ChipDocs.org
⌘K
2284 PARTSUpload PDF
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) — Symbol, Footprint IPC-7351B & 3D STEP Model

ATSAMW25H18-MR210PB1952

MICROCHIPID: C1526230WIRELM-SMD_MICROCHIP_ATSAMW25H18 · 59 Pins · Pitch 1.20mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18)1Commonground2IO233V34NC5IO26IO37NC8SeeSAMD21Gda9SeeSAMD21Gda10Ground11SeeSAMD21Gda12SeeSAMD21Gda13SeeSAMD21Gda14SeeSAMD21Gda15SeeSAMD21Gda16SeeSAMD21Gda17Ground18IO1919IO2020Ground21Powersupplyf22SeeSAMD21Gda23SeeSAMD21Gda24IO1325IO1426IO2127SeeSAMD21Gda28SeeSAMD21Gda29SeeSAMD21Gda30SeeSAMD21GdaG8GNDG7GNDG6GNDG5GNDG4GNDG3GNDG2GNDG1GND51Ground50IO5049IO4948IO4847IO4746IO4645IO4544SeeSAMD21Gda43SeeSAMD21Gda42Ground41SeeSAMD21Gda40SeeSAMD21Gda39SeeSAMD21Gda38SeeSAMD21Gda37SeeSAMD21Gda36SeeSAMD21Gda35SeeSAMD21Gda34SeeSAMD21Gda33SeeSAMD21Gda32Ground31SeeSAMD21GdaGrid Pitch = 2.54mm (IEEE-315)-20.3-15.2-10.2-5.105.110.215.220.343.238.133.027.922.917.812.77.62.5-2.5-7.6-12.7-17.8-22.9-27.9-33.0-38.1-43.2mm
2. 2D FOOTPRINT
ANTENNA KEEPOUT (5.2mm)G2G1G4G3G5G8G6G7323334353637383940414243444546474849505120191817161514131211109876543212627282930312524232221E=14.21mm · Pitch e=1.20mmD=30.75mm-16-14-12-10-8-6-4-20246810121416242220181614121086420-2-4-6-8-10-12-14-16-18-20-22-24mm
3. 3D CAD MODEL
Package Body: 14.21mm × 30.75mm · Pitch: 1.20mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (59/59)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1CommongroundI/OMultiplexed I/O & Peripheral Pin Commonground (General)
2IO2I/OGeneral Purpose Digital I/O Pin IO2
33V3Power3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4NCNCNo Connect (Leave Floating)
5IO2I/OGPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1
6IO3I/OGPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)
7NCNCNo Connect (Leave Floating)
8SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
9SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
10GroundI/OMultiplexed I/O & Peripheral Pin Ground (General)
11SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
12SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
13SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
14SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
15SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
16SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
17GroundI/OMultiplexed I/O & Peripheral Pin Ground (General)
18IO19I/OGPIO19 / RTC_GPIO19 / USB_D- / U1RTS / ADC2_CH8
19IO20I/OGPIO20 / RTC_GPIO20 / USB_D+ / U1CTS / ADC2_CH9
20GroundI/OMultiplexed I/O & Peripheral Pin Ground (General)
21PowersupplyforI/OI/OMultiplexed I/O & Peripheral Pin PowersupplyforI/O (General)
22SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
23SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
24IO13I/OGPIO13 / RTC_GPIO13 / TOUCH13 / ADC2_CH2 / FSPIQ
25IO14I/OGPIO14 / RTC_GPIO14 / TOUCH14 / ADC2_CH3 / FSPIWP
26IO21I/OGPIO21 / RTC_GPIO21
27SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
28SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
29SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (RTC/CLK)
30SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (RTC/CLK)
31SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
32GroundI/OMultiplexed I/O & Peripheral Pin Ground (General)
33SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
34SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
35SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
36SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
37SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
38SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
39SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
40SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
41SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
42GroundI/OMultiplexed I/O & Peripheral Pin Ground (General)
43SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
44SeeSAMD21GdatasheetI/OMultiplexed I/O & Peripheral Pin SeeSAMD21Gdatasheet (General)
45IO45I/OGeneral Purpose Digital I/O Pin IO45
46IO46I/OGeneral Purpose Digital I/O Pin IO46
47IO47I/OGeneral Purpose Digital I/O Pin IO47
48IO48I/OGeneral Purpose Digital I/O Pin IO48
49IO49I/OGeneral Purpose Digital I/O Pin IO49
50IO50I/OGeneral Purpose Digital I/O Pin IO50
51GroundI/OMultiplexed I/O & Peripheral Pin Ground (General)
G1GNDGNDGround Reference Pin (GND)
G2GNDGNDGround Reference Pin (GND)
G3GNDGNDGround Reference Pin (GND)
G4GNDGNDGround Reference Pin (GND)
G5GNDGNDGround Reference Pin (GND)
G6GNDGNDGround Reference Pin (GND)
G7GNDGNDGround Reference Pin (GND)
G8GNDGNDGround Reference Pin (GND)
PIN 1 Commonground
I/O
Multiplexed I/O & Peripheral Pin Commonground (General)
Design note: GND
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 6 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: ATSAMW25H18-MR210PB1952 (MICROCHIP · WIRELM-SMD_MICROCHIP_ATSAMW25H18)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) - 2. Standard Pinout (Top View)
True package pinout (59 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) - 4. Package Dimensions (D×E×A)
WIRELM-SMD_MICROCHIP_ATSAMW25H18 · 14.21×30.75mm · Pitch 1.20mmExpand ›
5. Recommended Land PatternLAND PATTERN
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) - 5. Recommended Land Pattern
IPC-7351B Footprint (59 Pads)Expand ›
6. Application SchematicSCHEMATIC
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (6 figures · Page 1/1)
Showing 1–6 of 6 uncropped original figures for ATSAMW25H18
P5 · p05_fig011189×2082px
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) — Figure 3-1. Pin Assignment
Figure 3-1. Pin Assignment
P8 · p08_fig011718×1093px
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) — Figure 3-2. SAMW25 MR210PB Package
Figure 3-2. SAMW25 MR210PB Package
P8 · p08_fig01P8
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) — Datasheet Page 8 (p08_fig01)
Datasheet Page 8 (p08_fig01)
P18 · p18_fig011406×2169px
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) — Figure 8-1. ATSAMW25-MR210PB/MR510 Module Schematic
Figure 8-1. ATSAMW25-MR210PB/MR510 Module Schematic
P21 · p21_fig011453×1081px
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) — Figure 10-1. Connections for the ATSAMW25
Figure 10-1. Connections for the ATSAMW25
P21 · p21_fig01P21
ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) — Datasheet Page 21 (p21_fig01)
Datasheet Page 21 (p21_fig01)

