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MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L) — Symbol, Footprint IPC-7351B & 3D STEP Model

MIC29512BT L3

MICROCHIPID: C17590085TO-220-5_L10.2-W4.2-P1.70-L · 5 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L)1EN2IN3GND5ADJ4OUTGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
54321E=10.20mm · Pitch e=0.50mmD=4.20mm-7-5-3-11357420-2-4mm
3. 3D CAD MODEL
Package Body: 10.20mm × 4.20mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (5/5)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1ENISystem Enable & Hardware Reset (EN)
2INI/OMultiplexed I/O & Peripheral Pin IN (General)
3GNDGNDGround Reference Pin (GND)
4OUTI/OMultiplexed I/O & Peripheral Pin OUT (General)
5ADJI/OMultiplexed I/O & Peripheral Pin ADJ (General)
PIN 1 EN
I
System Enable & Hardware Reset (EN)
Design note: Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MIC29512BT L3 (MICROCHIP · TO-220-5_L10.2-W4.2-P1.70-L)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L) - 2. Standard Pinout (Top View)
True package pinout (5 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L) - 4. Package Dimensions (D×E×A)
TO-220-5_L10.2-W4.2-P1.70-L · 10.20×4.20mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L) - 5. Recommended Land Pattern
IPC-7351B Footprint (5 Pads)Expand ›
6. Application SchematicSCHEMATIC
MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L) - 6. Application Schematic
Typical Application SchematicExpand ›

Technical Specifications & Part Details (MIC29512BT L3)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L) is a 5-pin standard electronic & interconnect component featuring a 10.20 × 4.20 × 2.00 mm mechanical envelope (lead pitch e = 0.00 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
10.20 × 4.20 × 2.00 mm (A1=0.02 mm)
Package family: OTHER (TO-220-5_L10.2-W4.2-P1.70-L)
Pin Count & Lead PitchN / e
5 Pins
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol5 auto-grouped pins
OK
IPC-7351B Land Pattern5 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (TO-220-5_L10.2-W4.2-P1.70-L)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
10.20 × 4.20 mm
Height (A) & Pitch (e)IPC-7351B
A=2.00mm · e=0.50mm
Pad Size (W × L)Level B
0.40 × 0.90 mm
Pins / Total PadsTopology
5P / 5Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
TO-220-5_L10.2-W4.2-P1.70-L
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L)?

Manufactured by MICROCHIP, the MIC29512BT L3 is housed in a TO-220-5_L10.2-W4.2-P1.70-L package with 5 pins and a 0.50 mm lead pitch. Key pins include: 1 (EN: System Enable & Hardware Reset (EN)), 2 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 3 (GND: Ground Reference Pin (GND)), 4 (OUT: Multiplexed I/O & Peripheral Pin OUT (General)), 5 (ADJ: Multiplexed I/O & Peripheral Pin ADJ (General)).

What are the IPC-7351B PCB Footprint dimensions for MIC29512BT L3?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC29512BT L3 (TO-220-5_L10.2-W4.2-P1.70-L) has a nominal body envelope of 4.20 × 10.20 mm, pitch e = 0.50 mm, and 5 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC29512BT L3?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC29512BT L3 (MICROCHIP, TO-220-5_L10.2-W4.2-P1.70-L) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (5 pins) & MIC29512 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
2INDigital_IOSignal terminal IN (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: IN. Supported peripheral buses: General.
3GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
4OUTDigital_IOSignal terminal OUT (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: OUT. Supported peripheral buses: General.
5ADJDigital_IOSignal terminal ADJ (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: ADJ. Supported peripheral buses: General.
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