SOIC-8 · 8P
Synchronized Pinout (Symbol / 2D / 3D) (9/9)
Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D| Pin | Symbol | Type | Function (EN) |
|---|---|---|---|
| 1 | A0 | I/O | Multiplexed I/O & Peripheral Pin A0 (General) |
| 2 | A1 | I/O | Multiplexed I/O & Peripheral Pin A1 (General) |
| 3 | A2 | I/O | Multiplexed I/O & Peripheral Pin A2 (General) |
| 4 | VSS | GND | Ground Reference Pin (VSS) |
| 5 | SDA | I/O | Multiplexed I/O & Peripheral Pin SDA (I2C) |
| 6 | SCL | I/O | Multiplexed I/O & Peripheral Pin SCL (I2C) |
| 7 | WP | I/O | Multiplexed I/O & Peripheral Pin WP (General) |
| 8 | VCC | Power | Power Supply Input (VCC — 1.7V-5.5V) |
| 9 | EP | GND | Exposed Thermal & Ground Pad (EP) |
PIN 1 A0
I/OMultiplexed I/O & Peripheral Pin A0 (General)
Design note: ChipAddressInput
IPC-7351B Solder Density & Span C/G/Z Tuner
Extracted Drawings Gallery (6 Standard Drawings + 17 Extracted Figures)
Read the original datasheet PDF directly or click any drawing to view fullscreen1. Realistic 3D PackageREPRESENTATIVE
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
True package pinout (9 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
TDFN-8-EP(2x3) · 2.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
IPC-7351B Footprint (9 Pads)Expand ›
6. Application SchematicSCHEMATIC
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (17 figures · Page 1/2)
Showing 1–12 of 17 uncropped original figures for 34AA02T
P1 · p01_fig01376×200px
P1 · p01_fig02587×578px
P1 · p01_fig03525×458px
P1 · p01_fig04518×422px
P1 · p01_fig04P1
P2 · p02_fig01867×955px
P20 · p20_fig011076×1145px
P23 · p23_fig011727×2192px
P24 · p24_fig011712×2178px
P24 · p24_fig01P24
P25 · p25_fig011727×2183px
P31 · p31_fig011719×2187px
Page 1 / 2 (17 extracted figures)
Technical Specifications & Part Details (34AA02T-I/MNY)
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)Detailed Overview:34AA02T-I/MNY (TDFN-8-EP(2x3)) is a 8-pin standard electronic & interconnect component featuring a 3.00 × 2.00 × 0.80 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.7V-5.5V supply operation across -40°C to +85°C with integrated I2C interfaces.
Operating Supply VoltageV_CC / V_DD
1.7V-5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
100 kHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 2.00 × 0.80 mm (A1=0.03 mm)
Package family: DFN (TDFN-8-EP(2x3))
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
I2C
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.
5-Point Standards Verification
Automated compliance checks prior to exportIEEE-315 Symbol9 auto-grouped pins
IPC-7351B Land Pattern9 pads · Pitch 0.50mm
IPC-7525 60% Solder PasteEPAD 1.50×1.50mm windowed grid
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
Hardware Verification & Community Engineering Reviews
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet5.00 PCB Verified
IPC-7351B
Select package variant or sibling MPN sharing this datasheetFamily Variants & Same Datasheet Chips — 34AA02T (2)
TDFN-8-EP(2x3) · 9P
Mechanical Dimensions & Land Pattern (TDFN-8-EP(2x3))
Extracted from Datasheet & IPC-7351B NormalizedPackage Body (D × E)Nominal
3.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.80mm · e=0.50mm
Pad Size (W × L)Level B
0.30 × 0.75 mm
Pins / Total PadsTopology
9P / 9Pad (DUAL_ROW)
Recommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit TDFN-8-EP(2x3) | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — 34AA02T-I/MNY (TDFN-8-EP(2x3))
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of 34AA02T-I/MNY (TDFN-8-EP(2x3))?
Manufactured by MICROCHIP, the 34AA02T-I/MNY is housed in a TDFN-8-EP(2x3) package with 9 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 1.7V-5.5V. Key pins include: 1 (A0: Multiplexed I/O & Peripheral Pin A0 (General)), 2 (A1: Multiplexed I/O & Peripheral Pin A1 (General)), 3 (A2: Multiplexed I/O & Peripheral Pin A2 (General)), 4 (VSS: Ground Reference Pin (VSS)), 5 (SDA: Multiplexed I/O & Peripheral Pin SDA (I2C)), 6 (SCL: Multiplexed I/O & Peripheral Pin SCL (I2C)).
What are the IPC-7351B PCB Footprint dimensions for 34AA02T-I/MNY?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 34AA02T-I/MNY (TDFN-8-EP(2x3)) has a nominal body envelope of 2.00 × 3.00 mm, pitch e = 0.50 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 1.50 × 1.50 mm with a 60% IPC-7525 windowed solder paste grid.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 34AA02T-I/MNY?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 34AA02T-I/MNY (MICROCHIP, TDFN-8-EP(2x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (9 pins) & 34AA02T Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | A0 | Digital_IO | Signal terminal A0 (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: A0. Supported peripheral buses: General. |
| 2 | A1 | Digital_IO | Signal terminal A1 (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: A1. Supported peripheral buses: General. |
| 3 | A2 | Digital_IO | Signal terminal A2 (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: A2. Supported peripheral buses: General. |
| 4 | VSS | GND | 0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks. |
| 5 | SDA | Digital_IO | Signal terminal SDA (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: SDA. Supported peripheral buses: I2C. |
| 6 | SCL | Digital_IO | Signal terminal SCL (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: SCL. Supported peripheral buses: I2C. |
| 7 | WP | Digital_IO | Signal terminal WP (I/O, 1.7V-5.5V domain). Multiplexed alternate functions: WP. Supported peripheral buses: General. |
| 8 | VCC | Power_In | Primary positive power supply input (VCC) operating in the 1.7V-5.5V domain (Max rating: 5.5V). |
| 9 | EP | GND | Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return. |