24LC32AT-E/MC (DFN-8-EP(2x3)) — Symbol, Footprint IPC-7351B & 3D STEP Model

24LC32AT-E/MC

MICROCHIPID: C612289DFN-8-EP(2x3) · 9 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · 24LC32AT-E/MC (DFN-8-EP(2x3))1A02A13A24VSS5SDA9EP8VCC7WP6SCLGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.812.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
123456789E=2.00mm · Pitch e=0.50mmD=3.00mm-3-2-1012343210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 2.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (9/9)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1A0I/OMultiplexed I/O & Peripheral Pin A0 (General)
2A1I/OMultiplexed I/O & Peripheral Pin A1 (General)
3A2I/OMultiplexed I/O & Peripheral Pin A2 (General)
4VSSGNDGround Reference Pin (VSS)
5SDAI/OMultiplexed I/O & Peripheral Pin SDA (I2C)
6SCLI/OMultiplexed I/O & Peripheral Pin SCL (I2C)
7WPI/OMultiplexed I/O & Peripheral Pin WP (General)
8VCCPowerPower Supply Input (VCC — 1.7V-5.5V)
9EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 A0
I/O
Multiplexed I/O & Peripheral Pin A0 (General)
Design note: ChipAddressInput
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: 24LC32AT-E/MC (MICROCHIP · DFN-8-EP(2x3))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
24LC32AT-E/MC (DFN-8-EP(2x3)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
24LC32AT-E/MC (DFN-8-EP(2x3)) - 2. Standard Pinout (Top View)
True package pinout (9 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
24LC32AT-E/MC (DFN-8-EP(2x3)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
24LC32AT-E/MC (DFN-8-EP(2x3)) - 4. Package Dimensions (D×E×A)
DFN-8-EP(2x3) · 2.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
24LC32AT-E/MC (DFN-8-EP(2x3)) - 5. Recommended Land Pattern
IPC-7351B Footprint (9 Pads)Expand ›
6. Application SchematicSCHEMATIC
24LC32AT-E/MC (DFN-8-EP(2x3)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)
Showing 1–10 of 10 uncropped original figures for 24LC32AT
P1 · p01_fig01376×200px
24LC32AT-E/MC (DFN-8-EP(2x3)) — 32-Kbit I2C Serial EEPROM
32-Kbit I2C Serial EEPROM
P13 · p13_fig011777×2734px
24LC32AT-E/MC (DFN-8-EP(2x3)) —  2002-2021 Microchip Technology Inc. and its subsidiaries DS20001713N-page 13 | 24AA32A/24LC32A | 9.0 PACKAGING INFORMATION | 9.1 Package Marking Information | XXXXXXXX T/XXXNNN | YYWW | 8-Lead PDIP (300 mil) Example | 8-Lead SOIC (3.90 mm
 2002-2021 Microchip Technology Inc. and its subsidiaries DS20001713N-page 13 | 24AA32A/24LC32A | 9.0 PACKAGING INFORMATION | 9.1 Package Marking Information | XXXXXXXX T/XXXNNN | YYWW | 8-Lead PDIP (300 mil) Example | 8-Lead SOIC (3.90 mm
P13 · p13_fig01P13
24LC32AT-E/MC (DFN-8-EP(2x3)) — Datasheet Page 13 (p13_fig01)
Datasheet Page 13 (p13_fig01)
P25 · p25_fig011298×1486px
24LC32AT-E/MC (DFN-8-EP(2x3)) — protrusions shall not exceed 0.15mm per side. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
P26 · p26_fig01989×908px
24LC32AT-E/MC (DFN-8-EP(2x3)) — RECOMMENDED LAND PATTERN
RECOMMENDED LAND PATTERN
P35 · p35_fig01878×1024px
24LC32AT-E/MC (DFN-8-EP(2x3)) — MILLIMETERS
MILLIMETERS
P35 · p35_fig01P35
24LC32AT-E/MC (DFN-8-EP(2x3)) — Datasheet Page 35 (p35_fig01)
Datasheet Page 35 (p35_fig01)
P41 · p41_fig011777×1689px
24LC32AT-E/MC (DFN-8-EP(2x3)) — 24AA32A/24LC32A | PRODUCT IDENTIFICATION SYSTEM (NON-AUTOMOTIVE) | To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. | Device: 24AA32A = 1.7V, 32-Kbit, I2C Serial EEPROM 24AA32AX
24AA32A/24LC32A | PRODUCT IDENTIFICATION SYSTEM (NON-AUTOMOTIVE) | To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. | Device: 24AA32A = 1.7V, 32-Kbit, I2C Serial EEPROM 24AA32AX
P41 · p41_fig01P41
24LC32AT-E/MC (DFN-8-EP(2x3)) — Datasheet Page 41 (p41_fig01)
Datasheet Page 41 (p41_fig01)
P1 · p01_fig02All Packages in PDF
24LC32AT-E/MC (DFN-8-EP(2x3)) — Note 1: 24XX32A is used in this document as a generic part number for the 24AA32A/ 24LC32A devices.
Note 1: 24XX32A is used in this document as a generic part number for the 24AA32A/ 24LC32A devices.

