Land Pattern
IPC-7351B Footprint (37 Pads)Expand ›
6. Application SchematicSCHEMATIC
MRF24WN0MB-I/RM100 (SMD-37P) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (12 figures · Page 1/1)
Showing 1–12 of 12 uncropped original figures for MRF24WN0MB
P1 · p01_fig01376×200px
MRF24WN0MB-I/RM100 (SMD-37P) — 2.4 GHz IEEE 802.11b/g/n Wireless Module
2.4 GHz IEEE 802.11b/g/n Wireless Module
P1 · p01_fig02785×689px
MRF24WN0MB-I/RM100 (SMD-37P) — Compliance
Compliance
P1 · p01_fig02P1
MRF24WN0MB-I/RM100 (SMD-37P) — Datasheet Page 1 (p01_fig02)
Datasheet Page 1 (p01_fig02)
P6 · p06_fig011777×2325px
MRF24WN0MB-I/RM100 (SMD-37P) — FIGURE 1-3: MRF24WN0MA/MB MODULE PHYSICAL DIMENSIONS (TOP AND SIDE VIEW)
FIGURE 1-3: MRF24WN0MA/MB MODULE PHYSICAL DIMENSIONS (TOP AND SIDE VIEW)
P7 · p07_fig011777×2168px
MRF24WN0MB-I/RM100 (SMD-37P) — FIGURE 1-4: MRF24WN0MA/MB MODULE PHYSICAL DIMENSIONS (BOTTOM VIEW)
FIGURE 1-4: MRF24WN0MA/MB MODULE PHYSICAL DIMENSIONS (BOTTOM VIEW)
P7 · p07_fig01P7
MRF24WN0MB-I/RM100 (SMD-37P) — Datasheet Page 7 (p07_fig01)
Datasheet Page 7 (p07_fig01)
P10 · p10_fig011714×1213px
MRF24WN0MB-I/RM100 (SMD-37P) — FIGURE 1-7: MRF24WN0MA/MB HOST PCB EXAMPLE LAYOUT
FIGURE 1-7: MRF24WN0MA/MB HOST PCB EXAMPLE LAYOUT
P10 · p10_fig01P10
MRF24WN0MB-I/RM100 (SMD-37P) — Datasheet Page 10 (p10_fig01)
Datasheet Page 10 (p10_fig01)
P15 · p15_fig011777×1908px
MRF24WN0MB-I/RM100 (SMD-37P) — FIGURE 3-1: APPLICATION SCHEMATIC
FIGURE 3-1: APPLICATION SCHEMATIC
P15 · p15_fig01P15
MRF24WN0MB-I/RM100 (SMD-37P) — Datasheet Page 15 (p15_fig01)
Datasheet Page 15 (p15_fig01)
P16 · p16_fig011103×1490px
MRF24WN0MB-I/RM100 (SMD-37P) — FIGURE 3-2: PCB ANTENNA SIMULATION DRAWING
FIGURE 3-2: PCB ANTENNA SIMULATION DRAWING
P17 · p17_fig011551×1526px
MRF24WN0MB-I/RM100 (SMD-37P) — Two-dimensional (2D) pattern, including the average on main radiation planes (Phi = 0 and 90 degrees).
Two-dimensional (2D) pattern, including the average on main radiation planes (Phi = 0 and 90 degrees).

Technical Specifications & Part Details (MRF24WN0MB-I/RM100)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Wireless Wi-Fi / Bluetooth LE SoC Module
Detailed Overview:MRF24WN0MB-I/RM100 (SMD-37P) is a 37-pin wireless wi-fi / bluetooth le soc module featuring a 26.67 × 17.78 × 3.10 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 3.15V to 3.45V supply operation across -40°C to +85°C with integrated Wi-Fi, SPI interfaces.
Operating Supply VoltageV_CC / V_DD
3.15V to 3.45V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2.4 GHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
26.67 × 17.78 × 3.10 mm (A1=0.00 mm)
Package family: CASTELLATED_MODULE (SMD-37P)
Pin Count & Lead PitchN / e
37 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Wi-Fi, SPI
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol37 auto-grouped pins
OK
IPC-7351B Land Pattern37 pads · Pitch 1.27mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SMD-37P)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
26.67 × 17.78 mm
Height (A) & Pitch (e)IPC-7351B
A=3.10mm · e=1.27mm
Pad Size (W × L)Level B
1.02 × 1.27 mm
Pins / Total PadsTopology
37P / 37Pad (CASTELLATED_MODULE)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SMD-37P
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MRF24WN0MB-I/RM100 (SMD-37P)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MRF24WN0MB-I/RM100 (SMD-37P)?

Manufactured by MICROCHIP, the MRF24WN0MB-I/RM100 is housed in a SMD-37P package with 37 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 3.15V to 3.45V. Key pins include: 1 (GND: Ground Reference Pin (GND)), 2 (TEST: Multiplexed I/O & Peripheral Pin TEST (General)), 3 (GND: Ground Reference Pin (GND)), 4 (VDD: Power Supply Input (VDD — 3.15V to 3.45V)), 5 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 6 (NC: Multiplexed I/O & Peripheral Pin NC (General)).

What are the IPC-7351B PCB Footprint dimensions for MRF24WN0MB-I/RM100?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MRF24WN0MB-I/RM100 (SMD-37P) has a nominal body envelope of 17.78 × 26.67 mm, pitch e = 1.27 mm, and 37 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MRF24WN0MB-I/RM100?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MRF24WN0MB-I/RM100 (MICROCHIP, SMD-37P) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (37 pins) & MRF24WN0MB Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
2TESTDigital_IOSignal terminal TEST (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: TEST. Supported peripheral buses: General.
3GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
4VDDPower_InPrimary positive power supply input (VDD) operating in the 3.15V to 3.45V domain (Max rating: 3.45V).
5NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
6NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
7NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
8NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
9NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
10NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
11NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
12NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
13SPI_CLKDigital_IOSignal terminal SPI_CLK (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: SPICLOCKINPUT. Supported peripheral buses: SPI.
14SPI_MISODigital_IOSignal terminal SPI_MISO (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: SPI. Supported peripheral buses: SPI.
15VDDPower_InPrimary positive power supply input (VDD) operating in the 3.15V to 3.45V domain (Max rating: 3.45V).
16GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
17TESTDigital_IOSignal terminal TEST (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: TEST. Supported peripheral buses: General.
18TESTDigital_IOSignal terminal TEST (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: TEST. Supported peripheral buses: General.
19HIBERNATEDigital_IOSignal terminal HIBERNATE (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: HIBERNATE. Supported peripheral buses: General.
20SPI_INTDigital_IOSignal terminal SPI_INT (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: SPI. Supported peripheral buses: SPI.
21MODE0Digital_IOSignal terminal MODE0 (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: MODE0. Supported peripheral buses: General.
22SPI_MOSIDigital_IOSignal terminal SPI_MOSI (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: SPIDATAINPUT. Supported peripheral buses: SPI.
23SPI CS/MODE1_Digital_IOSignal terminal SPI CS/MODE1_ (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: SPICHIPSELECT. Supported peripheral buses: SPI.
24GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
25NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
26NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
27GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
28NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
29NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
30NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
31NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
32NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
33NCNCSignal terminal NC (I/O, 3.15V to 3.45V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
34GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
35VDDPower_InPrimary positive power supply input (VDD) operating in the 3.15V to 3.45V domain (Max rating: 3.45V).
36GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
37GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
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