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MIC5239-1.8YS (SOT-223) — Symbol, Footprint IPC-7351B & 3D STEP Model

MIC5239-1.8YS

MICROCHIPID: C219095SOT-223 · 4 Pins · Pitch 2.30mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MIC5239-1.8YS (SOT-223)1IN2GND4GND3OUTGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
1234E=6.50mm · Pitch e=2.30mmD=3.50mm-5-4-3-2-10123456543210-1-2-3-4-5-6mm
3. 3D CAD MODEL
Package Body: 6.50mm × 3.50mm · Pitch: 2.30mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (4/4)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1INI/OMultiplexed I/O & Peripheral Pin IN (General)
2GNDGNDGround Reference Pin (GND)
3OUTI/OMultiplexed I/O & Peripheral Pin OUT (General)
4GNDGNDGround Reference Pin (GND)
PIN 1 IN
I/O
Multiplexed I/O & Peripheral Pin IN (General)
Design note: PowerSupplyInput .
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 13 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MIC5239-1.8YS (MICROCHIP · SOT-223)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MIC5239-1.8YS (SOT-223) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MIC5239-1.8YS (SOT-223) - 2. Standard Pinout (Top View)
True package pinout (4 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MIC5239-1.8YS (SOT-223) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MIC5239-1.8YS (SOT-223) - 4. Package Dimensions (D×E×A)
SOT-223 · 6.50×3.50mm · Pitch 2.30mmExpand ›
5. Recommended Land PatternLAND PATTERN
MIC5239-1.8YS (SOT-223) - 5. Recommended Land Pattern
IPC-7351B Footprint (4 Pads)Expand ›
6. Application SchematicSCHEMATIC
MIC5239-1.8YS (SOT-223) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (13 figures · Page 1/2)
Showing 1–12 of 13 uncropped original figures for MIC5239
P3 · p03_fig01EXACT PACKAGE
MIC5239-1.8YS (SOT-223) — SOIC-8 (M) SOT-223 (S) SOIC-8 (M) MSOP-8(MM) MSOP-8(MM) (Fixed) (Adj) Pin Description
SOIC-8 (M) SOT-223 (S) SOIC-8 (M) MSOP-8(MM) MSOP-8(MM) (Fixed) (Adj) Pin Description
P3 · p03_fig02EXACT PACKAGE
MIC5239-1.8YS (SOT-223) — Pin Configuration
Pin Configuration
P3 · p03_fig03EXACT PACKAGE
MIC5239-1.8YS (SOT-223) — SOIC-8 (M) SOT-223 (S) SOIC-8 (M) MSOP-8(MM) MSOP-8(MM) (Fixed) (Adj) Pin Description
SOIC-8 (M) SOT-223 (S) SOIC-8 (M) MSOP-8(MM) MSOP-8(MM) (Fixed) (Adj) Pin Description
P13 · p13_fig02EXACT PACKAGE
MIC5239-1.8YS (SOT-223) — SOT-223 (S)
SOT-223 (S)
P1 · p01_fig01609×618px
MIC5239-1.8YS (SOT-223) — 40 | 35 | 30 | 25 | 20 | 15 | 10 9 14 19 24 29 4 | IOUT = 1mA | IOUT = 10µA | IOUT = 100µA | Ground Current vs. Input Voltage
40 | 35 | 30 | 25 | 20 | 15 | 10 9 14 19 24 29 4 | IOUT = 1mA | IOUT = 10µA | IOUT = 100µA | Ground Current vs. Input Voltage
P1 · p01_fig02390×391px
MIC5239-1.8YS (SOT-223) — 10 9 14 19 24 29 4
10 9 14 19 24 29 4
P1 · p01_fig03787×435px
MIC5239-1.8YS (SOT-223) — IGND = 23µA | VOUT 3.0V/100µA VIN 30V IN | MIC5239 | EN | OUT | GND | FLG | Regulator with Low IO and Low IQ
IGND = 23µA | VOUT 3.0V/100µA VIN 30V IN | MIC5239 | EN | OUT | GND | FLG | Regulator with Low IO and Low IQ
P3 · p03_fig02P3
MIC5239-1.8YS (SOT-223) — Datasheet Page 3 (p03_fig02)
Datasheet Page 3 (p03_fig02)
P9 · p09_fig01614×623px
MIC5239-1.8YS (SOT-223) — Figure 2. Output Capacitor ESR
Figure 2. Output Capacitor ESR
P9 · p09_fig02853×482px
MIC5239-1.8YS (SOT-223) — Figure 1. Remote Enable
Figure 1. Remote Enable
P9 · p09_fig02P9
MIC5239-1.8YS (SOT-223) — Datasheet Page 9 (p09_fig02)
Datasheet Page 9 (p09_fig02)
P13 · p13_fig02P13
MIC5239-1.8YS (SOT-223) — Datasheet Page 13 (p13_fig02)
Datasheet Page 13 (p13_fig02)
Page 1 / 2 (13 extracted figures)

Technical Specifications & Part Details (MIC5239-1.8YS)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Low-Dropout Linear Voltage Regulator (LDO)
Detailed Overview:MIC5239-1.8YS (SOT-223) is a 4-pin low-dropout linear voltage regulator (ldo) featuring a 6.50 × 3.50 × 1.60 mm mechanical envelope (lead pitch e = 2.30 mm). Rated for 2.3V to 30V supply operation across 40°C to +125°C with integrated USB interfaces.
Operating Supply VoltageV_CC / V_DD
2.3V to 30V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to +125°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
100kHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
500mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
6.50 × 3.50 × 1.60 mm (A1=0.06 mm)
Package family: SOT223 (SOT-223)
Pin Count & Lead PitchN / e
4 Pins | Pitch e = 2.30 mm (90.6 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
USB
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol4 auto-grouped pins
OK
IPC-7351B Land Pattern4 pads · Pitch 2.30mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOT-223)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
6.50 × 3.50 mm
Height (A) & Pitch (e)IPC-7351B
A=1.60mm · e=2.30mm
Pad Size (W × L)Level B
0.95 × 2.00 mm
Pins / Total PadsTopology
4P / 4Pad (SOT_TAB)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOT-223
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC5239-1.8YS (SOT-223)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC5239-1.8YS (SOT-223)?

Manufactured by MICROCHIP, the MIC5239-1.8YS is housed in a SOT-223 package with 4 pins and a 2.30 mm lead pitch, supporting a VCC supply range of 2.3V to 30V. Key pins include: 1 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 2 (GND: Ground Reference Pin (GND)), 3 (OUT: Multiplexed I/O & Peripheral Pin OUT (General)), 4 (GND: Ground Reference Pin (GND)).

What are the IPC-7351B PCB Footprint dimensions for MIC5239-1.8YS?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5239-1.8YS (SOT-223) has a nominal body envelope of 3.50 × 6.50 mm, pitch e = 2.30 mm, and 4 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5239-1.8YS?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5239-1.8YS (MICROCHIP, SOT-223) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (4 pins) & MIC5239 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1INDigital_IOSignal terminal IN (I/O, 2.3V to 30V domain). Multiplexed alternate functions: IN. Supported peripheral buses: General.
2GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
3OUTDigital_IOSignal terminal OUT (I/O, 2.3V to 30V domain). Multiplexed alternate functions: OUT. Supported peripheral buses: General.
4GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
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