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LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) — Symbol, Footprint IPC-7351B & 3D STEP Model

LCKFB-DKX-STM32F103C8T6

LCSC-boardsID: C22396880CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD · 40 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD)1PB122PB133PB144PB155PA86PA97PA108PA119PA1210PA1511PB312PB413PB514PB615PB716PB817PB918+5V19GND20+3.3V40GND39GND38+3.3V37RESET36PB1135PB1034PB133PB032PA731PA630PA529PA428PA327PA226PA125PA024PC1523PC1422PC1321VBATGrid Pitch = 2.54mm (IEEE-315)-20.3-15.2-10.2-5.105.110.215.220.330.525.420.315.210.25.10-5.1-10.2-15.2-20.3-25.4-30.5mm
2. 2D FOOTPRINT
12345678910111213141516171819202122232425262728293031323334353637383940E=53.30mm · Pitch e=0.50mmD=22.90mm-41-39-37-35-33-31-29-27-25-23-21-19-17-15-13-11-9-7-5-3-1135791113151719212325272931333537394126242220181614121086420-2-4-6-8-10-12-14-16-18-20-22-24-26mm
3. 3D CAD MODEL
Package Body: 53.30mm × 22.90mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (40/40)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1PB12I/OMultiplexed I/O & Peripheral Pin PB12 (General)
2PB13I/OMultiplexed I/O & Peripheral Pin PB13 (General)
3PB14I/OMultiplexed I/O & Peripheral Pin PB14 (General)
4PB15I/OMultiplexed I/O & Peripheral Pin PB15 (General)
5PA8I/OMultiplexed I/O & Peripheral Pin PA8 (General)
6PA9I/OMultiplexed I/O & Peripheral Pin PA9 (General)
7PA10I/OMultiplexed I/O & Peripheral Pin PA10 (General)
8PA11I/OMultiplexed I/O & Peripheral Pin PA11 (General)
9PA12I/OMultiplexed I/O & Peripheral Pin PA12 (General)
10PA15I/OMultiplexed I/O & Peripheral Pin PA15 (General)
11PB3I/OMultiplexed I/O & Peripheral Pin PB3 (General)
12PB4I/OMultiplexed I/O & Peripheral Pin PB4 (General)
13PB5I/OMultiplexed I/O & Peripheral Pin PB5 (General)
14PB6I/OMultiplexed I/O & Peripheral Pin PB6 (General)
15PB7I/OMultiplexed I/O & Peripheral Pin PB7 (General)
16PB8I/OMultiplexed I/O & Peripheral Pin PB8 (General)
17PB9I/OMultiplexed I/O & Peripheral Pin PB9 (General)
18+5VPowerPower Supply Input (+5V — 3.3V VDD (Max 4.0V))
19GNDGNDGround Reference Pin (GND)
20+3.3VI/OMultiplexed I/O & Peripheral Pin +3.3V (General)
21VBATPowerPower Supply Input (VBAT — 3.3V VDD (Max 4.0V))
22PC13I/OMultiplexed I/O & Peripheral Pin PC13 (General)
23PC14I/OMultiplexed I/O & Peripheral Pin PC14 (General)
24PC15I/OMultiplexed I/O & Peripheral Pin PC15 (General)
25PA0I/OMultiplexed I/O & Peripheral Pin PA0 (General)
26PA1I/OMultiplexed I/O & Peripheral Pin PA1 (General)
27PA2I/OMultiplexed I/O & Peripheral Pin PA2 (General)
28PA3I/OMultiplexed I/O & Peripheral Pin PA3 (General)
29PA4I/OMultiplexed I/O & Peripheral Pin PA4 (General)
30PA5I/OMultiplexed I/O & Peripheral Pin PA5 (General)
31PA6I/OMultiplexed I/O & Peripheral Pin PA6 (General)
32PA7I/OMultiplexed I/O & Peripheral Pin PA7 (General)
33PB0I/OMultiplexed I/O & Peripheral Pin PB0 (General)
34PB1I/OMultiplexed I/O & Peripheral Pin PB1 (General)
35PB10I/OMultiplexed I/O & Peripheral Pin PB10 (General)
36PB11I/OMultiplexed I/O & Peripheral Pin PB11 (General)
37RESETISystem Enable & Hardware Reset (RESET)
38+3.3VI/OMultiplexed I/O & Peripheral Pin +3.3V (General)
39GNDGNDExposed Thermal & Ground Pad (GND)
40GNDGNDGround Reference Pin (GND)
PIN 1 PB12
I/O
Multiplexed I/O & Peripheral Pin PB12 (General)
Design note: Signal terminal PB12 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB12. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 6 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: LCKFB-DKX-STM32F103C8T6 (LCSC-boards · CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) - 2. Standard Pinout (Top View)
True package pinout (40 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) - 4. Package Dimensions (D×E×A)
CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD · 53.30×22.90mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) - 5. Recommended Land Pattern
IPC-7351B Footprint (40 Pads)Expand ›
6. Application SchematicSCHEMATIC
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (6 figures · Page 1/1)
Showing 1–6 of 6 uncropped original figures for LCKFB
P1 · p01_fig012546×3600px
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) — PDF Figure p01_fig01 (Page 1 — REPRESENTATIVE_PHOTO)
PDF Figure p01_fig01 (Page 1 — REPRESENTATIVE_PHOTO)
P1 · p01_fig01P1
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) — Datasheet Page 1 (p01_fig01)
Datasheet Page 1 (p01_fig01)
P2 · p02_fig012546×3600px
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) — PDF Figure p02_fig01 (Page 2 — REPRESENTATIVE_PHOTO)
PDF Figure p02_fig01 (Page 2 — REPRESENTATIVE_PHOTO)
P6 · p06_fig012546×3600px
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) — PDF Figure p06_fig01 (Page 6 — OTHER_DIAGRAM)
PDF Figure p06_fig01 (Page 6 — OTHER_DIAGRAM)
P7 · p07_fig012546×3600px
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) — PDF Figure p07_fig01 (Page 7 — OTHER_DIAGRAM)
PDF Figure p07_fig01 (Page 7 — OTHER_DIAGRAM)
P8 · p08_fig012546×3600px
LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) — PDF Figure p08_fig01 (Page 8 — OTHER_DIAGRAM)
PDF Figure p08_fig01 (Page 8 — OTHER_DIAGRAM)

