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EQCO62X20C1-I/8EX (QFN-16(4x4)) — Symbol, Footprint IPC-7351B & 3D STEP Model

EQCO62X20C1-I/8EX

MICROCHIPID: C5339185QFN-16(4x4) · 17 Pins · Pitch 0.50mmIPC TOLERANCE VARIATION5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · EQCO62X20C1-I/8EX (QFN-16(4x4))1GND2SDIp3SDIn4GND5LFI6AmpR7RiseR8NC9GND17EP16VCC15NC14NC13VCC12GND11SDOp10SDOnGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.817.812.77.62.5-2.5-7.6-12.7-17.8mm
2. 2D FOOTPRINT
1234567891011121314151617E=4.00mm · Pitch e=0.50mmD=4.00mm-4-3-2-10123443210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 4.00mm × 4.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (17/17)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1GNDGNDGround Reference Pin (GND)
2SDIpI/OMultiplexed I/O & Peripheral Pin SDIp (General)
3SDInI/OMultiplexed I/O & Peripheral Pin SDIn (General)
4GNDGNDGround Reference Pin (GND)
5LFII/OMultiplexed I/O & Peripheral Pin LFI (General)
6AmpRI/OMultiplexed I/O & Peripheral Pin AmpR (General)
7RiseRI/OMultiplexed I/O & Peripheral Pin RiseR (General)
8NCI/OMultiplexed I/O & Peripheral Pin NC (General)
9GNDGNDGround Reference Pin (GND)
10SDOnI/OMultiplexed I/O & Peripheral Pin SDOn (General)
11SDOpI/OMultiplexed I/O & Peripheral Pin SDOp (General)
12GNDGNDGround Reference Pin (GND)
13VCCPowerPower Supply Input (VCC — 3.3V / 5.0V Standard Logic)
14NCI/OMultiplexed I/O & Peripheral Pin NC (General)
15NCI/OMultiplexed I/O & Peripheral Pin NC (General)
16VCCPowerPower Supply Input (VCC — 3.3V / 5.0V Standard Logic)
17EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 GND
GND
Ground Reference Pin (GND)
Design note: 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 14 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: EQCO62X20C1-I/8EX (MICROCHIP · QFN-16(4x4))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
EQCO62X20C1-I/8EX (QFN-16(4x4)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
EQCO62X20C1-I/8EX (QFN-16(4x4)) - 2. Standard Pinout (Top View)
True package pinout (17 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
EQCO62X20C1-I/8EX (QFN-16(4x4)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
EQCO62X20C1-I/8EX (QFN-16(4x4)) - 4. Package Dimensions (D×E×A)
QFN-16(4x4) · 4.00×4.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
EQCO62X20C1-I/8EX (QFN-16(4x4)) - 5. Recommended Land Pattern
IPC-7351B Footprint (17 Pads)Expand ›
6. Application SchematicSCHEMATIC
EQCO62X20C1-I/8EX (QFN-16(4x4)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (14 figures · Page 1/2)
Showing 1–12 of 14 uncropped original figures for EQCO62X20C1
P1 · p01_fig01377×200px
EQCO62X20C1-I/8EX (QFN-16(4x4)) — EQCO62R20.3 6.25 Gbps Asymmetric Coax Equalizer/ EQCO31R20.3 3.125 Gbps Asymmetric Coax Equalizer
EQCO62R20.3 6.25 Gbps Asymmetric Coax Equalizer/ EQCO31R20.3 3.125 Gbps Asymmetric Coax Equalizer
P5 · p05_fig011390×1007px
EQCO62X20C1-I/8EX (QFN-16(4x4)) — FIGURE 1-2: EQCO62R20.3 PIN DIAGRAM(VIEWED FROM TOP)
FIGURE 1-2: EQCO62R20.3 PIN DIAGRAM(VIEWED FROM TOP)
P5 · p05_fig02256×154px
EQCO62X20C1-I/8EX (QFN-16(4x4)) — FIGURE 1-2: EQCO62R20.3 PIN DIAGRAM(VIEWED FROM TOP)
FIGURE 1-2: EQCO62R20.3 PIN DIAGRAM(VIEWED FROM TOP)
P5 · p05_fig01P5
EQCO62X20C1-I/8EX (QFN-16(4x4)) — Datasheet Page 5 (p05_fig01)
Datasheet Page 5 (p05_fig01)
P9 · p09_fig011669×1074px
EQCO62X20C1-I/8EX (QFN-16(4x4)) — FIGURE 2-1: EQCO62R20.3 TYPICAL APPLICATION CIRCUIT
FIGURE 2-1: EQCO62R20.3 TYPICAL APPLICATION CIRCUIT
P9 · p09_fig01P9
EQCO62X20C1-I/8EX (QFN-16(4x4)) — Datasheet Page 9 (p09_fig01)
Datasheet Page 9 (p09_fig01)
P10 · p10_fig011657×1178px
EQCO62X20C1-I/8EX (QFN-16(4x4)) — FIGURE 2-2: RECOMMENDED PCB LAYOUT FOR EQCO62R20.3
FIGURE 2-2: RECOMMENDED PCB LAYOUT FOR EQCO62R20.3
P18 · p18_fig011664×768px
EQCO62X20C1-I/8EX (QFN-16(4x4)) — 4.1 Package Marking Information
4.1 Package Marking Information
P18 · p18_fig021361×615px
EQCO62X20C1-I/8EX (QFN-16(4x4)) — Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. | 3 e | 3 e
Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. | 3 e | 3 e
P18 · p18_fig01P18
EQCO62X20C1-I/8EX (QFN-16(4x4)) — Datasheet Page 18 (p18_fig01)
Datasheet Page 18 (p18_fig01)
P20 · p20_fig011777×2439px
EQCO62X20C1-I/8EX (QFN-16(4x4)) — DS60001302C-page 20  2012-2018 Microchip Technology Inc. | Microchip Technology Drawing C04-259B Sheet 2 of 2 | For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/pac
DS60001302C-page 20  2012-2018 Microchip Technology Inc. | Microchip Technology Drawing C04-259B Sheet 2 of 2 | For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/pac
P21 · p21_fig011777×2520px
EQCO62X20C1-I/8EX (QFN-16(4x4)) — EQCO62R20.3/EQCO31R20.3
EQCO62R20.3/EQCO31R20.3
Page 1 / 2 (14 extracted figures)

