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PIC16LF18877-I/MV (QFN-40-EP(5x5)) — Symbol, Footprint IPC-7351B & 3D STEP Model

PIC16LF18877-I/MV

MICROCHIPID: C510925QFN-40-EP(5x5) · 41 Pins · Pitch 0.40mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · PIC16LF18877-I/MV (QFN-40-EP(5x5))1RC72RD43RD54RD65RD76VSS7VDD8RB09RB110RB211RB312RB413RB514ICSPCLK/RB615ICSPDAT/RB716VPP/MCLR#/RE17RA018RA119RA220RA321RA441EP40RC639RC538RC437RD336RD235RD134RD033RC332RC231RC130RC029RA628RA727VSS26VDD25RE224RE123RE022RA5Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.833.027.922.917.812.77.62.5-2.5-7.6-12.7-17.8-22.9-27.9-33.0mm
2. 2D FOOTPRINT
1234567891011121314151617181920212223242526272829303132333435363738394041E=5.00mm · Pitch e=0.40mmD=5.00mm-5-4-3-2-1012345543210-1-2-3-4-5mm
3. 3D CAD MODEL
Package Body: 5.00mm × 5.00mm · Pitch: 0.40mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (41/41)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1RC7I/OMultiplexed I/O & Peripheral Pin RC7 (General)
2RD4I/OMultiplexed I/O & Peripheral Pin RD4 (General)
3RD5I/OMultiplexed I/O & Peripheral Pin RD5 (General)
4RD6I/OMultiplexed I/O & Peripheral Pin RD6 (General)
5RD7I/OMultiplexed I/O & Peripheral Pin RD7 (General)
6VSSGNDGround Reference Pin (VSS)
7VDDPowerPower Supply Input (VDD — 1.8V to 3.6V)
8RB0I/OMultiplexed I/O & Peripheral Pin RB0 (General)
9RB1I/OMultiplexed I/O & Peripheral Pin RB1 (General)
10RB2I/OMultiplexed I/O & Peripheral Pin RB2 (General)
11RB3I/OMultiplexed I/O & Peripheral Pin RB3 (General)
12RB4I/OMultiplexed I/O & Peripheral Pin RB4 (General)
13RB5I/OMultiplexed I/O & Peripheral Pin RB5 (General)
14ICSPCLK/RB6I/OMultiplexed I/O & Peripheral Pin ICSPCLK/RB6 (General)
15ICSPDAT/RB7I/OMultiplexed I/O & Peripheral Pin ICSPDAT/RB7 (General)
16VPP/MCLR#/RE3I/OMultiplexed I/O & Peripheral Pin VPP/MCLR#/RE3 (General)
17RA0I/OMultiplexed I/O & Peripheral Pin RA0 (General)
18RA1I/OMultiplexed I/O & Peripheral Pin RA1 (General)
19RA2I/OMultiplexed I/O & Peripheral Pin RA2 (General)
20RA3I/OMultiplexed I/O & Peripheral Pin RA3 (General)
21RA4I/OMultiplexed I/O & Peripheral Pin RA4 (General)
22RA5I/OMultiplexed I/O & Peripheral Pin RA5 (General)
23RE0I/OMultiplexed I/O & Peripheral Pin RE0 (General)
24RE1I/OMultiplexed I/O & Peripheral Pin RE1 (General)
25RE2I/OMultiplexed I/O & Peripheral Pin RE2 (General)
26VDDPowerPower Supply Input (VDD — 1.8V to 3.6V)
27VSSGNDGround Reference Pin (VSS)
28RA7I/OMultiplexed I/O & Peripheral Pin RA7 (General)
29RA6I/OMultiplexed I/O & Peripheral Pin RA6 (General)
30RC0I/OMultiplexed I/O & Peripheral Pin RC0 (General)
31RC1I/OMultiplexed I/O & Peripheral Pin RC1 (General)
32RC2I/OMultiplexed I/O & Peripheral Pin RC2 (General)
33RC3I/OMultiplexed I/O & Peripheral Pin RC3 (General)
34RD0I/OMultiplexed I/O & Peripheral Pin RD0 (General)
35RD1I/OMultiplexed I/O & Peripheral Pin RD1 (General)
36RD2I/OMultiplexed I/O & Peripheral Pin RD2 (General)
37RD3I/OMultiplexed I/O & Peripheral Pin RD3 (General)
38RC4I/OMultiplexed I/O & Peripheral Pin RC4 (General)
39RC5I/OMultiplexed I/O & Peripheral Pin RC5 (General)
40RC6I/OMultiplexed I/O & Peripheral Pin RC6 (General)
41EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 RC7
I/O
Multiplexed I/O & Peripheral Pin RC7 (General)
Design note: Signal terminal RC7 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC7. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 3 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: PIC16LF18877-I/MV (MICROCHIP · QFN-40-EP(5x5))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
PIC16LF18877-I/MV (QFN-40-EP(5x5)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
PIC16LF18877-I/MV (QFN-40-EP(5x5)) - 2. Standard Pinout (Top View)
True package pinout (41 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
PIC16LF18877-I/MV (QFN-40-EP(5x5)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
PIC16LF18877-I/MV (QFN-40-EP(5x5)) - 4. Package Dimensions (D×E×A)
QFN-40-EP(5x5) · 5.00×5.00mm · Pitch 0.40mmExpand ›
5. Recommended Land PatternLAND PATTERN
PIC16LF18877-I/MV (QFN-40-EP(5x5)) - 5. Recommended Land Pattern
IPC-7351B Footprint (41 Pads)Expand ›
6. Application SchematicSCHEMATIC
PIC16LF18877-I/MV (QFN-40-EP(5x5)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (3 figures · Page 1/1)
Showing 1–3 of 3 uncropped original figures for PIC16LF18877
P1 · p01_fig01377×200px
PIC16LF18877-I/MV (QFN-40-EP(5x5)) — Full-Featured 28/40-Pin Microcontroller Product Brief
Full-Featured 28/40-Pin Microcontroller Product Brief
P15 · p15_fig011824×2637px
PIC16LF18877-I/MV (QFN-40-EP(5x5)) —  2014 Microchip Technology Inc. Advance Information DS40001768A-page 15 | Trademarks | The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. | SQTP is a service mark
 2014 Microchip Technology Inc. Advance Information DS40001768A-page 15 | Trademarks | The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. | SQTP is a service mark
P16 · p16_fig01452×240px
PIC16LF18877-I/MV (QFN-40-EP(5x5)) — Worldwide Sales and Service
Worldwide Sales and Service

