93AA56AT-I/MC (DFN-8-EP(2x3)) — Symbol, Footprint IPC-7351B & 3D STEP Model

93AA56AT-I/MC

MICROCHIPID: C612317DFN-8-EP(2x3) · 9 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · 93AA56AT-I/MC (DFN-8-EP(2x3))1CS2CLK3DI4DO5VSS9EP8VCC7NC6ORG/NCGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.812.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
123456789E=2.00mm · Pitch e=0.50mmD=3.00mm-3-2-1012343210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 2.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (9/9)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1CSI/OMultiplexed I/O & Peripheral Pin CS (General)
2CLKI/OMultiplexed I/O & Peripheral Pin CLK (General)
3DII/OMultiplexed I/O & Peripheral Pin DI (General)
4DOI/OMultiplexed I/O & Peripheral Pin DO (General)
5VSSGNDGround Reference Pin (VSS)
6ORG/NCI/OMultiplexed I/O & Peripheral Pin ORG/NC (General)
7NCI/OMultiplexed I/O & Peripheral Pin NC (General)
8VCCPowerPower Supply Input (VCC — 1.8V-5.5V)
9EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 CS
I/O
Multiplexed I/O & Peripheral Pin CS (General)
Design note: ChipSelect
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 11 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: 93AA56AT-I/MC (MICROCHIP · DFN-8-EP(2x3))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
93AA56AT-I/MC (DFN-8-EP(2x3)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
93AA56AT-I/MC (DFN-8-EP(2x3)) - 2. Standard Pinout (Top View)
True package pinout (9 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
93AA56AT-I/MC (DFN-8-EP(2x3)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
93AA56AT-I/MC (DFN-8-EP(2x3)) - 4. Package Dimensions (D×E×A)
DFN-8-EP(2x3) · 2.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
93AA56AT-I/MC (DFN-8-EP(2x3)) - 5. Recommended Land Pattern
IPC-7351B Footprint (9 Pads)Expand ›
6. Application SchematicSCHEMATIC
93AA56AT-I/MC (DFN-8-EP(2x3)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (11 figures · Page 1/1)
Showing 1–11 of 11 uncropped original figures for 93AA56AT
P1 · p01_fig01376×200px
93AA56AT-I/MC (DFN-8-EP(2x3)) — 2-Kbit Microwire Compatible Serial EEPROM
2-Kbit Microwire Compatible Serial EEPROM
P22 · p22_fig011061×1130px
93AA56AT-I/MC (DFN-8-EP(2x3)) — RECOMMENDED LAND PATTERN
RECOMMENDED LAND PATTERN
P22 · p22_fig01P22
93AA56AT-I/MC (DFN-8-EP(2x3)) — Datasheet Page 22 (p22_fig01)
Datasheet Page 22 (p22_fig01)
P25 · p25_fig011500×1973px
93AA56AT-I/MC (DFN-8-EP(2x3)) — Microchip Technology Drawing No. C04-057-SN Rev J Sheet 1 of 2
Microchip Technology Drawing No. C04-057-SN Rev J Sheet 1 of 2
P25 · p25_fig01P25
93AA56AT-I/MC (DFN-8-EP(2x3)) — Datasheet Page 25 (p25_fig01)
Datasheet Page 25 (p25_fig01)
P26 · p26_fig011296×1609px
93AA56AT-I/MC (DFN-8-EP(2x3)) — protrusions shall not exceed 0.15mm per side. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
P27 · p27_fig01981×911px
93AA56AT-I/MC (DFN-8-EP(2x3)) — RECOMMENDED LAND PATTERN
RECOMMENDED LAND PATTERN
P33 · p33_fig01876×1020px
93AA56AT-I/MC (DFN-8-EP(2x3)) — MILLIMETERS
MILLIMETERS
P39 · p39_fig011776×1834px
93AA56AT-I/MC (DFN-8-EP(2x3)) — 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
P39 · p39_fig01P39
93AA56AT-I/MC (DFN-8-EP(2x3)) — Datasheet Page 39 (p39_fig01)
Datasheet Page 39 (p39_fig01)
P40 · p40_fig011776×1486px
93AA56AT-I/MC (DFN-8-EP(2x3)) — 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

Technical Specifications & Part Details (93AA56AT-I/MC)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:93AA56AT-I/MC (DFN-8-EP(2x3)) is a 8-pin standard electronic & interconnect component featuring a 3.00 × 2.00 × 0.80 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V-5.5V supply operation across -40°C to +85°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V-5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
1 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 2.00 × 0.80 mm (A1=0.03 mm)
Package family: DFN (DFN-8-EP(2x3))
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol9 auto-grouped pins
OK
IPC-7351B Land Pattern9 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteEPAD 1.75×1.55mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DFN-8-EP(2x3))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.80mm · e=0.50mm
Pad Size (W × L)Level B
0.30 × 0.85 mm
Pins / Total PadsTopology
9P / 9Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
DFN-8-EP(2x3)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — 93AA56AT-I/MC (DFN-8-EP(2x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of 93AA56AT-I/MC (DFN-8-EP(2x3))?

Manufactured by MICROCHIP, the 93AA56AT-I/MC is housed in a DFN-8-EP(2x3) package with 9 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 1.8V-5.5V. Key pins include: 1 (CS: Multiplexed I/O & Peripheral Pin CS (General)), 2 (CLK: Multiplexed I/O & Peripheral Pin CLK (General)), 3 (DI: Multiplexed I/O & Peripheral Pin DI (General)), 4 (DO: Multiplexed I/O & Peripheral Pin DO (General)), 5 (VSS: Ground Reference Pin (VSS)), 6 (ORG/NC: Multiplexed I/O & Peripheral Pin ORG/NC (General)).

What are the IPC-7351B PCB Footprint dimensions for 93AA56AT-I/MC?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 93AA56AT-I/MC (DFN-8-EP(2x3)) has a nominal body envelope of 2.00 × 3.00 mm, pitch e = 0.50 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 1.75 × 1.55 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 93AA56AT-I/MC?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 93AA56AT-I/MC (MICROCHIP, DFN-8-EP(2x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (9 pins) & 93AA56AT Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1CSDigital_IOSignal terminal CS (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: CS. Supported peripheral buses: General.
2CLKDigital_IOSignal terminal CLK (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: CLK. Supported peripheral buses: General.
3DIDigital_IOSignal terminal DI (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: DI. Supported peripheral buses: General.
4DODigital_IOSignal terminal DO (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: DO. Supported peripheral buses: General.
5VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
6ORG/NCDigital_IOSignal terminal ORG/NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: ORG/NC. Supported peripheral buses: General.
7NCNCSignal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
8VCCPower_InPrimary positive power supply input (VCC) operating in the 1.8V-5.5V domain (Max rating: 5.5V).
9EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.