PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of PIC16LF15313T-I/RF (TDFN-8-EP(3x3))?

Manufactured by MICROCHIP, the PIC16LF15313T-I/RF is housed in a TDFN-8-EP(3x3) package with 9 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 1.8V to 3.6V. Key pins include: 1 (VDD: Power Supply Input (VDD — 1.8V to 3.6V)), 2 (RA5: Multiplexed I/O & Peripheral Pin RA5 (General)), 3 (RA4: Multiplexed I/O & Peripheral Pin RA4 (General)), 4 (VPP/#MCLR/RA3: Multiplexed I/O & Peripheral Pin VPP/#MCLR/RA3 (General)), 5 (RA2: Multiplexed I/O & Peripheral Pin RA2 (General)), 6 (RA1/ICSPCLK: Multiplexed I/O & Peripheral Pin RA1/ICSPCLK (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for PIC16LF15313T-I/RF?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.65 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 2.40 × 1.60 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16LF15313T-I/RF?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16LF15313T-I/RF (MICROCHIP, TDFN-8-EP(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 3.00mm × 3.00mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (9/9)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	VDD	Power	Power Supply Input (VDD — 1.8V to 3.6V)
2	RA5	I/O	Multiplexed I/O & Peripheral Pin RA5 (General)
3	RA4	I/O	Multiplexed I/O & Peripheral Pin RA4 (General)
4	VPP/#MCLR/RA3	I/O	Multiplexed I/O & Peripheral Pin VPP/#MCLR/RA3 (General)
5	RA2	I/O	Multiplexed I/O & Peripheral Pin RA2 (General)
6	RA1/ICSPCLK	I/O	Multiplexed I/O & Peripheral Pin RA1/ICSPCLK (General)
7	RA0/ICSPDAT	I/O	Multiplexed I/O & Peripheral Pin RA0/ICSPDAT (General)
8	VSS	GND	Ground Reference Pin (VSS)
9	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 VDD

Power

Power Supply Input (VDD — 1.8V to 3.6V)

Design note: VDD

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 17 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) - 2. Standard Pinout (Top View)

True package pinout (9 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) - 4. Package Dimensions (D×E×A)

TDFN-8-EP(3x3) · 3.00×3.00mm · Pitch 0.65mmExpand ›

5. Recommended Land PatternLAND PATTERN

PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) - 5. Recommended Land Pattern

IPC-7351B Footprint (9 Pads)Expand ›

6. Application SchematicSCHEMATIC

PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (17 figures · Page 1/2)

Showing 1–12 of 17 uncropped original figures for PIC16LF15313

P22 · p22_fig011777×1126px

FIGURE 2-1: RECOMMENDED MINIMUM CONNECTIONS

P141 · p141_fig011777×951px

FIGURE 11-2: WAKE-UP FROM SLEEP THROUGH INTERRUPT

P371 · p371_fig01867×587px

FIGURE 32-11: I2C MASTER/ SLAVE CONNECTION

P445 · p445_fig01890×737px

FIGURE 35-2: PICkit™ PROGRAMMER STYLE CONNECTOR INTERFACE

P445 · p445_fig021068×718px

FIGURE 35-3: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING

P445 · p445_fig02P445

Datasheet Page 445 (p445_fig02)

P513 · p513_fig01530×494px

8-Lead SOIC (3.90 mm) Example

P513 · p513_fig02529×495px

8-Lead SOIC (3.90 mm) Example

P513 · p513_fig03394×311px

8-Lead UDFN (3x3x0.5 mm) Example

P513 · p513_fig04596×326px

8-Lead UDFN (3x3x0.5 mm) Example

P513 · p513_fig051366×579px

PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) — 3 e

3 e

P513 · p513_fig061777×834px

NNN YYWW

Page 1 / 2 (17 extracted figures)

Technical Specifications & Part Details (PIC16LF15313T-I/RF)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) is a 8-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 0.80 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 1.8V to 3.6V supply operation across -40°C to 85°C with integrated UART, SPI, I2C, ADC, DAC, PWM interfaces.

Operating Supply VoltageV_CC / V_DD

1.8V to 3.6V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to 85°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

32 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

3.00 × 3.00 × 0.80 mm (A1=0.03 mm)

Package family: DFN (TDFN-8-EP(3x3))

Pin Count & Lead PitchN / e

8 Pins | Pitch e = 0.65 mm (25.6 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

UART, SPI, I2C, ADC, DAC, PWM

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol9 auto-grouped pins

IPC-7351B Land Pattern9 pads · Pitch 0.65mm

IPC-7525 60% Solder PasteEPAD 2.40×1.60mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (TDFN-8-EP(3x3))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

3.00 × 3.00 mm

Height (A) & Pitch (e)IPC-7351B

A=0.80mm · e=0.65mm

Pad Size (W × L)Level B

0.35 × 0.84 mm

Pins / Total PadsTopology

9P / 9Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit TDFN-8-EP(3x3)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC16LF15313T-I/RF (TDFN-8-EP(3x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC16LF15313T-I/RF (TDFN-8-EP(3x3))?

Manufactured by MICROCHIP, the PIC16LF15313T-I/RF is housed in a TDFN-8-EP(3x3) package with 9 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 1.8V to 3.6V. Key pins include: 1 (VDD: Power Supply Input (VDD — 1.8V to 3.6V)), 2 (RA5: Multiplexed I/O & Peripheral Pin RA5 (General)), 3 (RA4: Multiplexed I/O & Peripheral Pin RA4 (General)), 4 (VPP/#MCLR/RA3: Multiplexed I/O & Peripheral Pin VPP/#MCLR/RA3 (General)), 5 (RA2: Multiplexed I/O & Peripheral Pin RA2 (General)), 6 (RA1/ICSPCLK: Multiplexed I/O & Peripheral Pin RA1/ICSPCLK (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC16LF15313T-I/RF?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.65 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 2.40 × 1.60 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16LF15313T-I/RF?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16LF15313T-I/RF (MICROCHIP, TDFN-8-EP(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (9 pins) & PIC16LF15313 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	VDD	Power_In	Primary positive power supply input (VDD) operating in the 1.8V to 3.6V domain (Max rating: 3.6V).
2	RA5	Digital_IO	Signal terminal RA5 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA5. Supported peripheral buses: General.
3	RA4	Digital_IO	Signal terminal RA4 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA4. Supported peripheral buses: General.
4	VPP/#MCLR/RA3	Digital_IO	Signal terminal VPP/#MCLR/RA3 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: VPP/#MCLR/RA3. Supported peripheral buses: General.
5	RA2	Digital_IO	Signal terminal RA2 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.
6	RA1/ICSPCLK	Digital_IO	Signal terminal RA1/ICSPCLK (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA1/ICSPCLK. Supported peripheral buses: General.
7	RA0/ICSPDAT	Digital_IO	Signal terminal RA0/ICSPDAT (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA0/ICSPDAT. Supported peripheral buses: General.
8	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
9	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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