Mechanical Dimensions & Land Pattern (MLF-8(2x2))
Extracted from Datasheet & IPC-7351B NormalizedRecommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit MLF-8(2x2) | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — SY89250VMI-TR (MLF-8(2x2))
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of SY89250VMI-TR (MLF-8(2x2))?
Manufactured by MICROCHIP, the SY89250VMI-TR is housed in a MLF-8(2x2) package with 9 pins and a 0.50 mm lead pitch. Key pins include: 1 (/Q: Multiplexed I/O & Peripheral Pin /Q (General)), 2 (D: Multiplexed I/O & Peripheral Pin D (General)), 3 (VBB: Multiplexed I/O & Peripheral Pin VBB (General)), 4 (/EN: Multiplexed I/O & Peripheral Pin /EN (General)), 5 (VEE , ExposedPad: Multiplexed I/O & Peripheral Pin VEE , ExposedPad (General)), 6 (/QHG QHG ,: Multiplexed I/O & Peripheral Pin /QHG QHG , (General)).
What are the IPC-7351B PCB Footprint dimensions for SY89250VMI-TR?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), SY89250VMI-TR (MLF-8(2x2)) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.50 mm, and 9 copper pads.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for SY89250VMI-TR?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for SY89250VMI-TR (MICROCHIP, MLF-8(2x2)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (9 pins) & SY89250 Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | /Q | Digital_IO | Signal terminal /Q (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: /Q. Supported peripheral buses: General. |
| 2 | D | Digital_IO | Signal terminal D (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: D. Supported peripheral buses: General. |
| 3 | VBB | Digital_IO | Signal terminal VBB (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VBB. Supported peripheral buses: General. |
| 4 | /EN | Digital_IO | Signal terminal /EN (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: /EN. Supported peripheral buses: General. |
| 5 | VEE , ExposedPad | Digital_IO | Signal terminal VEE , ExposedPad (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VEE , ExposedPad. Supported peripheral buses: General. |
| 6 | /QHG QHG , | Digital_IO | Signal terminal /QHG QHG , (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: /QHG QHG ,. Supported peripheral buses: General. |
| 7 | /QHG QHG , | Digital_IO | Signal terminal /QHG QHG , (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: /QHG QHG ,. Supported peripheral buses: General. |
| 8 | VCC | Power_In | Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V). |
| 9 | EP | GND | Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return. |







