CH2024Q (DFN-10(3x3)) — Symbol, Footprint IPC-7351B & 3D STEP Model

CH2024Q

WCHID: C55509535DFN-10(3x3) · 11 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · CH2024Q (DFN-10(3x3))1IO12IO233V34FB5AGND6BST11GND10VIN9VIN8SW7SWGrid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.212.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
1234567891011E=3.00mm · Pitch e=0.50mmD=3.00mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 3.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (11/11)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1IO1I/OGeneral Purpose Digital I/O Pin IO1
2IO2I/OGeneral Purpose Digital I/O Pin IO2
33V3Power3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4FBI/OMultiplexed I/O & Peripheral Pin FB (General)
5AGNDGNDGround Reference Pin (AGND)
6BSTI/OMultiplexed I/O & Peripheral Pin BST (General)
7SWI/OMultiplexed I/O & Peripheral Pin SW (General)
8SWI/OMultiplexed I/O & Peripheral Pin SW (General)
9VINPowerPower Supply Input (VIN — 3.3V / 5.0V Standard Logic)
10VINPowerPower Supply Input (VIN — 3.3V / 5.0V Standard Logic)
11GNDGNDGround Reference Pin (GND)
PIN 1 IO1
I/O
General Purpose Digital I/O Pin IO1
Design note: 3.3V logic domain (3.6V absolute max), 40mA max drive current.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 5 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: CH2024Q (WCH · DFN-10(3x3))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
CH2024Q (DFN-10(3x3)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
CH2024Q (DFN-10(3x3)) - 2. Standard Pinout (Top View)
True package pinout (11 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
CH2024Q (DFN-10(3x3)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
CH2024Q (DFN-10(3x3)) - 4. Package Dimensions (D×E×A)
DFN-10(3x3) · 3.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
CH2024Q (DFN-10(3x3)) - 5. Recommended Land Pattern
IPC-7351B Footprint (11 Pads)Expand ›
6. Application SchematicSCHEMATIC
CH2024Q (DFN-10(3x3)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (5 figures · Page 1/1)
Showing 1–5 of 5 uncropped original figures for CH2024
P2 · p02_fig01EXACT PACKAGE
CH2024Q (DFN-10(3x3)) — 引脚编号 引脚 名称 类型 功能描述 CH2024K CH2024Q 1 0 GND 电源 电源接地端,峰值电流较大,必须充分连接。
引脚编号 引脚 名称 类型 功能描述 CH2024K CH2024Q 1 0 GND 电源 电源接地端,峰值电流较大,必须充分连接。
P3 · p03_fig011623×964px
CH2024Q (DFN-10(3x3)) — 图5-1 CH2024Q 典型应用方案示意图 CH2024Q
图5-1 CH2024Q 典型应用方案示意图 CH2024Q
P3 · p03_fig01P3
CH2024Q (DFN-10(3x3)) — Datasheet Page 3 (p03_fig01)
Datasheet Page 3 (p03_fig01)
P4 · p04_fig011690×1189px
CH2024Q (DFN-10(3x3)) — 图5-2 Type-C 动态调压示意图 CH2024Q
图5-2 Type-C 动态调压示意图 CH2024Q
P5 · p05_fig011421×666px
CH2024Q (DFN-10(3x3)) — 图5-3 CH2024K 典型应用方案示意图
图5-3 CH2024K 典型应用方案示意图

Technical Specifications & Part Details (CH2024Q)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:CH2024Q (DFN-10(3x3)) is a 10-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 0.85 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated PWM interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
3A
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 3.00 × 0.85 mm (A1=0.03 mm)
Package family: DFN (DFN-10(3x3))
Pin Count & Lead PitchN / e
10 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
PWM
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol11 auto-grouped pins
OK
IPC-7351B Land Pattern11 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteEPAD 2.40×1.70mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DFN-10(3x3))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.00 × 3.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.85mm · e=0.50mm
Pad Size (W × L)Level B
0.28 × 0.67 mm
Pins / Total PadsTopology
11P / 11Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
DFN-10(3x3)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — CH2024Q (DFN-10(3x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of CH2024Q (DFN-10(3x3))?

Manufactured by WCH, the CH2024Q is housed in a DFN-10(3x3) package with 11 pins and a 0.50 mm lead pitch. Key pins include: 1 (IO1: General Purpose Digital I/O Pin IO1), 2 (IO2: General Purpose Digital I/O Pin IO2), 3 (3V3: 3.3V Main Power Supply Rail (3.0V ~ 3.6V)), 4 (FB: Multiplexed I/O & Peripheral Pin FB (General)), 5 (AGND: Ground Reference Pin (AGND)), 6 (BST: Multiplexed I/O & Peripheral Pin BST (General)).

What are the IPC-7351B PCB Footprint dimensions for CH2024Q?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), CH2024Q (DFN-10(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 2.40 × 1.70 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for CH2024Q?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for CH2024Q (WCH, DFN-10(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (11 pins) & CH2024 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1IO1Digital_IOGeneral Purpose Digital I/O Pin IO1
2IO2Digital_IOGeneral Purpose Digital I/O Pin IO2
33V3Power_In3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4FBDigital_IOSignal terminal FB (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: FB. Supported peripheral buses: General.
5AGNDGND0V electrical ground return terminal (AGND) for internal core logic, I/O drivers, and analog sub-blocks.
6BSTDigital_IOSignal terminal BST (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: BST. Supported peripheral buses: General.
7SWDigital_IOSignal terminal SW (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
8SWDigital_IOSignal terminal SW (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
9VINPower_InPrimary positive power supply input (VIN) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
10VINPower_InPrimary positive power supply input (VIN) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
11GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.