MIC2212-GKBML-TR (MLF-10(3x3)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC2212-GKBML-TR (MLF-10(3x3))?

Manufactured by MICROCHIP, the MIC2212-GKBML-TR is housed in a MLF-10(3x3) package with 11 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.25V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.25V to 5.5V)), 2 (EN1: Multiplexed I/O & Peripheral Pin EN1 (General)), 3 (EN2: Multiplexed I/O & Peripheral Pin EN2 (General)), 4 (CBYP: Multiplexed I/O & Peripheral Pin CBYP (General)), 5 (SET: Multiplexed I/O & Peripheral Pin SET (General)), 6 (GND: Ground Reference Pin (GND)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC2212-GKBML-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC2212-GKBML-TR (MLF-10(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 1.70 × 2.40 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC2212-GKBML-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC2212-GKBML-TR (MICROCHIP, MLF-10(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 3.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (11/11)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	VIN	Power	Power Supply Input (VIN — 2.25V to 5.5V)
2	EN1	I/O	Multiplexed I/O & Peripheral Pin EN1 (General)
3	EN2	I/O	Multiplexed I/O & Peripheral Pin EN2 (General)
4	CBYP	I/O	Multiplexed I/O & Peripheral Pin CBYP (General)
5	SET	I/O	Multiplexed I/O & Peripheral Pin SET (General)
6	GND	GND	Ground Reference Pin (GND)
7	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
8	POR	I/O	Multiplexed I/O & Peripheral Pin POR (General)
9	VOUT2	Power	Power Supply Input (VOUT2 — 2.25V to 5.5V)
10	VOUT1	Power	Power Supply Input (VOUT1 — 2.25V to 5.5V)
11	GND	GND	Ground Reference Pin (GND)

PIN 1 VIN

Power

Power Supply Input (VIN — 2.25V to 5.5V)

Design note: SupplyInput: (VIN1andVIN2areinternallytiedtogether) .

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 8 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC2212-GKBML-TR (MLF-10(3x3)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC2212-GKBML-TR (MLF-10(3x3)) - 2. Standard Pinout (Top View)

True package pinout (11 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC2212-GKBML-TR (MLF-10(3x3)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC2212-GKBML-TR (MLF-10(3x3)) - 4. Package Dimensions (D×E×A)

MLF-10(3x3) · 3.00×3.00mm · Pitch 0.50mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC2212-GKBML-TR (MLF-10(3x3)) - 5. Recommended Land Pattern

IPC-7351B Footprint (11 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC2212-GKBML-TR (MLF-10(3x3)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)

Showing 1–8 of 8 uncropped original figures for MIC2212

P3 · p03_fig01EXACT PACKAGE

Pin Number Pin Name Pin Function MLF-10 (3x3)

P10 · p10_fig01EXACT PACKAGE

10-Pin 3mm x 3mm MLF (ML)

P1 · p01_fig011158×765px

Typical Application

P1 · p01_fig01P1

Datasheet Page 1 (p01_fig01)

P8 · p08_fig01842×1479px

MIC2212-GKBML-TR (MLF-10(3x3)) — Enable Characteristics | Time (100µs/div) | VEN | (2V/div) | VOUT1 | (2V/div) | VOUT2 | (1V/div) | CIN = 1µF COUT = 1µF Ceramic CBYP = 0.01µF VIN = 3.8V | Load Transient Response (LDO 1) | Time (4µs/div) | IOUT1 | (100mA/div) VOUT1 | (50mV/

P8 · p08_fig02774×699px

Load Transient Response (LDO 2)

P8 · p08_fig03770×699px

P10 · p10_fig01P10

Datasheet Page 10 (p10_fig01)

Technical Specifications & Part Details (MIC2212-GKBML-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC2212-GKBML-TR (MLF-10(3x3)) is a 10-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 1.00 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 2.25V to 5.5V supply operation across -40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

2.25V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

1kHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

48µA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

3.00 × 3.00 × 1.00 mm (A1=0.02 mm)

Package family: OTHER (MLF-10(3x3))

Pin Count & Lead PitchN / e

10 Pins | Pitch e = 0.50 mm (19.7 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol11 auto-grouped pins

IPC-7351B Land Pattern11 pads · Pitch 0.50mm

IPC-7525 60% Solder PasteEPAD 1.70×2.40mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MLF-10(3x3))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

3.00 × 3.00 mm

Height (A) & Pitch (e)IPC-7351B

A=1.00mm · e=0.50mm

Pad Size (W × L)Level B

0.28 × 0.79 mm

Pins / Total PadsTopology

11P / 11Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit MLF-10(3x3)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC2212-GKBML-TR (MLF-10(3x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC2212-GKBML-TR (MLF-10(3x3))?

Manufactured by MICROCHIP, the MIC2212-GKBML-TR is housed in a MLF-10(3x3) package with 11 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.25V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.25V to 5.5V)), 2 (EN1: Multiplexed I/O & Peripheral Pin EN1 (General)), 3 (EN2: Multiplexed I/O & Peripheral Pin EN2 (General)), 4 (CBYP: Multiplexed I/O & Peripheral Pin CBYP (General)), 5 (SET: Multiplexed I/O & Peripheral Pin SET (General)), 6 (GND: Ground Reference Pin (GND)).

What are the IPC-7351B PCB Footprint dimensions for MIC2212-GKBML-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC2212-GKBML-TR (MLF-10(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 1.70 × 2.40 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC2212-GKBML-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC2212-GKBML-TR (MICROCHIP, MLF-10(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (11 pins) & MIC2212 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	VIN	Power_In	Primary positive power supply input (VIN) operating in the 2.25V to 5.5V domain (Max rating: 5.5V).
2	EN1	Digital_IO	Signal terminal EN1 (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: EN1. Supported peripheral buses: General.
3	EN2	Digital_IO	Signal terminal EN2 (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: EN2. Supported peripheral buses: General.
4	CBYP	Digital_IO	Signal terminal CBYP (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: CBYP. Supported peripheral buses: General.
5	SET	Digital_IO	Signal terminal SET (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: SET. Supported peripheral buses: General.
6	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
7	NC	NC	Signal terminal NC (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
8	POR	Open_Drain	Signal terminal POR (I/O, 2.25V to 5.5V domain). Multiplexed alternate functions: POR. Supported peripheral buses: General.
9	VOUT2	Power_In	Primary positive power supply input (VOUT2) operating in the 2.25V to 5.5V domain (Max rating: 5.5V).
10	VOUT1	Power_In	Primary positive power supply input (VOUT1) operating in the 2.25V to 5.5V domain (Max rating: 5.5V).
11	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.

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