CH9441P (QFN-16(3x3)) — Symbol, Footprint IPC-7351B & 3D STEP Model

CH9441P

WCHID: C54300797QFN-16(3x3) · 17 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · CH9441P (QFN-16(3x3))1IO12IO233V34NC5IO26IO37VDD8VBUS9IO417EP16IO1815IO1714CC213CC112IO711IO610IO5Grid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.217.812.77.62.5-2.5-7.6-12.7-17.8mm
2. 2D FOOTPRINT
1234567891011121314151617E=3.00mm · Pitch e=0.50mmD=3.00mm-4-3-2-10123443210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 3.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (17/17)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1IO1I/OGeneral Purpose Digital I/O Pin IO1
2IO2I/OGeneral Purpose Digital I/O Pin IO2
33V3Power3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4NCNCNo Connect (Leave Floating)
5IO2I/OGPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1
6IO3I/OGPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)
7VDDPowerPower Supply Input (VDD — 3.3V / 5.0V Standard Logic)
8VBUSPowerPower Supply Input (VBUS — 3.3V / 5.0V Standard Logic)
9IO4I/OGPIO4 / RTC_GPIO4 / TOUCH4 / ADC1_CH3
10IO5I/OGPIO5 / RTC_GPIO5 / TOUCH5 / ADC1_CH4
11IO6I/OGPIO6 / RTC_GPIO6 / TOUCH6 / ADC1_CH5
12IO7I/OGPIO7 / RTC_GPIO7 / TOUCH7 / ADC1_CH6
13CC1I/OMultiplexed I/O & Peripheral Pin CC1 (General)
14CC2I/OMultiplexed I/O & Peripheral Pin CC2 (General)
15IO17I/OGPIO17 / RTC_GPIO17 / U1TXD / ADC2_CH6
16IO18I/OGPIO18 / RTC_GPIO18 / U1RXD / ADC2_CH7 / CLK_OUT3
17EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 IO1
I/O
General Purpose Digital I/O Pin IO1
Design note: 3.3V logic domain (3.6V absolute max), 40mA max drive current.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 8 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: CH9441P (WCH · QFN-16(3x3))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
CH9441P (QFN-16(3x3)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
CH9441P (QFN-16(3x3)) - 2. Standard Pinout (Top View)
True package pinout (17 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
CH9441P (QFN-16(3x3)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
CH9441P (QFN-16(3x3)) - 4. Package Dimensions (D×E×A)
QFN-16(3x3) · 3.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
CH9441P (QFN-16(3x3)) - 5. Recommended Land Pattern
IPC-7351B Footprint (17 Pads)Expand ›
6. Application SchematicSCHEMATIC
CH9441P (QFN-16(3x3)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)
Showing 1–8 of 8 uncropped original figures for CH9441
P4 · p04_fig02EXACT PACKAGE
CH9441P (QFN-16(3x3)) — V1.11 4
V1.11 4
P7 · p07_fig01EXACT PACKAGE
CH9441P (QFN-16(3x3)) — 8.2. QFN16C_2x2x0.55-0.4
8.2. QFN16C_2x2x0.55-0.4
P7 · p07_fig02EXACT PACKAGE
CH9441P (QFN-16(3x3)) — 8.2. QFN16C_2x2x0.55-0.4
8.2. QFN16C_2x2x0.55-0.4
P1 · p01_fig011557×1370px
CH9441P (QFN-16(3x3)) — V1.11 1
V1.11 1
P2 · p02_fig011748×2082px
CH9441P (QFN-16(3x3)) — V1.11 2
V1.11 2
P4 · p04_fig011001×889px
CH9441P (QFN-16(3x3)) — CH9441 实时检测CC1 和CC2 引脚连接状态和电压,根据Type-C 规范自动切换USB 3.0 模拟开关 选择相应的信号通道。下表是其控制表。
CH9441 实时检测CC1 和CC2 引脚连接状态和电压,根据Type-C 规范自动切换USB 3.0 模拟开关 选择相应的信号通道。下表是其控制表。
P5 · p05_fig011725×2308px
CH9441P (QFN-16(3x3)) — CH9441 支持Type-C 母口正反面自动识别和USB 3.0 信号通道自动切换。P1 为USB Type-C Receptacle,经过CH9441 自动切换处理后,连接P2 或者U2,P2 为USB-B 口或A 口,U2 为USB 3.0 接口芯片、SoC 或MCU,可以是USB Device 或者USB HUB,也可以是USB Host。
CH9441 支持Type-C 母口正反面自动识别和USB 3.0 信号通道自动切换。P1 为USB Type-C Receptacle,经过CH9441 自动切换处理后,连接P2 或者U2,P2 为USB-B 口或A 口,U2 为USB 3.0 接口芯片、SoC 或MCU,可以是USB Device 或者USB HUB,也可以是USB Host。
P5 · p05_fig01P5
CH9441P (QFN-16(3x3)) — Datasheet Page 5 (p05_fig01)
Datasheet Page 5 (p05_fig01)

