MCP6281T-E/OTVAO (SOT-23-5) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MCP6281T-E/OTVAO (SOT-23-5)?

Manufactured by MICROCHIP, the MCP6281T-E/OTVAO is housed in a SOT-23-5 package with 5 pins and a 0.95 mm lead pitch, supporting a VCC supply range of 2.2V to 6.0V. Key pins include: 1 (V OUT: Multiplexed I/O & Peripheral Pin V OUT (General)), 2 (VSS: Ground Reference Pin (VSS)), 3 (V IN+: Multiplexed I/O & Peripheral Pin V IN+ (General)), 4 (V IN–: Multiplexed I/O & Peripheral Pin V IN– (General)), 5 (VDD: Power Supply Input (VDD — 2.2V to 6.0V)).

Q: What are the IPC-7351B PCB Footprint dimensions for MCP6281T-E/OTVAO?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP6281T-E/OTVAO (SOT-23-5) has a nominal body envelope of 1.60 × 2.90 mm, pitch e = 0.95 mm, and 5 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP6281T-E/OTVAO?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP6281T-E/OTVAO (MICROCHIP, SOT-23-5) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 2.90mm × 1.60mm · Pitch: 0.95mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (5/5)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	V OUT	I/O	Multiplexed I/O & Peripheral Pin V OUT (General)
2	VSS	GND	Ground Reference Pin (VSS)
3	V IN+	I/O	Multiplexed I/O & Peripheral Pin V IN+ (General)
4	V IN–	I/O	Multiplexed I/O & Peripheral Pin V IN– (General)
5	VDD	Power	Power Supply Input (VDD — 2.2V to 6.0V)

PIN 1 V OUT

I/O

Multiplexed I/O & Peripheral Pin V OUT (General)

Design note: AnalogOutput

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 18 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MCP6281T-E/OTVAO (SOT-23-5) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MCP6281T-E/OTVAO (SOT-23-5) - 2. Standard Pinout (Top View)

True package pinout (5 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MCP6281T-E/OTVAO (SOT-23-5) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MCP6281T-E/OTVAO (SOT-23-5) - 4. Package Dimensions (D×E×A)

SOT-23-5 · 2.90×1.60mm · Pitch 0.95mmExpand ›

5. Recommended Land PatternLAND PATTERN

MCP6281T-E/OTVAO (SOT-23-5) - 5. Recommended Land Pattern

IPC-7351B Footprint (5 Pads)Expand ›

6. Application SchematicSCHEMATIC

MCP6281T-E/OTVAO (SOT-23-5) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (18 figures · Page 1/2)

Showing 1–12 of 18 uncropped original figures for MCP6281

P23 · p23_fig01EXACT PACKAGE

MCP6281T-E/OTVAO (SOT-23-5) —  2019 Microchip Technology Inc. DS20001811F-page 23 | MCP6281/1R/2/3/4/5 | RECOMMENDED LAND PATTERN | 5-Lead Plastic Small Outline Transistor (OT) [SOT23] | For the most current package drawings, please see the Microchip Packaging Specific

 2019 Microchip Technology Inc. DS20001811F-page 23 | MCP6281/1R/2/3/4/5 | RECOMMENDED LAND PATTERN | 5-Lead Plastic Small Outline Transistor (OT) [SOT23] | For the most current package drawings, please see the Microchip Packaging Specific

P26 · p26_fig01EXACT PACKAGE

MCP6281T-E/OTVAO (SOT-23-5) — MCP6281/1R/2/3/4/5 | DS20001811F-page 26  2019 Microchip Technology Inc. | RECOMMENDED LAND PATTERN | Microchip Technology Drawing No. C04-2028B (CH) | 6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23] | For the most current packa

P1 · p01_fig01376×200px

450 µA, 5 MHz Rail-to-Rail Op Amp

P1 · p01_fig021752×737px

+ - - +

P12 · p12_fig01867×775px

FIGURE 4-2: Protecting the Analog Inputs.

