MIC5319-2.8YD5-TR (TSOT-23-5) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC5319-2.8YD5-TR (TSOT-23-5)?

Manufactured by MICROCHIP, the MIC5319-2.8YD5-TR is housed in a TSOT-23-5 package with 5 pins and a 0.95 mm lead pitch, supporting a VCC supply range of 2.5V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.5V to 5.5V)), 2 (GND: Ground Reference Pin (GND)), 3 (EN: System Enable & Hardware Reset (EN)), 4 (BYP: Multiplexed I/O & Peripheral Pin BYP (General)), 5 (VOUT: Regulated Power Output (VOUT — 2.5V to 5.5V)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC5319-2.8YD5-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5319-2.8YD5-TR (TSOT-23-5) has a nominal body envelope of 1.60 × 2.90 mm, pitch e = 0.95 mm, and 5 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5319-2.8YD5-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5319-2.8YD5-TR (MICROCHIP, TSOT-23-5) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 2.90mm × 1.60mm · Pitch: 0.95mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (5/5)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	VIN	Power	Power Supply Input (VIN — 2.5V to 5.5V)
2	GND	GND	Ground Reference Pin (GND)
3	EN	I	System Enable & Hardware Reset (EN)
4	BYP	I/O	Multiplexed I/O & Peripheral Pin BYP (General)
5	VOUT	Power	Regulated Power Output (VOUT — 2.5V to 5.5V)

PIN 1 VIN

Power

Power Supply Input (VIN — 2.5V to 5.5V)

Design note: InputVoltage .

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 14 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC5319-2.8YD5-TR (TSOT-23-5) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC5319-2.8YD5-TR (TSOT-23-5) - 2. Standard Pinout (Top View)

True package pinout (5 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC5319-2.8YD5-TR (TSOT-23-5) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC5319-2.8YD5-TR (TSOT-23-5) - 4. Package Dimensions (D×E×A)

TSOT-23-5 · 2.90×1.60mm · Pitch 0.95mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC5319-2.8YD5-TR (TSOT-23-5) - 5. Recommended Land Pattern

IPC-7351B Footprint (5 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC5319-2.8YD5-TR (TSOT-23-5) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (14 figures · Page 1/2)

Showing 1–12 of 14 uncropped original figures for MIC5319

P1 · p01_fig03EXACT PACKAGE

 2018 Microchip Technology Inc. DS20005876B-page 1

P2 · p02_fig01EXACT PACKAGE

Functional Block Diagrams

P13 · p13_fig01EXACT PACKAGE

MIC5319-2.8YD5-TR (TSOT-23-5) —  2018 Microchip Technology Inc. DS20005876B-page 13 | MIC5319 | 5.0 PACKAGING INFORMATION | 5.1 Package Marking Information | Example | XXXX | 5-Pin TSOT23* | NNN | Z31J 689 | Example | XXX | 6-Pin DFN* | NNN | 933 689 | Part Number Markin

P1 · p01_fig01377×200px

500 mA, µCap Ultra-Low Dropout Regulator with High PSRR

P2 · p02_fig021777×1908px

MIC5319-2.8YD5-TR (TSOT-23-5) — DS20005876B-page 2  2018 Microchip Technology Inc. | Functional Block Diagrams | VIN | EN | BYP | VOUT | GND | CURRENT | LIMIT | QUICK- | START VREF | THERMAL SHUTDOWN | ERROR | AMP | MIC5319 | VIN | EN | BYP | VOUT | GND | CURRENT | LIMIT

DS20005876B-page 2  2018 Microchip Technology Inc. | Functional Block Diagrams | VIN | EN | BYP | VOUT | GND | CURRENT | LIMIT | QUICK- | START VREF | THERMAL SHUTDOWN | ERROR | AMP | MIC5319 | VIN | EN | BYP | VOUT | GND | CURRENT | LIMIT

P2 · p02_fig01P2

Datasheet Page 2 (p02_fig01)

P11 · p11_fig01867×823px

FIGURE 4-1: Adjustable Voltage Typical Application. 4.7 Thermal Considerations

P12 · p12_fig01722×483px

EQUATION 4-5:

P12 · p12_fig02599×409px

EQUATION 4-5: | 0.25W 125C TA - 93C/W --------------------------- = | TA 101.75C =

P13 · p13_fig01P13

Datasheet Page 13 (p13_fig01)

P14 · p14_fig011669×1773px

MIC5319-2.8YD5-TR (TSOT-23-5) — Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

P14 · p14_fig01P14

Datasheet Page 14 (p14_fig01)

Page 1 / 2 (14 extracted figures)

Technical Specifications & Part Details (MIC5319-2.8YD5-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC5319-2.8YD5-TR (TSOT-23-5) is a 5-pin standard electronic & interconnect component featuring a 2.90 × 1.60 × 1.10 mm mechanical envelope (lead pitch e = 0.95 mm). Rated for 2.5V to 5.5V supply operation across 40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

2.5V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

100 kHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

2.90 × 1.60 × 1.10 mm (A1=0.08 mm)

Package family: SOT23 (TSOT-23-5)

Pin Count & Lead PitchN / e

5 Pins | Pitch e = 0.95 mm (37.4 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol5 auto-grouped pins

IPC-7351B Land Pattern5 pads · Pitch 0.95mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (TSOT-23-5)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

2.90 × 1.60 mm

Height (A) & Pitch (e)IPC-7351B

A=1.10mm · e=0.95mm

Pad Size (W × L)Level B

0.60 × 1.00 mm

Pins / Total PadsTopology

5P / 5Pad (SOT_SMALL)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit TSOT-23-5	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC5319-2.8YD5-TR (TSOT-23-5)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC5319-2.8YD5-TR (TSOT-23-5)?

Manufactured by MICROCHIP, the MIC5319-2.8YD5-TR is housed in a TSOT-23-5 package with 5 pins and a 0.95 mm lead pitch, supporting a VCC supply range of 2.5V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.5V to 5.5V)), 2 (GND: Ground Reference Pin (GND)), 3 (EN: System Enable & Hardware Reset (EN)), 4 (BYP: Multiplexed I/O & Peripheral Pin BYP (General)), 5 (VOUT: Regulated Power Output (VOUT — 2.5V to 5.5V)).

What are the IPC-7351B PCB Footprint dimensions for MIC5319-2.8YD5-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5319-2.8YD5-TR (TSOT-23-5) has a nominal body envelope of 1.60 × 2.90 mm, pitch e = 0.95 mm, and 5 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5319-2.8YD5-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5319-2.8YD5-TR (MICROCHIP, TSOT-23-5) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (5 pins) & MIC5319 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	VIN	Power_In	Primary positive power supply input (VIN) operating in the 2.5V to 5.5V domain (Max rating: 5.5V).
2	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
3	EN	Digital_IO	Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
4	BYP	Digital_IO	Signal terminal BYP (I/O, 2.5V to 5.5V domain). Multiplexed alternate functions: BYP. Supported peripheral buses: General.
5	VOUT	Power_Out	Regulated power output rail (VOUT) operating in the 2.5V to 5.5V domain (Max rating: 5.5V).

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