Technical Specifications & Part Details (24LC32AT-E/MC)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:24LC32AT-E/MC (DFN-8-EP(2x3)) is a 8-pin standard electronic & interconnect component featuring a 3.00 × 2.00 × 0.80 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.7V-5.5V supply operation across -40°C to +85°C with integrated I2C interfaces.
Operating Supply VoltageV_CC / V_DD
1.7V-5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
100 kHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 2.00 × 0.80 mm (A1=0.03 mm)
Package family: DFN (DFN-8-EP(2x3))
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
I2C
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol9 auto-grouped pins
OK
IPC-7351B Land Pattern9 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteEPAD 1.75×1.55mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DFN-8-EP(2x3))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.80mm · e=0.50mm
Pad Size (W × L)Level B
0.30 × 0.85 mm
Pins / Total PadsTopology
9P / 9Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
DFN-8-EP(2x3)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — 24LC32AT-E/MC (DFN-8-EP(2x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of 24LC32AT-E/MC (DFN-8-EP(2x3))?

Manufactured by MICROCHIP, the 24LC32AT-E/MC is housed in a DFN-8-EP(2x3) package with 9 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 1.7V-5.5V. Key pins include: 1 (A0: Multiplexed I/O & Peripheral Pin A0 (General)), 2 (A1: Multiplexed I/O & Peripheral Pin A1 (General)), 3 (A2: Multiplexed I/O & Peripheral Pin A2 (General)), 4 (VSS: Ground Reference Pin (VSS)), 5 (SDA: Multiplexed I/O & Peripheral Pin SDA (I2C)), 6 (SCL: Multiplexed I/O & Peripheral Pin SCL (I2C)).

What are the IPC-7351B PCB Footprint dimensions for 24LC32AT-E/MC?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 24LC32AT-E/MC (DFN-8-EP(2x3)) has a nominal body envelope of 2.00 × 3.00 mm, pitch e = 0.50 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 1.75 × 1.55 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 24LC32AT-E/MC?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 24LC32AT-E/MC (MICROCHIP, DFN-8-EP(2x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (9 pins) & 24LC32AT Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1A0Digital_IOSignal terminal A0 (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: A0. Supported peripheral buses: General.
2A1Digital_IOSignal terminal A1 (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: A1. Supported peripheral buses: General.
3A2Digital_IOSignal terminal A2 (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: A2. Supported peripheral buses: General.
4VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
5SDADigital_IOSignal terminal SDA (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: SDA. Supported peripheral buses: I2C.
6SCLDigital_IOSignal terminal SCL (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: SCL. Supported peripheral buses: I2C.
7WPDigital_IOSignal terminal WP (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: WP. Supported peripheral buses: General.
8VCCPower_InPrimary positive power supply input (VCC) operating in the 1.7V-5.5V domain (Max rating: 5.5V).
9EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.