MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — Symbol, Footprint IPC-7351B & 3D STEP Model

MIC2033-08BYMT-T5

MICROCHIPID: C632977UDFN-6-EP(2x2) · 7 Pins · Pitch 0.65mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MIC2033-08BYMT-T5 (UDFN-6-EP(2x2))1V OUT2CSLEW3FAULT/4EN7EP6V IN5GNDGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
1234567E=2.00mm · Pitch e=0.65mmD=2.00mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 2.00mm × 2.00mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (7/7)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1V OUTI/OMultiplexed I/O & Peripheral Pin V OUT (General)
2CSLEWI/OMultiplexed I/O & Peripheral Pin CSLEW (General)
3FAULT/I/OMultiplexed I/O & Peripheral Pin FAULT/ (General)
4ENISystem Enable & Hardware Reset (EN)
5GNDGNDGround Reference Pin (GND)
6V INI/OMultiplexed I/O & Peripheral Pin V IN (General)
7EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 V OUT
I/O
Multiplexed I/O & Peripheral Pin V OUT (General)
Design note: SwitchOutput:Powerswitchoutput .
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MIC2033-08BYMT-T5 (MICROCHIP · UDFN-6-EP(2x2))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) - 2. Standard Pinout (Top View)
True package pinout (7 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) - 4. Package Dimensions (D×E×A)
UDFN-6-EP(2x2) · 2.00×2.00mm · Pitch 0.65mmExpand ›
5. Recommended Land PatternLAND PATTERN
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) - 5. Recommended Land Pattern
IPC-7351B Footprint (7 Pads)Expand ›
6. Application SchematicSCHEMATIC
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)
Showing 1–10 of 10 uncropped original figures for MIC2033
P1 · p01_fig01377×200px
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — High-Accuracy, High-Side, Fixed Current-Limit Power Switch
High-Accuracy, High-Side, Fixed Current-Limit Power Switch
P1 · p01_fig021777×761px
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) —  2018 Microchip Technology Inc. DS20005539A-page 1
 2018 Microchip Technology Inc. DS20005539A-page 1
P2 · p02_fig011777×763px
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — Functional Block Diagram
Functional Block Diagram
P2 · p02_fig021777×1330px
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — Functional Block Diagram | UVLO | VIN | EN | CSLEW | CONTROL | THERMAL | SENSOR | SLEW RATE | CONTROL | REFERENCE | CURRENT | LIMIT | SENSE FET | POWER FET | FAULT/ | GND | DELAY | VOUT
Functional Block Diagram | UVLO | VIN | EN | CSLEW | CONTROL | THERMAL | SENSOR | SLEW RATE | CONTROL | REFERENCE | CURRENT | LIMIT | SENSE FET | POWER FET | FAULT/ | GND | DELAY | VOUT
P2 · p02_fig01P2
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — Datasheet Page 2 (p02_fig01)
Datasheet Page 2 (p02_fig01)
P17 · p17_fig011777×2031px
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — MIC2033 | 6.0 PACKAGING INFORMATION | 6.1 Package Marking Information | 6-Pin SOT-23* Example | 6-Pin TDFN* Example | XXX | XXX NNN | NNN | 36A 943 | 3A5 668 | ●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle m
MIC2033 | 6.0 PACKAGING INFORMATION | 6.1 Package Marking Information | 6-Pin SOT-23* Example | 6-Pin TDFN* Example | XXX | XXX NNN | NNN | 36A 943 | 3A5 668 | ●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle m
P17 · p17_fig01P17
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — Datasheet Page 17 (p17_fig01)
Datasheet Page 17 (p17_fig01)
P18 · p18_fig011668×1745px
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
P18 · p18_fig01P18
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — Datasheet Page 18 (p18_fig01)
Datasheet Page 18 (p18_fig01)
P19 · p19_fig011662×1751px
MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) — Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Technical Specifications & Part Details (MIC2033-08BYMT-T5)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) is a 6-pin standard electronic & interconnect component featuring a 2.00 × 2.00 × 0.85 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 2.5V to 5.5V supply operation across 40°C to +125°C with integrated USB interfaces.
Operating Supply VoltageV_CC / V_DD
2.5V to 5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to +125°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
100 µA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.00 × 2.00 × 0.85 mm (A1=0.03 mm)
Package family: DFN (UDFN-6-EP(2x2))
Pin Count & Lead PitchN / e
6 Pins | Pitch e = 0.65 mm (25.6 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
USB
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol7 auto-grouped pins
OK
IPC-7351B Land Pattern7 pads · Pitch 0.65mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (UDFN-6-EP(2x2))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.85mm · e=0.65mm
Pad Size (W × L)Level B
0.34 × 0.58 mm
Pins / Total PadsTopology
7P / 7Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
UDFN-6-EP(2x2)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC2033-08BYMT-T5 (UDFN-6-EP(2x2))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC2033-08BYMT-T5 (UDFN-6-EP(2x2))?

Manufactured by MICROCHIP, the MIC2033-08BYMT-T5 is housed in a UDFN-6-EP(2x2) package with 7 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2.5V to 5.5V. Key pins include: 1 (V OUT: Multiplexed I/O & Peripheral Pin V OUT (General)), 2 (CSLEW: Multiplexed I/O & Peripheral Pin CSLEW (General)), 3 (FAULT/: Multiplexed I/O & Peripheral Pin FAULT/ (General)), 4 (EN: System Enable & Hardware Reset (EN)), 5 (GND: Ground Reference Pin (GND)), 6 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)).

What are the IPC-7351B PCB Footprint dimensions for MIC2033-08BYMT-T5?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.65 mm, and 7 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC2033-08BYMT-T5?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC2033-08BYMT-T5 (MICROCHIP, UDFN-6-EP(2x2)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (7 pins) & MIC2033 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1V OUTDigital_IOSignal terminal V OUT (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: V OUT. Supported peripheral buses: General.
2CSLEWDigital_IOSignal terminal CSLEW (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: CSLEW. Supported peripheral buses: General.
3FAULT/Open_DrainSignal terminal FAULT/ (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: FAULT/. Supported peripheral buses: General.
4ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
5GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
6V INDigital_IOSignal terminal V IN (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: V IN. Supported peripheral buses: General.
7EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.