MIC23051-945YML-TR (MLF-8) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC23051-945YML-TR (MLF-8)?

Manufactured by MICROCHIP, the MIC23051-945YML-TR is housed in a MLF-8 package with 9 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.7V to 5.5V. Key pins include: 1 (SW: Multiplexed I/O & Peripheral Pin SW (General)), 2 (EN: System Enable & Hardware Reset (EN)), 3 (VSC: Multiplexed I/O & Peripheral Pin VSC (General)), 4 (SNS: Multiplexed I/O & Peripheral Pin SNS (General)), 5 (CFF: Multiplexed I/O & Peripheral Pin CFF (General)), 6 (AGND: Ground Reference Pin (AGND)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC23051-945YML-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC23051-945YML-TR (MLF-8) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.50 mm, and 9 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC23051-945YML-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC23051-945YML-TR (MICROCHIP, MLF-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 2.00mm × 2.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (9/9)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	SW	I/O	Multiplexed I/O & Peripheral Pin SW (General)
2	EN	I	System Enable & Hardware Reset (EN)
3	VSC	I/O	Multiplexed I/O & Peripheral Pin VSC (General)
4	SNS	I/O	Multiplexed I/O & Peripheral Pin SNS (General)
5	CFF	I/O	Multiplexed I/O & Peripheral Pin CFF (General)
6	AGND	GND	Ground Reference Pin (AGND)
7	VIN	Power	Power Supply Input (VIN — 2.7V to 5.5V)
8	PGND	GND	Ground Reference Pin (PGND)
9	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 SW

I/O

Multiplexed I/O & Peripheral Pin SW (General)

Design note: Switch(Output):InternalpowerMOSFEToutputswitches .

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC23051-945YML-TR (MLF-8) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC23051-945YML-TR (MLF-8) - 2. Standard Pinout (Top View)

True package pinout (9 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC23051-945YML-TR (MLF-8) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC23051-945YML-TR (MLF-8) - 4. Package Dimensions (D×E×A)

MLF-8 · 2.00×2.00mm · Pitch 0.50mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC23051-945YML-TR (MLF-8) - 5. Recommended Land Pattern

IPC-7351B Footprint (9 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC23051-945YML-TR (MLF-8) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)

Showing 1–10 of 10 uncropped original figures for MIC23051

P1 · p01_fig02EXACT PACKAGE

 2020 Microchip Technology Inc. DS20006471A-page 1

P1 · p01_fig01376×200px

4 MHz PWM Buck Regulator with HyperLight Load®and Voltage Scaling

P1 · p01_fig02P1

Datasheet Page 1 (p01_fig02)

P2 · p02_fig011030×571px

Typical Application Circuit

P2 · p02_fig021087×776px

Functional Block Diagram

P2 · p02_fig01P2

Datasheet Page 2 (p02_fig01)

P10 · p10_fig011779×603px

DS20006471A-page 10  2020 Microchip Technology Inc. | EQUATION 4-1: | IPEAK IOUT VOUT | 1 VOUT VIN  - | 2 f L   -----------------------------------     + =

P12 · p12_fig011360×815px

MIC23051-945YML-TR (MLF-8) — ●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle mark). | Underbar (_) and/or Overbar (‾) symbol may not be to scale. | 3 e | 3 e

●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle mark). | Underbar (_) and/or Overbar (‾) symbol may not be to scale. | 3 e | 3 e

P13 · p13_fig011568×1657px

MIC23051-945YML-TR (MLF-8) — Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

P13 · p13_fig01P13

Datasheet Page 13 (p13_fig01)

Technical Specifications & Part Details (MIC23051-945YML-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC23051-945YML-TR (MLF-8) is a 8-pin standard electronic & interconnect component featuring a 2.00 × 2.00 × 0.75 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 2.7V to 5.5V supply operation across 40°C to +125°C with integrated Wi-Fi, USB, PWM interfaces.

Operating Supply VoltageV_CC / V_DD

2.7V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

4 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

20 µA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

2.00 × 2.00 × 0.75 mm (A1=0.02 mm)

Package family: OTHER (MLF-8)

Pin Count & Lead PitchN / e

8 Pins | Pitch e = 0.50 mm (19.7 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Wi-Fi, USB, PWM

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol9 auto-grouped pins

IPC-7351B Land Pattern9 pads · Pitch 0.50mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MLF-8)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

2.00 × 2.00 mm

Height (A) & Pitch (e)IPC-7351B

A=0.75mm · e=0.50mm

Pad Size (W × L)Level B

0.25 × 0.60 mm

Pins / Total PadsTopology

9P / 9Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit MLF-8	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC23051-945YML-TR (MLF-8)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC23051-945YML-TR (MLF-8)?

Manufactured by MICROCHIP, the MIC23051-945YML-TR is housed in a MLF-8 package with 9 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.7V to 5.5V. Key pins include: 1 (SW: Multiplexed I/O & Peripheral Pin SW (General)), 2 (EN: System Enable & Hardware Reset (EN)), 3 (VSC: Multiplexed I/O & Peripheral Pin VSC (General)), 4 (SNS: Multiplexed I/O & Peripheral Pin SNS (General)), 5 (CFF: Multiplexed I/O & Peripheral Pin CFF (General)), 6 (AGND: Ground Reference Pin (AGND)).

What are the IPC-7351B PCB Footprint dimensions for MIC23051-945YML-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC23051-945YML-TR (MLF-8) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.50 mm, and 9 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC23051-945YML-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC23051-945YML-TR (MICROCHIP, MLF-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (9 pins) & MIC23051 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	SW	Digital_IO	Signal terminal SW (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
2	EN	Digital_IO	Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
3	VSC	Digital_IO	Signal terminal VSC (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: VSC. Supported peripheral buses: General.
4	SNS	Digital_IO	Signal terminal SNS (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: SNS. Supported peripheral buses: General.
5	CFF	Digital_IO	Signal terminal CFF (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: CFF. Supported peripheral buses: General.
6	AGND	GND	0V electrical ground return terminal (AGND) for internal core logic, I/O drivers, and analog sub-blocks.
7	VIN	Power_In	Primary positive power supply input (VIN) operating in the 2.7V to 5.5V domain (Max rating: 5.5V).
8	PGND	GND	0V electrical ground return terminal (PGND) for internal core logic, I/O drivers, and analog sub-blocks.
9	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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