Technical Specifications & Part Details (PIC16LF18877-I/MV)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:PIC16LF18877-I/MV (QFN-40-EP(5x5)) is a 40-pin standard electronic & interconnect component featuring a 5.00 × 5.00 × 0.85 mm mechanical envelope (lead pitch e = 0.40 mm). Rated for 1.8V to 3.6V supply operation across -40°C to 85°C with integrated UART, SPI, I2C, ADC, DAC, PWM interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V to 3.6V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to 85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
32 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
5.00 × 5.00 × 0.85 mm (A1=0.03 mm)
Package family: QFN (QFN-40-EP(5x5))
Pin Count & Lead PitchN / e
40 Pins | Pitch e = 0.40 mm (15.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
UART, SPI, I2C, ADC, DAC, PWM
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol41 auto-grouped pins
OK
IPC-7351B Land Pattern41 pads · Pitch 0.40mm
OK
IPC-7525 60% Solder PasteEPAD 3.70×3.70mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QFN-40-EP(5x5))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
5.00 × 5.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.85mm · e=0.40mm
Pad Size (W × L)Level B
0.22 × 0.80 mm
Pins / Total PadsTopology
41P / 41Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
QFN-40-EP(5x5)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC16LF18877-I/MV (QFN-40-EP(5x5))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC16LF18877-I/MV (QFN-40-EP(5x5))?

Manufactured by MICROCHIP, the PIC16LF18877-I/MV is housed in a QFN-40-EP(5x5) package with 41 pins and a 0.40 mm lead pitch, supporting a VCC supply range of 1.8V to 3.6V. Key pins include: 1 (RC7: Multiplexed I/O & Peripheral Pin RC7 (General)), 2 (RD4: Multiplexed I/O & Peripheral Pin RD4 (General)), 3 (RD5: Multiplexed I/O & Peripheral Pin RD5 (General)), 4 (RD6: Multiplexed I/O & Peripheral Pin RD6 (General)), 5 (RD7: Multiplexed I/O & Peripheral Pin RD7 (General)), 6 (VSS: Ground Reference Pin (VSS)).