Technical Specifications & Part Details (LCKFB-DKX-STM32F103C8T6)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Embedded Microcontroller Unit (MCU)
Detailed Overview:LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) is a 40-pin embedded microcontroller unit (mcu) featuring a 22.86 × 53.34 × 2.00 mm mechanical envelope (lead pitch e = 0.00 mm). Rated for 3.0V ~ 3.6V (Typ 3.3V) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
3.0V ~ 3.6V (Typ 3.3V)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
ARM Cortex-M3 72 MHz (HSE 8 MHz / LSE 32.768 kHz)
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
22.86 × 53.34 × 2.00 mm (A1=0.10 mm)
Package family: OTHER (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD)
Pin Count & Lead PitchN / e
40 Pins
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol40 auto-grouped pins
OK
IPC-7351B Land Pattern40 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified
IPC-7351B

Family Variants & Same Datasheet Chips — LCKFB (2)

Select package variant or sibling MPN sharing this datasheet

Mechanical Dimensions & Land Pattern (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
53.30 × 22.90 mm
Height (A) & Pitch (e)IPC-7351B
A=3.85mm · e=0.50mm
Pad Size (W × L)Level B
0.40 × 0.90 mm
Pins / Total PadsTopology
40P / 40Pad (THT_DIP)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
C1, C2, C3
BOM
3× 100nF (0.1µF) 50V X7R
0402 / 0603
Digital supply decoupling caps for VDD_1..3 (Pins 24, 36, 48) — place < 1.5mm from each VDD pin.
C4
BOM
4.7µF ~ 10µF 10V X5R
0603 / 0805
Bulk decoupling capacitor for main VDD rail — place near 3.3V power entry to the MCU.
C5, C6 + FB1
BOM
100nF + 1µF + Ferrite 600Ω@100MHz
0402 / 0603
Analog rail filter for VDDA/VSSA (Pins 8, 9) 12-bit ADC — isolate digital switching noise.
Y1 + C7, C8
BOM
8MHz Crystal (CL=12pF) + 2× 18pF NP0
SMD-3225 + 0402
Main HSE oscillator crystal (Pin 5 PD0, Pin 6 PD1) — route matched traces < 4mm with GND guard ring.
STM32F103CBT6
STMicroelectronics
100% Drop-in100% Drop-in (128KB Flash Upgrade) — identical LQFP-48 pinout with doubled Flash capacity.
GD32F103C8T6
GigaDevice
Pin-to-Pin LQFP-48 (108MHz)Pin-to-Pin LQFP-48 (108MHz) — higher core clock; verify Flash wait-states & USB timing.
APM32F103C8T6
Geehy
Pin-to-Pin LQFP-48 (96MHz)Pin-to-Pin LQFP-48 (96MHz) — direct hardware replacement, register-compatible with STM32F1.

Technical Frequently Asked Questions (FAQ) — LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD)?

