MCP6H02T-E/MNY (TDFN-8-EP(2x3)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MCP6H02T-E/MNY (TDFN-8-EP(2x3))?

Manufactured by MICROCHIP, the MCP6H02T-E/MNY is housed in a TDFN-8-EP(2x3) package with 9 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 3.5V to 16V. Key pins include: 1 (V V OUT, OUTA: Multiplexed I/O & Peripheral Pin V V OUT, OUTA (General)), 2 (V V IN–, INA–: Multiplexed I/O & Peripheral Pin V V IN–, INA– (General)), 3 (V IN+ V INA+ ,: Multiplexed I/O & Peripheral Pin V IN+ V INA+ , (General)), 4 (VSS: Ground Reference Pin (VSS)), 5 (V INB+: Multiplexed I/O & Peripheral Pin V INB+ (General)), 6 (V INB–: Multiplexed I/O & Peripheral Pin V INB– (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for MCP6H02T-E/MNY?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP6H02T-E/MNY (TDFN-8-EP(2x3)) has a nominal body envelope of 2.00 × 3.00 mm, pitch e = 0.50 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 1.50 × 1.50 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP6H02T-E/MNY?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP6H02T-E/MNY (MICROCHIP, TDFN-8-EP(2x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 2.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (9/9)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	V V OUT, OUTA	I/O	Multiplexed I/O & Peripheral Pin V V OUT, OUTA (General)
2	V V IN–, INA–	I/O	Multiplexed I/O & Peripheral Pin V V IN–, INA– (General)
3	V IN+ V INA+ ,	I/O	Multiplexed I/O & Peripheral Pin V IN+ V INA+ , (General)
4	VSS	GND	Ground Reference Pin (VSS)
5	V INB+	I/O	Multiplexed I/O & Peripheral Pin V INB+ (General)
6	V INB–	I/O	Multiplexed I/O & Peripheral Pin V INB– (General)
7	V OUTB	I/O	Multiplexed I/O & Peripheral Pin V OUTB (General)
8	VDD	Power	Power Supply Input (VDD — 3.5V to 16V)
9	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 V V OUT, OUTA

I/O

Multiplexed I/O & Peripheral Pin V V OUT, OUTA (General)

Design note: AnalogOutput(opampA)

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) - 2. Standard Pinout (Top View)

True package pinout (9 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) - 4. Package Dimensions (D×E×A)

TDFN-8-EP(2x3) · 2.00×3.00mm · Pitch 0.50mmExpand ›

5. Recommended Land PatternLAND PATTERN

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) - 5. Recommended Land Pattern

IPC-7351B Footprint (9 Pads)Expand ›

6. Application SchematicSCHEMATIC

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)

Showing 1–10 of 10 uncropped original figures for MCP6H02T

P1 · p01_fig01377×200px

1.2 MHz, 16V Op Amps

P1 · p01_fig021777×1689px

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) —  2010-2011 Microchip Technology Inc. DS22243D-page 1 | Applications: | • Automotive Power Electronics • Industrial Control Equipment • Battery Powered Systems • Medical Diagnostic Instruments | Design Aids: | • SPICE Macro Models • FilterL

 2010-2011 Microchip Technology Inc. DS22243D-page 1 | Applications: | • Automotive Power Electronics • Industrial Control Equipment • Battery Powered Systems • Medical Diagnostic Instruments | Design Aids: | • SPICE Macro Models • FilterL

P1 · p01_fig02P1

Datasheet Page 1 (p01_fig02)

P17 · p17_fig011777×695px

FIGURE 4-2: Protecting the Analog Inputs.

P17 · p17_fig021777×812px

FIGURE 4-3: Protecting the Analog Inputs. 4.1.4 NORMAL OPERATION

P19 · p19_fig011777×1005px

FIGURE 4-8: High Side Current Sensing Using Difference Amplifier.

