MIC5264-PPYML-TR (MLF-10) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC5264-PPYML-TR (MLF-10)?

Manufactured by MICROCHIP, the MIC5264-PPYML-TR is housed in a MLF-10 package with 11 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.7V to 5.5V. Key pins include: 1 (GND1: Ground Reference Pin (GND1)), 2 (IN1: Multiplexed I/O & Peripheral Pin IN1 (General)), 3 (OUT1: Multiplexed I/O & Peripheral Pin OUT1 (General)), 4 (BYP2: Multiplexed I/O & Peripheral Pin BYP2 (General)), 5 (EN2: Multiplexed I/O & Peripheral Pin EN2 (General)), 6 (GND2: Ground Reference Pin (GND2)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC5264-PPYML-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5264-PPYML-TR (MLF-10) has a nominal body envelope of 2.50 × 2.50 mm, pitch e = 0.50 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 1.90 × 1.20 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5264-PPYML-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5264-PPYML-TR (MICROCHIP, MLF-10) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 2.50mm × 2.50mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (11/11)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	GND1	GND	Ground Reference Pin (GND1)
2	IN1	I/O	Multiplexed I/O & Peripheral Pin IN1 (General)
3	OUT1	I/O	Multiplexed I/O & Peripheral Pin OUT1 (General)
4	BYP2	I/O	Multiplexed I/O & Peripheral Pin BYP2 (General)
5	EN2	I/O	Multiplexed I/O & Peripheral Pin EN2 (General)
6	GND2	GND	Ground Reference Pin (GND2)
7	IN2	I/O	Multiplexed I/O & Peripheral Pin IN2 (General)
8	OUT2	I/O	Multiplexed I/O & Peripheral Pin OUT2 (General)
9	BYP1	I/O	Multiplexed I/O & Peripheral Pin BYP1 (General)
10	EN1	I/O	Multiplexed I/O & Peripheral Pin EN1 (General)
11	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 GND1

GND

Ground Reference Pin (GND1)

Design note: Ground

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC5264-PPYML-TR (MLF-10) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC5264-PPYML-TR (MLF-10) - 2. Standard Pinout (Top View)

True package pinout (11 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC5264-PPYML-TR (MLF-10) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC5264-PPYML-TR (MLF-10) - 4. Package Dimensions (D×E×A)

MLF-10 · 2.50×2.50mm · Pitch 0.50mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC5264-PPYML-TR (MLF-10) - 5. Recommended Land Pattern

IPC-7351B Footprint (11 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC5264-PPYML-TR (MLF-10) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)

Showing 1–10 of 10 uncropped original figures for MIC5264

P3 · p03_fig01EXACT PACKAGE

Micrel, Inc. MIC5264

P11 · p11_fig01EXACT PACKAGE

Package Information

P1 · p01_fig01629×628px

MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc.

P1 · p01_fig02999×583px

Typical Application

P1 · p01_fig02P1

Datasheet Page 1 (p01_fig02)

P3 · p03_fig01P3

Datasheet Page 3 (p03_fig01)

P7 · p07_fig01721×573px

Time (5µs/div)

P7 · p07_fig02717×571px

Time (400µs/div)

P7 · p07_fig03714×569px

Time (10µs/div)

P7 · p07_fig04715×572px

Time (100µs/div)

Technical Specifications & Part Details (MIC5264-PPYML-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC5264-PPYML-TR (MLF-10) is a 10-pin standard electronic & interconnect component featuring a 2.50 × 2.50 × 0.75 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 2.7V to 5.5V supply operation across 40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

2.7V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

1kHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

2.50 × 2.50 × 0.75 mm (A1=0.02 mm)

Package family: OTHER (MLF-10)

Pin Count & Lead PitchN / e

10 Pins | Pitch e = 0.50 mm (19.7 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol11 auto-grouped pins

IPC-7351B Land Pattern11 pads · Pitch 0.50mm

IPC-7525 60% Solder PasteEPAD 1.90×1.20mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MLF-10)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

2.50 × 2.50 mm

Height (A) & Pitch (e)IPC-7351B

A=0.75mm · e=0.50mm

Pad Size (W × L)Level B

0.25 × 0.60 mm

Pins / Total PadsTopology

11P / 11Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit MLF-10	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC5264-PPYML-TR (MLF-10)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC5264-PPYML-TR (MLF-10)?

Manufactured by MICROCHIP, the MIC5264-PPYML-TR is housed in a MLF-10 package with 11 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.7V to 5.5V. Key pins include: 1 (GND1: Ground Reference Pin (GND1)), 2 (IN1: Multiplexed I/O & Peripheral Pin IN1 (General)), 3 (OUT1: Multiplexed I/O & Peripheral Pin OUT1 (General)), 4 (BYP2: Multiplexed I/O & Peripheral Pin BYP2 (General)), 5 (EN2: Multiplexed I/O & Peripheral Pin EN2 (General)), 6 (GND2: Ground Reference Pin (GND2)).

What are the IPC-7351B PCB Footprint dimensions for MIC5264-PPYML-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5264-PPYML-TR (MLF-10) has a nominal body envelope of 2.50 × 2.50 mm, pitch e = 0.50 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 1.90 × 1.20 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5264-PPYML-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5264-PPYML-TR (MICROCHIP, MLF-10) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (11 pins) & MIC5264 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	GND1	GND	0V electrical ground return terminal (GND1) for internal core logic, I/O drivers, and analog sub-blocks.
2	IN1	Digital_IO	Signal terminal IN1 (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: IN1. Supported peripheral buses: General.
3	OUT1	Digital_IO	Signal terminal OUT1 (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: OUT1. Supported peripheral buses: General.
4	BYP2	Digital_IO	Signal terminal BYP2 (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: BYP2. Supported peripheral buses: General.
5	EN2	Digital_IO	Signal terminal EN2 (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: EN2. Supported peripheral buses: General.
6	GND2	GND	0V electrical ground return terminal (GND2) for internal core logic, I/O drivers, and analog sub-blocks.
7	IN2	Digital_IO	Signal terminal IN2 (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: IN2. Supported peripheral buses: General.
8	OUT2	Digital_IO	Signal terminal OUT2 (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: OUT2. Supported peripheral buses: General.
9	BYP1	Digital_IO	Signal terminal BYP1 (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: BYP1. Supported peripheral buses: General.
10	EN1	Digital_IO	Signal terminal EN1 (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: EN1. Supported peripheral buses: General.
11	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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