Manufactured by LCSC-boards, the LCKFB-DKX-STM32F103C8T6 is housed in a CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD package with 40 pins and a 0.50 mm lead pitch. Key pins include: 1 (PB12: Multiplexed I/O & Peripheral Pin PB12 (General)), 2 (PB13: Multiplexed I/O & Peripheral Pin PB13 (General)), 3 (PB14: Multiplexed I/O & Peripheral Pin PB14 (General)), 4 (PB15: Multiplexed I/O & Peripheral Pin PB15 (General)), 5 (PA8: Multiplexed I/O & Peripheral Pin PA8 (General)), 6 (PA9: Multiplexed I/O & Peripheral Pin PA9 (General)).

What are the IPC-7351B PCB Footprint dimensions for LCKFB-DKX-STM32F103C8T6?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), LCKFB-DKX-STM32F103C8T6 (CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) has a nominal body envelope of 22.90 × 53.30 mm, pitch e = 0.50 mm, and 40 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for LCKFB-DKX-STM32F103C8T6?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for LCKFB-DKX-STM32F103C8T6 (LCSC-boards, CONN-TH_L53.3-W22.9_STM32F103C8T6-CARD) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (40 pins) & LCKFB Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1PB12Digital_IOSignal terminal PB12 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB12. Supported peripheral buses: General.
2PB13Digital_IOSignal terminal PB13 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB13. Supported peripheral buses: General.
3PB14Digital_IOSignal terminal PB14 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB14. Supported peripheral buses: General.
4PB15Digital_IOSignal terminal PB15 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB15. Supported peripheral buses: General.
5PA8Digital_IOSignal terminal PA8 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA8. Supported peripheral buses: General.
6PA9Digital_IOSignal terminal PA9 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA9. Supported peripheral buses: General.
7PA10Digital_IOSignal terminal PA10 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA10. Supported peripheral buses: General.
8PA11Digital_IOSignal terminal PA11 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA11. Supported peripheral buses: General.
9PA12Digital_IOSignal terminal PA12 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA12. Supported peripheral buses: General.
10PA15Digital_IOSignal terminal PA15 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA15. Supported peripheral buses: General.
11PB3Digital_IOSignal terminal PB3 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB3. Supported peripheral buses: General.
12PB4Digital_IOSignal terminal PB4 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB4. Supported peripheral buses: General.
13PB5Digital_IOSignal terminal PB5 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB5. Supported peripheral buses: General.
14PB6Digital_IOSignal terminal PB6 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB6. Supported peripheral buses: General.
15PB7Digital_IOSignal terminal PB7 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB7. Supported peripheral buses: General.
16PB8Digital_IOSignal terminal PB8 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB8. Supported peripheral buses: General.
17PB9Digital_IOSignal terminal PB9 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB9. Supported peripheral buses: General.
18+5VPower_InPrimary positive power supply input (+5V) operating in the 3.3V VDD (Max 4.0V) domain (Max rating: 4.0V).
19GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
20+3.3VDigital_IOSignal terminal +3.3V (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: +3.3V. Supported peripheral buses: General.
21VBATPower_InPrimary positive power supply input (VBAT) operating in the 3.3V VDD (Max 4.0V) domain (Max rating: 4.0V).
22PC13Digital_IOSignal terminal PC13 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PC13. Supported peripheral buses: General.
23PC14Digital_IOSignal terminal PC14 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PC14. Supported peripheral buses: General.
24PC15Digital_IOSignal terminal PC15 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PC15. Supported peripheral buses: General.
25PA0Digital_IOSignal terminal PA0 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA0. Supported peripheral buses: General.
26PA1Digital_IOSignal terminal PA1 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA1. Supported peripheral buses: General.
27PA2Digital_IOSignal terminal PA2 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA2. Supported peripheral buses: General.
28PA3Digital_IOSignal terminal PA3 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA3. Supported peripheral buses: General.
29PA4Digital_IOSignal terminal PA4 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA4. Supported peripheral buses: General.
30PA5Digital_IOSignal terminal PA5 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA5. Supported peripheral buses: General.
31PA6Digital_IOSignal terminal PA6 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA6. Supported peripheral buses: General.
32PA7Digital_IOSignal terminal PA7 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA7. Supported peripheral buses: General.
33PB0Digital_IOSignal terminal PB0 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB0. Supported peripheral buses: General.
34PB1Digital_IOSignal terminal PB1 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB1. Supported peripheral buses: General.
35PB10Digital_IOSignal terminal PB10 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB10. Supported peripheral buses: General.
36PB11Digital_IOSignal terminal PB11 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB11. Supported peripheral buses: General.
37RESETDigital_IOActive-low hardware reset terminal (RESET): pulling this pin Low resets the processor core and peripherals.
38+3.3VDigital_IOSignal terminal +3.3V (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: +3.3V. Supported peripheral buses: General.
39GNDGNDBottom exposed die attach pad (GND) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.
40GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
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