P31 · p31_fig011778×2430px

 2010-2011 Microchip Technology Inc. DS22243D-page 31

P31 · p31_fig01P31

Datasheet Page 31 (p31_fig01)

P23 · p23_fig01All Packages in PDF

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) —  2010-2011 Microchip Technology Inc. DS22243D-page 23 | MCP6H01/2/4 | 6.0 PACKAGING INFORMATION | 6.1 Package Marking Information | 5-Lead SC-70 (MCP6H01) Example | 8-Lead SOIC (150 mil) (MCP6H01, MCP6H02) Example: | XXXXXXXX XXXXYYWW | NN

P37 · p37_fig01All Packages in PDF

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) — 14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http:/www.microchip.com/packaging |  2010-2011 Microchip Technolo

14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http:/www.microchip.com/packaging |  2010-2011 Microchip Technolo

Technical Specifications & Part Details (MCP6H02T-E/MNY)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MCP6H02T-E/MNY (TDFN-8-EP(2x3)) is a 8-pin standard electronic & interconnect component featuring a 3.00 × 2.00 × 0.80 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 3.5V to 16V supply operation across -40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

3.5V to 16V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

1.2 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

135 µA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

3.00 × 2.00 × 0.80 mm (A1=0.03 mm)

Package family: DFN (TDFN-8-EP(2x3))

Pin Count & Lead PitchN / e

8 Pins | Pitch e = 0.50 mm (19.7 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol9 auto-grouped pins

IPC-7351B Land Pattern9 pads · Pitch 0.50mm

IPC-7525 60% Solder PasteEPAD 1.50×1.50mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (TDFN-8-EP(2x3))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

3.00 × 2.00 mm

Height (A) & Pitch (e)IPC-7351B

A=0.80mm · e=0.50mm

Pad Size (W × L)Level B

0.30 × 0.75 mm

Pins / Total PadsTopology

9P / 9Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit TDFN-8-EP(2x3)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MCP6H02T-E/MNY (TDFN-8-EP(2x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MCP6H02T-E/MNY (TDFN-8-EP(2x3))?

Manufactured by MICROCHIP, the MCP6H02T-E/MNY is housed in a TDFN-8-EP(2x3) package with 9 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 3.5V to 16V. Key pins include: 1 (V V OUT, OUTA: Multiplexed I/O & Peripheral Pin V V OUT, OUTA (General)), 2 (V V IN–, INA–: Multiplexed I/O & Peripheral Pin V V IN–, INA– (General)), 3 (V IN+ V INA+ ,: Multiplexed I/O & Peripheral Pin V IN+ V INA+ , (General)), 4 (VSS: Ground Reference Pin (VSS)), 5 (V INB+: Multiplexed I/O & Peripheral Pin V INB+ (General)), 6 (V INB–: Multiplexed I/O & Peripheral Pin V INB– (General)).

What are the IPC-7351B PCB Footprint dimensions for MCP6H02T-E/MNY?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP6H02T-E/MNY (TDFN-8-EP(2x3)) has a nominal body envelope of 2.00 × 3.00 mm, pitch e = 0.50 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 1.50 × 1.50 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP6H02T-E/MNY?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP6H02T-E/MNY (MICROCHIP, TDFN-8-EP(2x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (9 pins) & MCP6H02T Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	V V OUT, OUTA	Digital_IO	Signal terminal V V OUT, OUTA (I/O, 3.5V to 16V domain). Multiplexed alternate functions: V V OUT, OUTA. Supported peripheral buses: General.
2	V V IN–, INA–	Digital_IO	Signal terminal V V IN–, INA– (I/O, 3.5V to 16V domain). Multiplexed alternate functions: V V IN–, INA–. Supported peripheral buses: General.
3	V IN+ V INA+ ,	Digital_IO	Signal terminal V IN+ V INA+ , (I/O, 3.5V to 16V domain). Multiplexed alternate functions: V IN+ V INA+ ,. Supported peripheral buses: General.
4	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
5	V INB+	Digital_IO	Signal terminal V INB+ (I/O, 3.5V to 16V domain). Multiplexed alternate functions: V INB+. Supported peripheral buses: General.
6	V INB–	Digital_IO	Signal terminal V INB– (I/O, 3.5V to 16V domain). Multiplexed alternate functions: V INB–. Supported peripheral buses: General.
7	V OUTB	Digital_IO	Signal terminal V OUTB (I/O, 3.5V to 16V domain). Multiplexed alternate functions: V OUTB. Supported peripheral buses: General.
8	VDD	Power_In	Primary positive power supply input (VDD) operating in the 3.5V to 16V domain (Max rating: 16.0V).
9	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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