Technical Specifications & Part Details (ATSAMW25H18-MR210PB1952)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Wireless Wi-Fi / Bluetooth LE SoC Module
Detailed Overview:ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) is a 51-pin wireless wi-fi / bluetooth le soc module featuring a 30.75 × 14.21 × 2.40 mm mechanical envelope (lead pitch e = 1.20 mm). Rated for 2.7 to 3.6V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Wi-Fi, USB, UART, SPI, I2C, RTC/CLK, SWD/JTAG interfaces.
Operating Supply VoltageV_CC / V_DD
2.7 to 3.6V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2.4GHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
30.75 × 14.21 × 2.40 mm (A1=0.00 mm)
Package family: CASTELLATED_MODULE (WIRELM-SMD_MICROCHIP_ATSAMW25H18)
Pin Count & Lead PitchN / e
51 Pins | Pitch e = 1.20 mm (47.2 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Wi-Fi, USB, UART, SPI, I2C, RTC/CLK, SWD/JTAG
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol59 auto-grouped pins
OK
IPC-7351B Land Pattern59 pads · Pitch 1.20mm
OK
IPC-7525 60% Solder PasteEPAD 5.13×16.97mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified
IPC-7351B

Family Variants & Same Datasheet Chips — ATSAMW25H18 (2)

Select package variant or sibling MPN sharing this datasheet

Mechanical Dimensions & Land Pattern (WIRELM-SMD_MICROCHIP_ATSAMW25H18)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
30.75 × 14.21 mm
Height (A) & Pitch (e)IPC-7351B
A=2.40mm · e=1.20mm
Pad Size (W × L)Level B
0.75 × 1.50 mm
Pins / Total PadsTopology
59P / 59Pad (CASTELLATED_MODULE)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
WIRELM-SMD_MICROCHIP_ATSAMW25H18
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18)?

