MCP1702-3002E/TO (TO-92-3) — Symbol, Footprint IPC-7351B & 3D STEP Model

MCP1702-3002E/TO

MICROCHIPID: C510883TO-92-3 · 3 Pins · Pitch 1.27mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MCP1702-3002E/TO (TO-92-3)1GND2V IN3V OUTGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
123E=4.90mm · Pitch e=1.27mmD=3.70mm-4-3-2-10123443210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 4.90mm × 3.70mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (3/3)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1GNDGNDGround Reference Pin (GND)
2V INI/OMultiplexed I/O & Peripheral Pin V IN (General)
3V OUTI/OMultiplexed I/O & Peripheral Pin V OUT (General)
PIN 1 GND
GND
Ground Reference Pin (GND)
Design note: GroundTerminal
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 11 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MCP1702-3002E/TO (MICROCHIP · TO-92-3)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MCP1702-3002E/TO (TO-92-3) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MCP1702-3002E/TO (TO-92-3) - 2. Standard Pinout (Top View)
True package pinout (3 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MCP1702-3002E/TO (TO-92-3) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MCP1702-3002E/TO (TO-92-3) - 4. Package Dimensions (D×E×A)
TO-92-3 · 4.90×3.70mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
MCP1702-3002E/TO (TO-92-3) - 5. Recommended Land Pattern
IPC-7351B Footprint (3 Pads)Expand ›
6. Application SchematicSCHEMATIC
MCP1702-3002E/TO (TO-92-3) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (11 figures · Page 1/1)
Showing 1–11 of 11 uncropped original figures for MCP1702
P1 · p01_fig02EXACT PACKAGE
MCP1702-3002E/TO (TO-92-3) — Package options include the SOT-23A, SOT-89-3, and TO-92.
Package options include the SOT-23A, SOT-89-3, and TO-92.
P1 · p01_fig01377×200px
MCP1702-3002E/TO (TO-92-3) — 250 mA Low Quiescent Current LDO Regulator
250 mA Low Quiescent Current LDO Regulator
P1 · p01_fig02P1
MCP1702-3002E/TO (TO-92-3) — Datasheet Page 1 (p01_fig02)
Datasheet Page 1 (p01_fig02)
P2 · p02_fig011327×1149px
MCP1702-3002E/TO (TO-92-3) — Functional Block Diagrams
Functional Block Diagrams
P2 · p02_fig021534×479px
MCP1702-3002E/TO (TO-92-3) — Typical Application Circuits
Typical Application Circuits
P14 · p14_fig011777×1406px
MCP1702-3002E/TO (TO-92-3) — 6.2 Power Calculations
6.2 Power Calculations
P14 · p14_fig021777×2074px
MCP1702-3002E/TO (TO-92-3) — TAMAX = Maximum ambient temperature
TAMAX = Maximum ambient temperature
P14 · p14_fig01P14
MCP1702-3002E/TO (TO-92-3) — Datasheet Page 14 (p14_fig01)
Datasheet Page 14 (p14_fig01)
P15 · p15_fig01867×600px
MCP1702-3002E/TO (TO-92-3) — FIGURE 6-2: Using the MCP1702 as a Voltage Reference.
FIGURE 6-2: Using the MCP1702 as a Voltage Reference.
P17 · p17_fig011777×2735px
MCP1702-3002E/TO (TO-92-3) —  2010 Microchip Technology Inc. DS22008E-page 17 | MCP1702 | 7.0 PACKAGING INFORMATION | 7.1 Package Marking Information | 3-Pin SOT-23A | XXNN | Standard | Extended Temp | Symbol Voltage * Symbol Voltage * | HA 1.2 HF 3.0 HB 1.5 HG 3.3 HC
 2010 Microchip Technology Inc. DS22008E-page 17 | MCP1702 | 7.0 PACKAGING INFORMATION | 7.1 Package Marking Information | 3-Pin SOT-23A | XXNN | Standard | Extended Temp | Symbol Voltage * Symbol Voltage * | HA 1.2 HF 3.0 HB 1.5 HG 3.3 HC
P17 · p17_fig01P17
MCP1702-3002E/TO (TO-92-3) — Datasheet Page 17 (p17_fig01)
Datasheet Page 17 (p17_fig01)

Technical Specifications & Part Details (MCP1702-3002E/TO)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:MCP1702-3002E/TO (TO-92-3) is a 3-pin standard electronic & interconnect component featuring a 4.90 × 3.70 × 4.60 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 2.7V to 13.2V supply operation across -40°C to +125°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
2.7V to 13.2V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +125°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
1 kHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
4.90 × 3.70 × 4.60 mm (A1=1.50 mm)
Package family: TO92 (TO-92-3)
Pin Count & Lead PitchN / e
3 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol3 auto-grouped pins
OK
IPC-7351B Land Pattern3 pads · Pitch 1.27mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified
IPC-7351B

Family Variants & Same Datasheet Chips — MCP1702 (2)

Select package variant or sibling MPN sharing this datasheet

Mechanical Dimensions & Land Pattern (TO-92-3)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
4.90 × 3.70 mm
Height (A) & Pitch (e)IPC-7351B
A=4.60mm · e=1.27mm
Pad Size (W × L)Level B
0.95 × 1.55 mm
Pins / Total PadsTopology
3P / 3Pad (THT_TO92)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
TO-92-3
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MCP1702-3002E/TO (TO-92-3)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MCP1702-3002E/TO (TO-92-3)?

Manufactured by MICROCHIP, the MCP1702-3002E/TO is housed in a TO-92-3 package with 3 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 2.7V to 13.2V. Key pins include: 1 (GND: Ground Reference Pin (GND)), 2 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 3 (V OUT: Multiplexed I/O & Peripheral Pin V OUT (General)).

What are the IPC-7351B PCB Footprint dimensions for MCP1702-3002E/TO?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP1702-3002E/TO (TO-92-3) has a nominal body envelope of 3.70 × 4.90 mm, pitch e = 1.27 mm, and 3 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP1702-3002E/TO?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP1702-3002E/TO (MICROCHIP, TO-92-3) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (3 pins) & MCP1702 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
2V INDigital_IOSignal terminal V IN (I/O, 2.7V to 13.2V domain). Multiplexed alternate functions: V IN. Supported peripheral buses: General.
3V OUTDigital_IOSignal terminal V OUT (I/O, 2.7V to 13.2V domain). Multiplexed alternate functions: V OUT. Supported peripheral buses: General.