PIC16LF1614-I/P (DIP-14) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of PIC16LF1614-I/P (DIP-14)?

Manufactured by MICROCHIP, the PIC16LF1614-I/P is housed in a DIP-14 package with 14 pins and a 2.54 mm lead pitch, supporting a VCC supply range of 1.8V to 3.6V. Key pins include: 1 (VDD: Power Supply Input (VDD — 1.8V to 3.6V)), 2 (RA5: Multiplexed I/O & Peripheral Pin RA5 (General)), 3 (RA4: Multiplexed I/O & Peripheral Pin RA4 (General)), 4 (MCLR#/VPP/RA3: Multiplexed I/O & Peripheral Pin MCLR#/VPP/RA3 (General)), 5 (RC5: Multiplexed I/O & Peripheral Pin RC5 (General)), 6 (RC4: Multiplexed I/O & Peripheral Pin RC4 (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for PIC16LF1614-I/P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16LF1614-I/P (DIP-14) has a nominal body envelope of 6.70 × 20.00 mm, pitch e = 2.54 mm, and 14 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16LF1614-I/P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16LF1614-I/P (MICROCHIP, DIP-14) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 20.00mm × 6.70mm · Pitch: 2.54mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (14/14)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	VDD	Power	Power Supply Input (VDD — 1.8V to 3.6V)
2	RA5	I/O	Multiplexed I/O & Peripheral Pin RA5 (General)
3	RA4	I/O	Multiplexed I/O & Peripheral Pin RA4 (General)
4	MCLR#/VPP/RA3	I/O	Multiplexed I/O & Peripheral Pin MCLR#/VPP/RA3 (General)
5	RC5	I/O	Multiplexed I/O & Peripheral Pin RC5 (General)
6	RC4	I/O	Multiplexed I/O & Peripheral Pin RC4 (General)
7	RC3	I/O	Multiplexed I/O & Peripheral Pin RC3 (General)
8	RC2	I/O	Multiplexed I/O & Peripheral Pin RC2 (General)
9	RC1	I/O	Multiplexed I/O & Peripheral Pin RC1 (General)
10	RC0	I/O	Multiplexed I/O & Peripheral Pin RC0 (General)
11	RA2	I/O	Multiplexed I/O & Peripheral Pin RA2 (General)
12	RA1/ICSPCLK	I/O	Multiplexed I/O & Peripheral Pin RA1/ICSPCLK (General)
13	RA0/ICSPDAT	I/O	Multiplexed I/O & Peripheral Pin RA0/ICSPDAT (General)
14	VSS	GND	Ground Reference Pin (VSS)

PIN 1 VDD

Power

Power Supply Input (VDD — 1.8V to 3.6V)

Design note: VDD

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 15 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

PIC16LF1614-I/P (DIP-14) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

PIC16LF1614-I/P (DIP-14) - 2. Standard Pinout (Top View)

True package pinout (14 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

PIC16LF1614-I/P (DIP-14) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

PIC16LF1614-I/P (DIP-14) - 4. Package Dimensions (D×E×A)

DIP-14 · 20.00×6.70mm · Pitch 2.54mmExpand ›

5. Recommended Land PatternLAND PATTERN

PIC16LF1614-I/P (DIP-14) - 5. Recommended Land Pattern

IPC-7351B Footprint (14 Pads)Expand ›

6. Application SchematicSCHEMATIC

PIC16LF1614-I/P (DIP-14) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (15 figures · Page 1/2)

Showing 1–12 of 15 uncropped original figures for PIC16LF1614

P110 · p110_fig011777×1106px

FIGURE 8-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT

P270 · p270_fig01867×588px

FIGURE 24-11: I2C MASTER/ SLAVE CONNECTION

P358 · p358_fig011959×2317px

27.1.1 FUNDAMENTAL OPERATION

P358 · p358_fig01P358

Datasheet Page 358 (p358_fig01)

P494 · p494_fig011778×1166px

FIGURE 33-2: PICkit™ PROGRAMMER STYLE CONNECTOR INTERFACE

P494 · p494_fig021778×1316px

FIGURE 33-3: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING

P494 · p494_fig02P494

Datasheet Page 494 (p494_fig02)

P556 · p556_fig02544×1086px

$PIC16LF1614-I/P (DIP-14) — Example | Example | PIC16F1614 | 1410017 | Example | F1614ST | 1410 017 | PIC16F1614 | 1410017 | 3 e | 3 e | \P | \SL$

