SMD · 29P
Synchronized Pinout (Symbol / 2D / 3D) (37/37)
Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D| Pin | Symbol | Type | Function (EN) |
|---|---|---|---|
| 1 | GND | GND | Ground Reference Pin (GND) |
| 2 | 3V3 | Power | Power Supply Input (3V3 — 3.3V VDD3P3 (3.0V ~ 3.6V)) |
| 3 | EN | I | System Enable & Hardware Reset (EN) |
| 4 | IO2 | I/O | Multiplexed I/O & Peripheral Pin IO2 (UART, SPI, I2C, ADC, SWD/JTAG) |
| 5 | IO3 | I/O | Multiplexed I/O & Peripheral Pin IO3 (UART, I2C, ADC, SWD/JTAG) |
| 6 | IO0 | I/O | Multiplexed I/O & Peripheral Pin IO0 (UART, RTC/CLK) |
| 7 | IO1 | I/O | Multiplexed I/O & Peripheral Pin IO1 (UART, ADC, RTC/CLK) |
| 8 | IO6 | I/O | Multiplexed I/O & Peripheral Pin IO6 (SPI, ADC) |
| 9 | IO7 | I/O | Multiplexed I/O & Peripheral Pin IO7 (SPI) |
| 10 | IO8 | I/O | Multiplexed I/O & Peripheral Pin IO8 (General) |
| 11 | IO9 | I/O | Multiplexed I/O & Peripheral Pin IO9 (General) |
| 12 | IO10 | I/O | Multiplexed I/O & Peripheral Pin IO10 (SPI) |
| 13 | IO13 | I/O | Multiplexed I/O & Peripheral Pin IO13 (USB) |
| 14 | IO14 | I/O | Multiplexed I/O & Peripheral Pin IO14 (USB) |
| 15 | IO28 | I/O | Multiplexed I/O & Peripheral Pin IO28 (General) |
| 16 | IO5 | I/O | Multiplexed I/O & Peripheral Pin IO5 (UART, SPI, ADC, SWD/JTAG) |
| 17 | IO4 | I/O | Multiplexed I/O & Peripheral Pin IO4 (UART, SPI, ADC, SWD/JTAG) |
| 18 | IO27 | I/O | Multiplexed I/O & Peripheral Pin IO27 (General) |
| 19 | NC/IO15 | I/O | Multiplexed I/O & Peripheral Pin NC/IO15 (SPI) |
| 20 | NC | I/O | Multiplexed I/O & Peripheral Pin NC (General) |
| 21 | IO23 | I/O | Multiplexed I/O & Peripheral Pin IO23 (General) |
| 22 | NC | I/O | Multiplexed I/O & Peripheral Pin NC (General) |
| 23 | IO24 | I/O | Multiplexed I/O & Peripheral Pin IO24 (General) |
| 24 | RX0 | I/O | Multiplexed I/O & Peripheral Pin RX0 (UART) |
| 25 | TX0 | I/O | Multiplexed I/O & Peripheral Pin TX0 (UART) |
| 26 | IO25 | I/O | Multiplexed I/O & Peripheral Pin IO25 (General) |
| 27 | IO26 | I/O | Multiplexed I/O & Peripheral Pin IO26 (General) |
| 28 | GND | GND | Ground Reference Pin (GND) |
| 29 | EPAD | GND | Exposed Thermal & Ground Pad (EPAD) |
| 30 | GND | GND | Ground Reference Pin (GND) |
| 31 | 4 ANT2 | I/O | Multiplexed I/O & Peripheral Pin 4 ANT2 (General) |
| 32 | GND | GND | Ground Reference Pin (GND) |
| 33 | GND | GND | Ground Reference Pin (GND) |
| 34 | GND | GND | Ground Reference Pin (GND) |
| 35 | GND | GND | Ground Reference Pin (GND) |
| 36 | GND | GND | Ground Reference Pin (GND) |
| 37 | GND | GND | Ground Reference Pin (GND) |
PIN 1 GND
GNDGround Reference Pin (GND)
Design note: Ground
IPC-7351B Solder Density & Span C/G/Z Tuner
Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 25 Extracted Figures)
Read the original datasheet PDF directly or click any drawing to view fullscreen1. Realistic 3D PackageREPRESENTATIVE
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
True package pinout (37 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
SMD,27.5x18mm · 18.00×27.50mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
IPC-7351B Footprint (37 Pads)Expand ›
6. Application SchematicSCHEMATIC
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (25 figures · Page 1/3)
Showing 1–12 of 25 uncropped original figures for ESP32-C5-WROOM
P1 · p01_fig01EXACT PACKAGE
P1 · p01_fig02EXACT PACKAGE
P12 · p12_fig01EXACT PACKAGE
P13 · p13_fig01EXACT PACKAGE
P49 · p49_fig02EXACT PACKAGE
P51 · p51_fig01EXACT PACKAGE
P53 · p53_fig01EXACT PACKAGE
P53 · p53_fig02EXACT PACKAGE
P53 · p53_fig03EXACT PACKAGE
P56 · p56_fig01EXACT PACKAGE
P1 · p01_fig03336×313px
P1 · p01_fig01P1
Page 1 / 3 (25 extracted figures)
Technical Specifications & Part Details (ESP32-C5-WROOM-1)
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)Detailed Overview:ESP32-C5-WROOM-1 (SMD,27.5x18mm) is a 37-pin wireless wi-fi / bluetooth le soc module featuring a 27.50 × 18.00 × 3.30 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 3.0 ~ 3.6 V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Wi-Fi, Bluetooth / BLE, USB, UART, SPI, I2C, I2S, ADC, PWM, SDIO, JTAG / SWD, RTC/CLK, SWD/JTAG interfaces.
Operating Supply VoltageV_CC / V_DD
3.0 ~ 3.6 V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
5 GHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_TX(peak) ≈ 310 mA @ 3.3V | Deep-Sleep ≈ 10 µA | I_GPIO(max) = 40 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
27.50 × 18.00 × 3.30 mm (A1=0.00 mm)
Package family: CASTELLATED_MODULE (SMD,27.5x18mm)
Pin Count & Lead PitchN / e
37 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Wi-Fi, Bluetooth / BLE, USB, UART, SPI, I2C, I2S, ADC, PWM, SDIO, JTAG / SWD, RTC/CLK, SWD/JTAG
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Boot Strapping Pin Alert (IO0): Do not force conflicting external pull-ups/pull-downs during POR reset.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.
5-Point Standards Verification
Automated compliance checks prior to exportIEEE-315 Symbol37 auto-grouped pins
IPC-7351B Land Pattern37 pads · Pitch 1.27mm
IPC-7525 60% Solder PasteReflow 1:1 Standard
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
Hardware Verification & Community Engineering Reviews
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet5.00 PCB Verified
IPC-7351B
Select package variant or sibling MPN sharing this datasheetFamily Variants & Same Datasheet Chips — ESP32-C5-WROOM (11)