P12 · p12_fig021543×591px

FIGURE 4-1: Simplified Analog Input ESD Structures.

P14 · p14_fig011777×711px

FIGURE 4-7: Example Guard Ring Layout for Inverting Gain.

P14 · p14_fig02867×626px

FIGURE 4-6: Unused Op Amps. 4.8 PCB Surface Leakage

P16 · p16_fig011777×796px

FIGURE 4-11: Cascaded Gain Circuit Configuration. 4.9.3.3 Difference Amplifier

P16 · p16_fig021777×707px

MCP6281T-E/OTVAO (SOT-23-5) — FIGURE 4-14: Integrator Circuit with Active Compensation. 4.9.3.6 Second-Order MFB Low-Pass Filter with an Extra Pole-Zero Pair

FIGURE 4-14: Integrator Circuit with Active Compensation. 4.9.3.6 Second-Order MFB Low-Pass Filter with an Extra Pole-Zero Pair

P16 · p16_fig01P16

Datasheet Page 16 (p16_fig01)

P19 · p19_fig03262×382px

Example:

Page 1 / 2 (18 extracted figures)

Technical Specifications & Part Details (MCP6281T-E/OTVAO)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MCP6281T-E/OTVAO (SOT-23-5) is a 5-pin standard electronic & interconnect component featuring a 2.90 × 1.60 × 1.10 mm mechanical envelope (lead pitch e = 0.95 mm). Rated for 2.2V to 6.0V supply operation across -40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

2.2V to 6.0V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

5 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

450 µA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

2.90 × 1.60 × 1.10 mm (A1=0.08 mm)

Package family: SOT23 (SOT-23-5)

Pin Count & Lead PitchN / e

5 Pins | Pitch e = 0.95 mm (37.4 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol5 auto-grouped pins

IPC-7351B Land Pattern5 pads · Pitch 0.95mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOT-23-5)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

2.90 × 1.60 mm

Height (A) & Pitch (e)IPC-7351B

A=1.10mm · e=0.95mm

Pad Size (W × L)Level B

0.60 × 1.10 mm

Pins / Total PadsTopology

5P / 5Pad (SOT_SMALL)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit SOT-23-5	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MCP6281T-E/OTVAO (SOT-23-5)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MCP6281T-E/OTVAO (SOT-23-5)?

Manufactured by MICROCHIP, the MCP6281T-E/OTVAO is housed in a SOT-23-5 package with 5 pins and a 0.95 mm lead pitch, supporting a VCC supply range of 2.2V to 6.0V. Key pins include: 1 (V OUT: Multiplexed I/O & Peripheral Pin V OUT (General)), 2 (VSS: Ground Reference Pin (VSS)), 3 (V IN+: Multiplexed I/O & Peripheral Pin V IN+ (General)), 4 (V IN–: Multiplexed I/O & Peripheral Pin V IN– (General)), 5 (VDD: Power Supply Input (VDD — 2.2V to 6.0V)).

What are the IPC-7351B PCB Footprint dimensions for MCP6281T-E/OTVAO?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP6281T-E/OTVAO (SOT-23-5) has a nominal body envelope of 1.60 × 2.90 mm, pitch e = 0.95 mm, and 5 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP6281T-E/OTVAO?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP6281T-E/OTVAO (MICROCHIP, SOT-23-5) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (5 pins) & MCP6281 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	V OUT	Digital_IO	Signal terminal V OUT (I/O, 2.2V to 6.0V domain). Multiplexed alternate functions: V OUT. Supported peripheral buses: General.
2	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
3	V IN+	Digital_IO	Signal terminal V IN+ (I/O, 2.2V to 6.0V domain). Multiplexed alternate functions: V IN+. Supported peripheral buses: General.
4	V IN–	Digital_IO	Signal terminal V IN– (I/O, 2.2V to 6.0V domain). Multiplexed alternate functions: V IN–. Supported peripheral buses: General.
5	VDD	Power_In	Primary positive power supply input (VDD) operating in the 2.2V to 6.0V domain (Max rating: 6.0V).

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