Technical Specifications & Part Details (EQCO62X20C1-I/8EX)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:EQCO62X20C1-I/8EX (QFN-16(4x4)) is a 16-pin standard electronic & interconnect component featuring a 4.00 × 4.00 × 0.90 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C to +85°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2 GHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
4.00 × 4.00 × 0.90 mm (A1=0.03 mm)
Package family: QFN (QFN-16(4x4))
Pin Count & Lead PitchN / e
16 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol17 auto-grouped pins
OK
IPC-7351B Land Pattern17 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteEPAD 2.20×2.20mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QFN-16(4x4))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
4.00 × 4.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.90mm · e=0.50mm
Pad Size (W × L)Level B
0.28 × 0.90 mm
Pins / Total PadsTopology
17P / 17Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
QFN-16(4x4)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — EQCO62X20C1-I/8EX (QFN-16(4x4))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of EQCO62X20C1-I/8EX (QFN-16(4x4))?

Manufactured by MICROCHIP, the EQCO62X20C1-I/8EX is housed in a QFN-16(4x4) package with 17 pins and a 0.50 mm lead pitch. Key pins include: 1 (GND: Ground Reference Pin (GND)), 2 (SDIp: Multiplexed I/O & Peripheral Pin SDIp (General)), 3 (SDIn: Multiplexed I/O & Peripheral Pin SDIn (General)), 4 (GND: Ground Reference Pin (GND)), 5 (LFI: Multiplexed I/O & Peripheral Pin LFI (General)), 6 (AmpR: Multiplexed I/O & Peripheral Pin AmpR (General)).

What are the IPC-7351B PCB Footprint dimensions for EQCO62X20C1-I/8EX?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), EQCO62X20C1-I/8EX (QFN-16(4x4)) has a nominal body envelope of 4.00 × 4.00 mm, pitch e = 0.50 mm, and 17 copper pads plus a central exposed thermal pad (EPAD) of 2.20 × 2.20 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for EQCO62X20C1-I/8EX?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for EQCO62X20C1-I/8EX (MICROCHIP, QFN-16(4x4)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (17 pins) & EQCO62X20C1 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
2SDIpDigital_IOSignal terminal SDIp (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SDIp. Supported peripheral buses: General.
3SDInDigital_IOSignal terminal SDIn (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SDIn. Supported peripheral buses: General.
4GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
5LFIDigital_IOSignal terminal LFI (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LFI. Supported peripheral buses: General.
6AmpRDigital_IOSignal terminal AmpR (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: AmpR. Supported peripheral buses: General.
7RiseRDigital_IOSignal terminal RiseR (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: RiseR. Supported peripheral buses: General.
8NCNCSignal terminal NC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
9GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
10SDOnDigital_IOSignal terminal SDOn (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SDOn. Supported peripheral buses: General.
11SDOpDigital_IOSignal terminal SDOp (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SDOp. Supported peripheral buses: General.
12GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
13VCCPower_InPrimary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
14NCNCSignal terminal NC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
15NCNCSignal terminal NC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
16VCCPower_InPrimary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
17EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.
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