MCP1700T-3502E/TT (SOT-23-3) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MCP1700T-3502E/TT (SOT-23-3)?

Manufactured by MICROCHIP, the MCP1700T-3502E/TT is housed in a SOT-23-3 package with 3 pins and a 1.90 mm lead pitch, supporting a VCC supply range of 2.3V to 6.0V. Key pins include: 1 (GND: Ground Reference Pin (GND)), 2 (V OUT: Multiplexed I/O & Peripheral Pin V OUT (General)), 3 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for MCP1700T-3502E/TT?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP1700T-3502E/TT (SOT-23-3) has a nominal body envelope of 1.30 × 2.90 mm, pitch e = 1.90 mm, and 3 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP1700T-3502E/TT?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP1700T-3502E/TT (MICROCHIP, SOT-23-3) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 2.90mm × 1.30mm · Pitch: 1.90mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (3/3)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	GND	GND	Ground Reference Pin (GND)
2	V OUT	I/O	Multiplexed I/O & Peripheral Pin V OUT (General)
3	V IN	I/O	Multiplexed I/O & Peripheral Pin V IN (General)

PIN 1 GND

GND

Ground Reference Pin (GND)

Design note: GroundTerminal

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 15 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MCP1700T-3502E/TT (SOT-23-3) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MCP1700T-3502E/TT (SOT-23-3) - 2. Standard Pinout (Top View)

True package pinout (3 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MCP1700T-3502E/TT (SOT-23-3) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MCP1700T-3502E/TT (SOT-23-3) - 4. Package Dimensions (D×E×A)

SOT-23-3 · 2.90×1.30mm · Pitch 1.90mmExpand ›

5. Recommended Land PatternLAND PATTERN

MCP1700T-3502E/TT (SOT-23-3) - 5. Recommended Land Pattern

IPC-7351B Footprint (3 Pads)Expand ›

6. Application SchematicSCHEMATIC

MCP1700T-3502E/TT (SOT-23-3) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (15 figures · Page 1/2)

Showing 1–12 of 15 uncropped original figures for MCP1700

P1 · p01_fig02EXACT PACKAGE

Package options include SOT-23, SOT-89, TO-92 and 2x2 DFN-6.

P14 · p14_fig02EXACT PACKAGE

FIGURE 6-1: Typical Application Circuit. 6.1.1 APPLICATION INPUT CONDITIONS

P17 · p17_fig01EXACT PACKAGE

MCP1700T-3502E/TT (SOT-23-3) —  2005-2020 Microchip Technology Inc. DS20001826F-page 17 | MCP1700 | 7.0 PACKAGING INFORMATION | 7.1 Package Marking Information | 3-Pin SOT-23 | CKNN | 3-Pin SOT-89 | CUYYWW | NNN | 3-Pin TO-92 | XXXXXX XXXXXX | YWWNNN | Standard | Extend

P1 · p01_fig01376×200px

Low Quiescent Current LDO

P1 · p01_fig02P1

Datasheet Page 1 (p01_fig02)

P2 · p02_fig011327×1149px

Functional Block Diagrams

P2 · p02_fig021193×562px

Typical Application Circuits

P14 · p14_fig011777×894px

6.1 Typical Application

P14 · p14_fig02P14

Datasheet Page 14 (p14_fig02)

P17 · p17_fig01P17

Datasheet Page 17 (p17_fig01)

P20 · p20_fig011711×1784px

$MCP1700T-3502E/TT (SOT-23-3) — 0LFURFKLS7HFKQRORJ\'UDZLQJ& &6KHHWRI$

0LFURFKLS7HFKQRORJ\'UDZLQJ& &6KHHWRI

P22 · p22_fig011128×1002px

RECOMMENDED LAND PATTERN

Page 1 / 2 (15 extracted figures)

Technical Specifications & Part Details (MCP1700T-3502E/TT)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MCP1700T-3502E/TT (SOT-23-3) is a 3-pin standard electronic & interconnect component featuring a 2.90 × 1.30 × 1.10 mm mechanical envelope (lead pitch e = 1.90 mm). Rated for 2.3V to 6.0V supply operation across -40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

2.3V to 6.0V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

1 kHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

2.90 × 1.30 × 1.10 mm (A1=0.07 mm)

Package family: SOT23 (SOT-23-3)

Pin Count & Lead PitchN / e

3 Pins | Pitch e = 1.90 mm (74.8 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol3 auto-grouped pins

IPC-7351B Land Pattern3 pads · Pitch 1.90mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOT-23-3)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

2.90 × 1.30 mm

Height (A) & Pitch (e)IPC-7351B

A=1.10mm · e=1.90mm

Pad Size (W × L)Level B

0.65 × 1.00 mm

Pins / Total PadsTopology

3P / 3Pad (SOT_SMALL)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit SOT-23-3	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MCP1700T-3502E/TT (SOT-23-3)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MCP1700T-3502E/TT (SOT-23-3)?

Manufactured by MICROCHIP, the MCP1700T-3502E/TT is housed in a SOT-23-3 package with 3 pins and a 1.90 mm lead pitch, supporting a VCC supply range of 2.3V to 6.0V. Key pins include: 1 (GND: Ground Reference Pin (GND)), 2 (V OUT: Multiplexed I/O & Peripheral Pin V OUT (General)), 3 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)).

What are the IPC-7351B PCB Footprint dimensions for MCP1700T-3502E/TT?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP1700T-3502E/TT (SOT-23-3) has a nominal body envelope of 1.30 × 2.90 mm, pitch e = 1.90 mm, and 3 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP1700T-3502E/TT?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP1700T-3502E/TT (MICROCHIP, SOT-23-3) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (3 pins) & MCP1700 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
2	V OUT	Digital_IO	Signal terminal V OUT (I/O, 2.3V to 6.0V domain). Multiplexed alternate functions: V OUT. Supported peripheral buses: General.
3	V IN	Digital_IO	Signal terminal V IN (I/O, 2.3V to 6.0V domain). Multiplexed alternate functions: V IN. Supported peripheral buses: General.

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