Example | Example | PIC16F1614 | 1410017 | Example | F1614ST | 1410 017 | PIC16F1614 | 1410017 | 3 e | 3 e | \P | \SL

P556 · p556_fig031360×615px

 2014-2016 Microchip Technology Inc. DS40001769B-page 556

P556 · p556_fig03P556

Datasheet Page 556 (p556_fig03)

P578 · p578_fig011777×2517px

PIC16(L)F1614/8

P579 · p579_fig011778×2529px

PIC16(L)F1614/8

Page 1 / 2 (15 extracted figures)

Technical Specifications & Part Details (PIC16LF1614-I/P)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:PIC16LF1614-I/P (DIP-14) is a 14-pin standard electronic & interconnect component featuring a 20.00 × 6.70 × 4.20 mm mechanical envelope (lead pitch e = 2.54 mm). Rated for 1.8V to 3.6V supply operation across -40°C to 85°C with integrated UART, SPI, I2C, ADC, DAC, PWM interfaces.

Operating Supply VoltageV_CC / V_DD

1.8V to 3.6V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to 85°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

32 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

100mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

20.00 × 6.70 × 4.20 mm (A1=0.51 mm)

Package family: DIP (DIP-14)

Pin Count & Lead PitchN / e

14 Pins | Pitch e = 2.54 mm (100.0 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

UART, SPI, I2C, ADC, DAC, PWM

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol14 auto-grouped pins

IPC-7351B Land Pattern14 pads · Pitch 2.54mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DIP-14)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

20.00 × 6.70 mm

Height (A) & Pitch (e)IPC-7351B

A=4.20mm · e=2.54mm

Pad Size (W × L)Level B

1.60 × 1.60 mm

Pins / Total PadsTopology

14P / 14Pad (THT_DIP)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit DIP-14	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC16LF1614-I/P (DIP-14)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC16LF1614-I/P (DIP-14)?

Manufactured by MICROCHIP, the PIC16LF1614-I/P is housed in a DIP-14 package with 14 pins and a 2.54 mm lead pitch, supporting a VCC supply range of 1.8V to 3.6V. Key pins include: 1 (VDD: Power Supply Input (VDD — 1.8V to 3.6V)), 2 (RA5: Multiplexed I/O & Peripheral Pin RA5 (General)), 3 (RA4: Multiplexed I/O & Peripheral Pin RA4 (General)), 4 (MCLR#/VPP/RA3: Multiplexed I/O & Peripheral Pin MCLR#/VPP/RA3 (General)), 5 (RC5: Multiplexed I/O & Peripheral Pin RC5 (General)), 6 (RC4: Multiplexed I/O & Peripheral Pin RC4 (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC16LF1614-I/P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16LF1614-I/P (DIP-14) has a nominal body envelope of 6.70 × 20.00 mm, pitch e = 2.54 mm, and 14 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16LF1614-I/P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16LF1614-I/P (MICROCHIP, DIP-14) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (14 pins) & PIC16LF1614 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	VDD	Power_In	Primary positive power supply input (VDD) operating in the 1.8V to 3.6V domain (Max rating: 3.6V).
2	RA5	Digital_IO	Signal terminal RA5 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA5. Supported peripheral buses: General.
3	RA4	Digital_IO	Signal terminal RA4 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA4. Supported peripheral buses: General.
4	MCLR#/VPP/RA3	Digital_IO	Signal terminal MCLR#/VPP/RA3 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: MCLR#/VPP/RA3. Supported peripheral buses: General.
5	RC5	Digital_IO	Signal terminal RC5 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC5. Supported peripheral buses: General.
6	RC4	Digital_IO	Signal terminal RC4 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC4. Supported peripheral buses: General.
7	RC3	Digital_IO	Signal terminal RC3 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC3. Supported peripheral buses: General.
8	RC2	Digital_IO	Signal terminal RC2 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC2. Supported peripheral buses: General.
9	RC1	Digital_IO	Signal terminal RC1 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC1. Supported peripheral buses: General.
10	RC0	Digital_IO	Signal terminal RC0 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RC0. Supported peripheral buses: General.
11	RA2	Digital_IO	Signal terminal RA2 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.
12	RA1/ICSPCLK	Digital_IO	Signal terminal RA1/ICSPCLK (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA1/ICSPCLK. Supported peripheral buses: General.
13	RA0/ICSPDAT	Digital_IO	Signal terminal RA0/ICSPDAT (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA0/ICSPDAT. Supported peripheral buses: General.
14	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.

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