SMD,27.5x18mm · 29P
29P27.5×18.0×3.30mmP=1.27mm
ESP32-C5-WROOM (SMD,27.5x18mm)
SMD,21.2x18mm · 32P
32P21.2×18.0×3.30mmP=1.27mm
ESP32-C5-WROOM (SMD,21.2x18mm)
SMD,21.2x18mm · 32P
32P21.2×18.0×3.30mmP=1.27mm
ESP32-C5-WROOM (SMD,21.2x18mm)
SMD,21.2x18mm · 32P
32P21.2×18.0×3.30mmP=1.27mm
ESP32-C5-WROOM (SMD,21.2x18mm)
SMD,21.2x18mm · 32P
32P21.2×18.0×3.10mmP=1.27mm
ESP32-C5-WROOM (SMD,21.2x18mm)
SMD,21.2x18mm · 32P
32P21.2×18.0×3.30mmP=1.27mm
ESP32-C5-WROOM (SMD,21.2x18mm)
SMD,27.5x18mm · 37P
37P27.5×18.0×3.30mmP=1.27mm
ESP32-C5-WROOM (SMD,27.5x18mm)
SMD,27.5x18mm · 37P
37P27.5×18.0×3.10mmP=1.27mm
ESP32-C5-WROOM (SMD,27.5x18mm)
SMD,27.5x18mm · 37P
37P27.5×18.0×3.30mmP=1.27mm
ESP32-C5-WROOM (SMD,27.5x18mm)
SMD,27.5x18mm · 37P
37P27.5×18.0×3.30mmP=1.27mm
ESP32-C5-WROOM (SMD,27.5x18mm)
Mechanical Dimensions & Land Pattern (SMD,27.5x18mm)
Extracted from Datasheet & IPC-7351B NormalizedPackage Body (D × E)Nominal
27.50 × 18.00 mm
Height (A) & Pitch (e)IPC-7351B
A=3.30mm · e=1.27mm
Pad Size (W × L)Level B
0.90 × 1.39 mm
Pins / Total PadsTopology
37P / 37Pad (CASTELLATED_MODULE)
Recommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| C1, C2 BOM | 22µF (or 10µF) X5R + 100nF X7R 0805 + 0402 | 3V3 supply decoupling for ~500mA Wi-Fi TX bursts — place closest to 3V3 pin; supply must deliver >= 600mA. |
| R_en + C_en BOM | R = 10kΩ to 3V3 + C = 1µF to GND 0402 / 0603 | Power-On Reset RC delay at EN (CHIP_PU) — 1µF capacitor at EN is REQUIRED for reliable cold boot. |
| R_boot + SW1 BOM | 10kΩ Pull-up + BOOT button 0402 + SMD | Firmware boot-mode strap (IO0 on ESP32/S2/S3, IO9 on ESP32-C3) — on C3 pull IO8 high via 10kΩ for UART/USB download. |
| D_esd BOM | USBLC6-2SC6 / LESD5D5.0CT1G SOT-23-6 / SOD-523 | ESD surge protection on USB D+/D- — place right next to USB Type-C connector before IO18/IO19/IO20. |
| ESP32-S3-MINI-1-N8 / 1U-N4R2 Espressif | 100% Drop-in | Same 15.4×15.4mm 65-pad footprint as ESP32-S2-MINI-2 — verify USB GPIO 19/20 pin mapping. |
Technical Frequently Asked Questions (FAQ) — ESP32-C5-WROOM-1 (SMD,27.5x18mm)
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of ESP32-C5-WROOM-1 (SMD,27.5x18mm)?
Manufactured by ESPRESSIF, the ESP32-C5-WROOM-1 is housed in a SMD,27.5x18mm package with 37 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 3.0 ~ 3.6 V. Key pins include: 1 (GND: Ground Reference Pin (GND)), 2 (3V3: Power Supply Input (3V3 — 3.3V VDD3P3 (3.0V ~ 3.6V))), 3 (EN: System Enable & Hardware Reset (EN)), 4 (IO2: Multiplexed I/O & Peripheral Pin IO2 (UART, SPI, I2C, ADC, SWD/JTAG)), 5 (IO3: Multiplexed I/O & Peripheral Pin IO3 (UART, I2C, ADC, SWD/JTAG)), 6 (IO0: Multiplexed I/O & Peripheral Pin IO0 (UART, RTC/CLK)).
