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C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP) — Symbol, Footprint IPC-7351B & 3D STEP Model

C3178070

SemiconductorMLF-6_L2.0-W2.0-P0.65-TL-EP · 7 Pins · Pitch 0.65mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP)1VOUT2CSLEW3FAULT#4ENABLE7EP6VIN5GNDGrid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.210.25.10-5.1-10.2mm
2. 2D FOOTPRINT
7654321E=2.00mm · Pitch e=0.65mmD=2.00mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 2.00mm × 2.00mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (7/7)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1VOUTPowerRegulated Power Output (VOUT — 3.3V / 5.0V Standard Logic)
2CSLEWI/OMultiplexed I/O & Peripheral Pin CSLEW (General)
3FAULT#I/OMultiplexed I/O & Peripheral Pin FAULT# (General)
4ENABLEI/OMultiplexed I/O & Peripheral Pin ENABLE (General)
5GNDGNDGround Reference Pin (GND)
6VINPowerPower Supply Input (VIN — 3.3V / 5.0V Standard Logic)
7EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 VOUT
Power
Regulated Power Output (VOUT — 3.3V / 5.0V Standard Logic)
Design note: Regulated power output rail (VOUT) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: C3178070 (Semiconductor · MLF-6_L2.0-W2.0-P0.65-TL-EP)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP) - 2. Standard Pinout (Top View)
True package pinout (7 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP) - 4. Package Dimensions (D×E×A)
MLF-6_L2.0-W2.0-P0.65-TL-EP · 2.00×2.00mm · Pitch 0.65mmExpand ›
5. Recommended Land PatternLAND PATTERN
C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP) - 5. Recommended Land Pattern
IPC-7351B Footprint (7 Pads)Expand ›
6. Application SchematicSCHEMATIC
C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP) - 6. Application Schematic
Typical Application SchematicExpand ›

Technical Specifications & Part Details (C3178070)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP) is a 6-pin standard electronic & interconnect component featuring a 2.00 × 2.00 × 0.75 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.00 × 2.00 × 0.75 mm (A1=0.02 mm)
Package family: OTHER (MLF-6_L2.0-W2.0-P0.65-TL-EP)
Pin Count & Lead PitchN / e
6 Pins | Pitch e = 0.65 mm (25.6 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol7 auto-grouped pins
OK
IPC-7351B Land Pattern7 pads · Pitch 0.65mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MLF-6_L2.0-W2.0-P0.65-TL-EP)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.75mm · e=0.65mm
Pad Size (W × L)Level B
0.30 × 0.60 mm
Pins / Total PadsTopology
7P / 7Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
MLF-6_L2.0-W2.0-P0.65-TL-EP
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP)?

Manufactured by Semiconductor, the C3178070 is housed in a MLF-6_L2.0-W2.0-P0.65-TL-EP package with 7 pins and a 0.65 mm lead pitch. Key pins include: 1 (VOUT: Regulated Power Output (VOUT — 3.3V / 5.0V Standard Logic)), 2 (CSLEW: Multiplexed I/O & Peripheral Pin CSLEW (General)), 3 (FAULT#: Multiplexed I/O & Peripheral Pin FAULT# (General)), 4 (ENABLE: Multiplexed I/O & Peripheral Pin ENABLE (General)), 5 (GND: Ground Reference Pin (GND)), 6 (VIN: Power Supply Input (VIN — 3.3V / 5.0V Standard Logic)).

What are the IPC-7351B PCB Footprint dimensions for C3178070?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), C3178070 (MLF-6_L2.0-W2.0-P0.65-TL-EP) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.65 mm, and 7 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for C3178070?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for C3178070 (Semiconductor, MLF-6_L2.0-W2.0-P0.65-TL-EP) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (7 pins) & C3178070 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1VOUTPower_OutRegulated power output rail (VOUT) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
2CSLEWDigital_IOSignal terminal CSLEW (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: CSLEW. Supported peripheral buses: General.
3FAULT#Digital_IOSignal terminal FAULT# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: FAULT#. Supported peripheral buses: General.
4ENABLEDigital_IOSignal terminal ENABLE (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: ENABLE. Supported peripheral buses: General.
5GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
6VINPower_InPrimary positive power supply input (VIN) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
7EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.
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