Manufactured by MICROCHIP, the ATSAMW25H18-MR210PB1952 is housed in a WIRELM-SMD_MICROCHIP_ATSAMW25H18 package with 59 pins and a 1.20 mm lead pitch, supporting a VCC supply range of 2.7 to 3.6V. Key pins include: 1 (Commonground: Multiplexed I/O & Peripheral Pin Commonground (General)), 2 (IO2: General Purpose Digital I/O Pin IO2), 3 (3V3: 3.3V Main Power Supply Rail (3.0V ~ 3.6V)), 4 (NC: No Connect (Leave Floating)), 5 (IO2: GPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1), 6 (IO3: GPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)).

What are the IPC-7351B PCB Footprint dimensions for ATSAMW25H18-MR210PB1952?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), ATSAMW25H18-MR210PB1952 (WIRELM-SMD_MICROCHIP_ATSAMW25H18) has a nominal body envelope of 14.21 × 30.75 mm, pitch e = 1.20 mm, and 59 copper pads plus a central exposed thermal pad (EPAD) of 5.13 × 16.97 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for ATSAMW25H18-MR210PB1952?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for ATSAMW25H18-MR210PB1952 (MICROCHIP, WIRELM-SMD_MICROCHIP_ATSAMW25H18) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (59 pins) & ATSAMW25H18 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1CommongroundDigital_IOSignal terminal Commonground (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: Commonground. Supported peripheral buses: General.
2IO2Digital_IOGeneral Purpose Digital I/O Pin IO2
33V3Power_In3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4NCNo_ConnectNo Connect (Leave Floating)
5IO2Digital_IOGPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1
6IO3Digital_IOGPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)
7NCNo_ConnectNo Connect (Leave Floating)
8SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
9SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
10GroundDigital_IOSignal terminal Ground (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: Ground. Supported peripheral buses: General.
11SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
12SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
13SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
14SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
15SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
16SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
17GroundDigital_IOSignal terminal Ground (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: Ground. Supported peripheral buses: General.
18IO19Digital_IOGPIO19 / RTC_GPIO19 / USB_D- / U1RTS / ADC2_CH8
19IO20Digital_IOGPIO20 / RTC_GPIO20 / USB_D+ / U1CTS / ADC2_CH9
20GroundDigital_IOSignal terminal Ground (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: Ground. Supported peripheral buses: General.
21PowersupplyforI/ODigital_IOSignal terminal PowersupplyforI/O (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: PowersupplyforI/O. Supported peripheral buses: General.
22SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
23SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
24IO13Digital_IOGPIO13 / RTC_GPIO13 / TOUCH13 / ADC2_CH2 / FSPIQ
25IO14Digital_IOGPIO14 / RTC_GPIO14 / TOUCH14 / ADC2_CH3 / FSPIWP
26IO21Digital_IOGPIO21 / RTC_GPIO21
27SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
28SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
29SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: RTC/CLK.
30SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: RTC/CLK.
31SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
32GroundDigital_IOSignal terminal Ground (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: Ground. Supported peripheral buses: General.
33SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
34SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
35SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
36SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
37SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
38SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
39SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
40SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
41SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
42GroundDigital_IOSignal terminal Ground (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: Ground. Supported peripheral buses: General.
43SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
44SeeSAMD21GdatasheetDigital_IOSignal terminal SeeSAMD21Gdatasheet (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: SeeSAMD21Gdatasheet. Supported peripheral buses: General.
45IO45Digital_IOGeneral Purpose Digital I/O Pin IO45
46IO46Digital_IOGeneral Purpose Digital I/O Pin IO46
47IO47Digital_IOGeneral Purpose Digital I/O Pin IO47
48IO48Digital_IOGeneral Purpose Digital I/O Pin IO48
49IO49Digital_IOGeneral Purpose Digital I/O Pin IO49
50IO50Digital_IOGeneral Purpose Digital I/O Pin IO50
51GroundDigital_IOSignal terminal Ground (I/O, 2.7 to 3.6V domain). Multiplexed alternate functions: Ground. Supported peripheral buses: General.
G1GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
G2GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
G3GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
G4GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
G5GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
G6GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
G7GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
G8GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
ExplorePartsPackagesMFRsUpload