Mechanical Dimensions & Land Pattern (TDFN-8-EP(3x3))
Extracted from Datasheet & IPC-7351B NormalizedRecommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit TDFN-8-EP(3x3) | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — MCP2561FD-E/MF (TDFN-8-EP(3x3))
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of MCP2561FD-E/MF (TDFN-8-EP(3x3))?
Manufactured by MICROCHIP, the MCP2561FD-E/MF is housed in a TDFN-8-EP(3x3) package with 9 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 1.8V to 5.5V. Key pins include: 1 (TXD: Multiplexed I/O & Peripheral Pin TXD (UART)), 2 (VSS: Ground Reference Pin (VSS)), 3 (VDD: Power Supply Input (VDD — 1.8V to 5.5V)), 4 (RXD: Multiplexed I/O & Peripheral Pin RXD (UART)), 5 (SPLIT: Multiplexed I/O & Peripheral Pin SPLIT (General)), 6 (CANL: Multiplexed I/O & Peripheral Pin CANL (CAN)).
What are the IPC-7351B PCB Footprint dimensions for MCP2561FD-E/MF?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP2561FD-E/MF (TDFN-8-EP(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.65 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 2.40 × 1.60 mm with a 60% IPC-7525 windowed solder paste grid.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP2561FD-E/MF?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP2561FD-E/MF (MICROCHIP, TDFN-8-EP(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (9 pins) & MCP2561 Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | TXD | Digital_IO | Signal terminal TXD (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: TXD. Supported peripheral buses: UART. |
| 2 | VSS | GND | 0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks. |
| 3 | VDD | Power_In | Primary positive power supply input (VDD) operating in the 1.8V to 5.5V domain (Max rating: 5.5V). |
| 4 | RXD | Digital_IO | Signal terminal RXD (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: RXD. Supported peripheral buses: UART. |
| 5 | SPLIT | Digital_IO | Signal terminal SPLIT (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: SPLIT. Supported peripheral buses: General. |
| 6 | CANL | Digital_IO | Signal terminal CANL (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: CANL. Supported peripheral buses: CAN. |
| 7 | CANH | Digital_IO | Signal terminal CANH (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: CANH. Supported peripheral buses: CAN. |
| 8 | STBY | Digital_IO | Signal terminal STBY (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: STBY. Supported peripheral buses: General. |
| 9 | EP | GND | Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return. |