MIC23030-AYMT-TR (MLF-6(1.6x1.6)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC23030-AYMT-TR (MLF-6(1.6x1.6))?

Manufactured by MICROCHIP, the MIC23030-AYMT-TR is housed in a MLF-6(1.6x1.6) package with 7 pins and a 0.51 mm lead pitch, supporting a VCC supply range of 2.7V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.7V to 5.5V)), 2 (SW: Multiplexed I/O & Peripheral Pin SW (General)), 3 (SNS: Multiplexed I/O & Peripheral Pin SNS (General)), 4 (EN: System Enable & Hardware Reset (EN)), 5 (AGND: Ground Reference Pin (AGND)), 6 (PGND: Ground Reference Pin (PGND)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC23030-AYMT-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC23030-AYMT-TR (MLF-6(1.6x1.6)) has a nominal body envelope of 1.60 × 1.60 mm, pitch e = 0.51 mm, and 7 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC23030-AYMT-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC23030-AYMT-TR (MICROCHIP, MLF-6(1.6x1.6)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 1.60mm × 1.60mm · Pitch: 0.51mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (7/7)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	VIN	Power	Power Supply Input (VIN — 2.7V to 5.5V)
2	SW	I/O	Multiplexed I/O & Peripheral Pin SW (General)
3	SNS	I/O	Multiplexed I/O & Peripheral Pin SNS (General)
4	EN	I	System Enable & Hardware Reset (EN)
5	AGND	GND	Ground Reference Pin (AGND)
6	PGND	GND	Ground Reference Pin (PGND)
7	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 VIN

Power

Power Supply Input (VIN — 2.7V to 5.5V)

Design note: Primary positive power supply input (VIN) operating in the 2.7V to 5.5V domain (Max rating: 5.5V).

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 16 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC23030-AYMT-TR (MLF-6(1.6x1.6)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC23030-AYMT-TR (MLF-6(1.6x1.6)) - 2. Standard Pinout (Top View)

True package pinout (7 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC23030-AYMT-TR (MLF-6(1.6x1.6)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC23030-AYMT-TR (MLF-6(1.6x1.6)) - 4. Package Dimensions (D×E×A)

MLF-6(1.6x1.6) · 1.60×1.60mm · Pitch 0.51mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC23030-AYMT-TR (MLF-6(1.6x1.6)) - 5. Recommended Land Pattern

IPC-7351B Footprint (7 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC23030-AYMT-TR (MLF-6(1.6x1.6)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (16 figures · Page 1/2)

Showing 1–12 of 16 uncropped original figures for MIC23030

P2 · p02_fig01EXACT PACKAGE

2. Thin MLF ® is GREEN RoHS compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free.

P17 · p17_fig02EXACT PACKAGE

6-Pin (1.6mm x 1.6mm) Thin MLF® (MT)

P1 · p01_fig01558×591px

Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com

P1 · p01_fig02983×450px

HyperLight Load is a trademark of Micrel, Inc. MLF and MicroLeadFrame are registered trademark Amkor Technology Inc.

P2 · p02_fig02564×480px

* Available August 2008. Pin Configuration

P2 · p02_fig03544×391px

Fixed Option ADJ Option Pin Name Pin Function

P2 · p02_fig041930×776px

August 2008 2 M9999-082608-B

P2 · p02_fig01P2

Datasheet Page 2 (p02_fig01)

P13 · p13_fig011537×669px

Item Part Number Manufacturer Description Qty.

P13 · p13_fig01P13

Datasheet Page 13 (p13_fig01)

P15 · p15_fig01910×944px

PCB Layout Recommendations (Fixed)

P15 · p15_fig02970×1052px

Fixed Top Layer

Page 1 / 2 (16 extracted figures)

Technical Specifications & Part Details (MIC23030-AYMT-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC23030-AYMT-TR (MLF-6(1.6x1.6)) is a 6-pin standard electronic & interconnect component featuring a 1.60 × 1.60 × 0.75 mm mechanical envelope (lead pitch e = 0.51 mm). Rated for 2.7V to 5.5V supply operation across 40°C to +125°C with integrated Wi-Fi, USB, PWM interfaces.

Operating Supply VoltageV_CC / V_DD

2.7V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

8MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

21µA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

1.60 × 1.60 × 0.75 mm (A1=0.02 mm)

Package family: OTHER (MLF-6(1.6x1.6))

Pin Count & Lead PitchN / e

6 Pins | Pitch e = 0.51 mm (20.0 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Wi-Fi, USB, PWM

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol7 auto-grouped pins

IPC-7351B Land Pattern7 pads · Pitch 0.51mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MLF-6(1.6x1.6))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

1.60 × 1.60 mm

Height (A) & Pitch (e)IPC-7351B

A=0.75mm · e=0.51mm

Pad Size (W × L)Level B

0.30 × 0.60 mm

Pins / Total PadsTopology

7P / 7Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit MLF-6(1.6x1.6)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC23030-AYMT-TR (MLF-6(1.6x1.6))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC23030-AYMT-TR (MLF-6(1.6x1.6))?

Manufactured by MICROCHIP, the MIC23030-AYMT-TR is housed in a MLF-6(1.6x1.6) package with 7 pins and a 0.51 mm lead pitch, supporting a VCC supply range of 2.7V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.7V to 5.5V)), 2 (SW: Multiplexed I/O & Peripheral Pin SW (General)), 3 (SNS: Multiplexed I/O & Peripheral Pin SNS (General)), 4 (EN: System Enable & Hardware Reset (EN)), 5 (AGND: Ground Reference Pin (AGND)), 6 (PGND: Ground Reference Pin (PGND)).

What are the IPC-7351B PCB Footprint dimensions for MIC23030-AYMT-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC23030-AYMT-TR (MLF-6(1.6x1.6)) has a nominal body envelope of 1.60 × 1.60 mm, pitch e = 0.51 mm, and 7 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC23030-AYMT-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC23030-AYMT-TR (MICROCHIP, MLF-6(1.6x1.6)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (7 pins) & MIC23030 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	VIN	Power_In	Primary positive power supply input (VIN) operating in the 2.7V to 5.5V domain (Max rating: 5.5V).
2	SW	Digital_IO	Signal terminal SW (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
3	SNS	Digital_IO	Signal terminal SNS (I/O, 2.7V to 5.5V domain). Multiplexed alternate functions: SNS. Supported peripheral buses: General.
4	EN	Digital_IO	Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
5	AGND	GND	0V electrical ground return terminal (AGND) for internal core logic, I/O drivers, and analog sub-blocks.
6	PGND	GND	0V electrical ground return terminal (PGND) for internal core logic, I/O drivers, and analog sub-blocks.
7	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

4D Studio: MIC23030-AYMT-TR Permalink: /part/C152162 MICROCHIP MLF-6(1.6x1.6)All Packages All Manufacturers