What are the IPC-7351B PCB Footprint dimensions for PIC16LF18877-I/MV?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16LF18877-I/MV (QFN-40-EP(5x5)) has a nominal body envelope of 5.00 × 5.00 mm, pitch e = 0.40 mm, and 41 copper pads plus a central exposed thermal pad (EPAD) of 3.70 × 3.70 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16LF18877-I/MV?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16LF18877-I/MV (MICROCHIP, QFN-40-EP(5x5)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (41 pins) & PIC16LF18877 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1RC7Digital_IOSignal terminal RC7 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC7. Supported peripheral buses: General.
2RD4Digital_IOSignal terminal RD4 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RD4. Supported peripheral buses: General.
3RD5Digital_IOSignal terminal RD5 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RD5. Supported peripheral buses: General.
4RD6Digital_IOSignal terminal RD6 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RD6. Supported peripheral buses: General.
5RD7Digital_IOSignal terminal RD7 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RD7. Supported peripheral buses: General.
6VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
7VDDPower_InPrimary positive power supply input (VDD) operating in the 1.8V to 3.6V domain (Max rating: 3.6V).
8RB0Digital_IOSignal terminal RB0 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RB0. Supported peripheral buses: General.
9RB1Digital_IOSignal terminal RB1 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RB1. Supported peripheral buses: General.
10RB2Digital_IOSignal terminal RB2 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RB2. Supported peripheral buses: General.
11RB3Digital_IOSignal terminal RB3 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RB3. Supported peripheral buses: General.
12RB4Digital_IOSignal terminal RB4 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RB4. Supported peripheral buses: General.
13RB5Digital_IOSignal terminal RB5 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RB5. Supported peripheral buses: General.
14ICSPCLK/RB6Digital_IOSignal terminal ICSPCLK/RB6 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: ICSPCLK/RB6. Supported peripheral buses: General.
15ICSPDAT/RB7Digital_IOSignal terminal ICSPDAT/RB7 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: ICSPDAT/RB7. Supported peripheral buses: General.
16VPP/MCLR#/RE3Digital_IOSignal terminal VPP/MCLR#/RE3 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: VPP/MCLR#/RE3. Supported peripheral buses: General.
17RA0Digital_IOSignal terminal RA0 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA0. Supported peripheral buses: General.
18RA1Digital_IOSignal terminal RA1 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA1. Supported peripheral buses: General.
19RA2Digital_IOSignal terminal RA2 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.
20RA3Digital_IOSignal terminal RA3 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA3. Supported peripheral buses: General.
21RA4Digital_IOSignal terminal RA4 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA4. Supported peripheral buses: General.
22RA5Digital_IOSignal terminal RA5 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA5. Supported peripheral buses: General.
23RE0Digital_IOSignal terminal RE0 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RE0. Supported peripheral buses: General.
24RE1Digital_IOSignal terminal RE1 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RE1. Supported peripheral buses: General.
25RE2Digital_IOSignal terminal RE2 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RE2. Supported peripheral buses: General.
26VDDPower_InPrimary positive power supply input (VDD) operating in the 1.8V to 3.6V domain (Max rating: 3.6V).
27VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
28RA7Digital_IOSignal terminal RA7 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA7. Supported peripheral buses: General.
29RA6Digital_IOSignal terminal RA6 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA6. Supported peripheral buses: General.
30RC0Digital_IOSignal terminal RC0 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC0. Supported peripheral buses: General.
31RC1Digital_IOSignal terminal RC1 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC1. Supported peripheral buses: General.
32RC2Digital_IOSignal terminal RC2 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC2. Supported peripheral buses: General.
33RC3Digital_IOSignal terminal RC3 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC3. Supported peripheral buses: General.
34RD0Digital_IOSignal terminal RD0 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RD0. Supported peripheral buses: General.
35RD1Digital_IOSignal terminal RD1 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RD1. Supported peripheral buses: General.
36RD2Digital_IOSignal terminal RD2 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RD2. Supported peripheral buses: General.
37RD3Digital_IOSignal terminal RD3 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RD3. Supported peripheral buses: General.
38RC4Digital_IOSignal terminal RC4 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC4. Supported peripheral buses: General.
39RC5Digital_IOSignal terminal RC5 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC5. Supported peripheral buses: General.
40RC6Digital_IOSignal terminal RC6 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC6. Supported peripheral buses: General.
41EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.
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