What are the IPC-7351B PCB Footprint dimensions for ESP32-C5-WROOM-1?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), ESP32-C5-WROOM-1 (SMD,27.5x18mm) has a nominal body envelope of 18.00 × 27.50 mm, pitch e = 1.27 mm, and 37 copper pads.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for ESP32-C5-WROOM-1?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for ESP32-C5-WROOM-1 (ESPRESSIF, SMD,27.5x18mm) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (37 pins) & ESP32-C5-WROOM Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 2 | 3V3 | Power_In | Primary positive power supply input (3V3) operating in the 3.3V VDD3P3 (3.0V ~ 3.6V) domain (Max rating: 3.6V). |
| 3 | EN | Digital_IO | Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset. |
| 4 | IO2 | Digital_IO | Signal terminal IO2 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTMS, GPIO2, I2C_SDA, ADC1_CH1, FSPIQ. Supported peripheral buses: UART, SPI, I2C, ADC, SWD/JTAG. |
| 5 | IO3 | Digital_IO | Signal terminal IO3 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTDI, GPIO3, I2C_SCL, ADC1_CH2. Supported peripheral buses: UART, I2C, ADC, SWD/JTAG. |
| 6 | IO0 | Digital_IO | Signal terminal IO0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO0. Supported peripheral buses: UART, RTC/CLK. |
| 7 | IO1 | Digital_IO | Signal terminal IO1 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO1, ADC1_CH0. Supported peripheral buses: UART, ADC, RTC/CLK. |
| 8 | IO6 | Digital_IO | Signal terminal IO6 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO6, ADC1_CH5, FSPICLK. Supported peripheral buses: SPI, ADC. |
| 9 | IO7 | Digital_IO | Signal terminal IO7 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO7, FSPID. Supported peripheral buses: SPI. |
| 10 | IO8 | Digital_IO | Signal terminal IO8 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO8. Supported peripheral buses: General. |
| 11 | IO9 | Digital_IO | Signal terminal IO9 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO9. Supported peripheral buses: General. |
| 12 | IO10 | Digital_IO | Signal terminal IO10 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO10, FSPICS0. Supported peripheral buses: SPI. |
| 13 | IO13 | Digital_IO | Signal terminal IO13 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO13. Supported peripheral buses: USB. |
| 14 | IO14 | Digital_IO | Signal terminal IO14 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO14. Supported peripheral buses: USB. |
| 15 | IO28 | Digital_IO | Signal terminal IO28 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO28. Supported peripheral buses: General. |
| 16 | IO5 | Digital_IO | Signal terminal IO5 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTDO, GPIO5, ADC1_CH4, FSPIWP. Supported peripheral buses: UART, SPI, ADC, SWD/JTAG. |
| 17 | IO4 | Digital_IO | Signal terminal IO4 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTCK, GPIO4, ADC1_CH3, FSPIHD. Supported peripheral buses: UART, SPI, ADC, SWD/JTAG. |
| 18 | IO27 | Digital_IO | Signal terminal IO27 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO27. Supported peripheral buses: General. |
| 19 | NC/IO15 | Digital_IO | Signal terminal NC/IO15 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: SPICS1, GPIO15. Supported peripheral buses: SPI. |
| 20 | NC | NC | Signal terminal NC (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC. Supported peripheral buses: General. |
| 21 | IO23 | Digital_IO | Signal terminal IO23 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO23. Supported peripheral buses: General. |
| 22 | NC | NC | Signal terminal NC (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC. Supported peripheral buses: General. |
| 23 | IO24 | Digital_IO | Signal terminal IO24 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO24. Supported peripheral buses: General. |
| 24 | RX0 | Digital_IO | Signal terminal RX0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: U0RXD, GPIO12. Supported peripheral buses: UART. |
| 25 | TX0 | Digital_IO | Signal terminal TX0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: U0TXD, GPIO11. Supported peripheral buses: UART. |
| 26 | IO25 | Digital_IO | Signal terminal IO25 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO25. Supported peripheral buses: General. |
| 27 | IO26 | Digital_IO | Signal terminal IO26 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO26. Supported peripheral buses: General. |
| 28 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 29 | EPAD | GND | Bottom exposed die attach pad (EPAD) providing primary thermal conduction path to the PCB and low-inductance 0V ground return. |
| 30 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 31 | 4 ANT2 | RF_50Ohm | Signal terminal 4 ANT2 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: 4 ANT2. Supported peripheral buses: General. |
| 32 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 33 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 34 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 35 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 36 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 37 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |