Mechanical Dimensions & Land Pattern (MLF-10(3x3))
Extracted from Datasheet & IPC-7351B NormalizedRecommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit MLF-10(3x3) | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — MIC2214-PMBML (MLF-10(3x3))
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of MIC2214-PMBML (MLF-10(3x3))?
Manufactured by MICROCHIP, the MIC2214-PMBML is housed in a MLF-10(3x3) package with 11 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.25V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.25V to 5.5V)), 2 (EN: System Enable & Hardware Reset (EN)), 3 (CBYP: Multiplexed I/O & Peripheral Pin CBYP (General)), 4 (SW: Multiplexed I/O & Peripheral Pin SW (General)), 5 (SET: Multiplexed I/O & Peripheral Pin SET (General)), 6 (GND: Ground Reference Pin (GND)).
What are the IPC-7351B PCB Footprint dimensions for MIC2214-PMBML?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC2214-PMBML (MLF-10(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 1.70 × 2.40 mm with a 60% IPC-7525 windowed solder paste grid.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC2214-PMBML?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC2214-PMBML (MICROCHIP, MLF-10(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (11 pins) & MIC2214 Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | VIN | Power_In | Primary positive power supply input (VIN) operating in the 2.25V to 5.5V domain (Max rating: 5.5V). |
| 2 | EN | Digital_IO | Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset. |
| 3 | CBYP | Digital_IO | Signal terminal CBYP (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: CBYP. Supported peripheral buses: General. |
| 4 | SW | Open_Drain | Signal terminal SW (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: SW. Supported peripheral buses: General. |
| 5 | SET | Digital_IO | Signal terminal SET (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: SET. Supported peripheral buses: General. |
| 6 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 7 | DRV | Open_Drain | Signal terminal DRV (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: DRV. Supported peripheral buses: General. |
| 8 | POR | Open_Drain | Signal terminal POR (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: POR. Supported peripheral buses: General. |
| 9 | VOUT2 | Power_In | Primary positive power supply input (VOUT2) operating in the 2.25V to 5.5V domain (Max rating: 5.5V). |
| 10 | VOUT1 | Power_In | Primary positive power supply input (VOUT1) operating in the 2.25V to 5.5V domain (Max rating: 5.5V). |
| 11 | EP | GND | Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return. |