Technical Specifications & Part Details (CH9441P)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:CH9441P (QFN-16(3x3)) is a 16-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 1.00 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 3.00 × 1.00 mm (A1=0.03 mm)
Package family: QFN (QFN-16(3x3))
Pin Count & Lead PitchN / e
16 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol17 auto-grouped pins
OK
IPC-7351B Land Pattern17 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteEPAD 1.80×1.80mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QFN-16(3x3))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.00 × 3.00 mm
Height (A) & Pitch (e)IPC-7351B
A=1.00mm · e=0.50mm
Pad Size (W × L)Level B
0.28 × 0.75 mm
Pins / Total PadsTopology
17P / 17Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
QFN-16(3x3)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — CH9441P (QFN-16(3x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of CH9441P (QFN-16(3x3))?

Manufactured by WCH, the CH9441P is housed in a QFN-16(3x3) package with 17 pins and a 0.50 mm lead pitch. Key pins include: 1 (IO1: General Purpose Digital I/O Pin IO1), 2 (IO2: General Purpose Digital I/O Pin IO2), 3 (3V3: 3.3V Main Power Supply Rail (3.0V ~ 3.6V)), 4 (NC: No Connect (Leave Floating)), 5 (IO2: GPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1), 6 (IO3: GPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)).

What are the IPC-7351B PCB Footprint dimensions for CH9441P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), CH9441P (QFN-16(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 17 copper pads plus a central exposed thermal pad (EPAD) of 1.80 × 1.80 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for CH9441P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for CH9441P (WCH, QFN-16(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (17 pins) & CH9441 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1IO1Digital_IOGeneral Purpose Digital I/O Pin IO1
2IO2Digital_IOGeneral Purpose Digital I/O Pin IO2
33V3Power_In3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4NCNo_ConnectNo Connect (Leave Floating)
5IO2Digital_IOGPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1
6IO3Digital_IOGPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)
7VDDPower_InPrimary positive power supply input (VDD) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
8VBUSPower_InPrimary positive power supply input (VBUS) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
9IO4Digital_IOGPIO4 / RTC_GPIO4 / TOUCH4 / ADC1_CH3
10IO5Digital_IOGPIO5 / RTC_GPIO5 / TOUCH5 / ADC1_CH4
11IO6Digital_IOGPIO6 / RTC_GPIO6 / TOUCH6 / ADC1_CH5
12IO7Digital_IOGPIO7 / RTC_GPIO7 / TOUCH7 / ADC1_CH6
13CC1Digital_IOSignal terminal CC1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: CC1. Supported peripheral buses: General.
14CC2Digital_IOSignal terminal CC2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: CC2. Supported peripheral buses: General.
15IO17Digital_IOGPIO17 / RTC_GPIO17 / U1TXD / ADC2_CH6
16IO18Digital_IOGPIO18 / RTC_GPIO18 / U1RXD / ADC2_CH7 / CLK_OUT3
17EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.