Through Hole,Right Angle,P=2mm · 10P
10P22.0×6.3×6.35mmP=2mm
Standard Electronic & Interconnect Component
Electronic Component Library & IPC-7351B CAD Models — Page 318
Look up datasheet specifications, verify synchronized IEEE-315 Symbols / IPC-7351B Footprints / STEP AP214 3D models, and download directly for KiCad 8, Fusion 360 (.lbr), and Altium.
Verified ComponentsDRC PASS
3818
2D ECAD LibrariesIEEE-315 / IPC
11454
3D MCAD ModelsAP214 / GLB
7628
Land Pattern NormalizationIPC-7351B
100%
Split by MPN (3824 · Page 318/319)
Showing 3805–3816 of 3824 componentsThrough Hole,D=5mm · 2P
2P5.0×5.0×7.70mmP=2.54mm
Standard Electronic & Interconnect Component
- · 41P
41P19.2×18.0×3.10mmP=1.27mm
Wireless Wi-Fi / Bluetooth LE SoC Module
SMD,20x18mm · 19P
19P20.0×18.0×3.20mmP=1.5mm
Wireless Wi-Fi / Bluetooth LE SoC Module
SMD-41P · 41P
41P19.2×18.0×3.20mmP=1.27mm3.0 ~ 3.6 V
Wireless Wi-Fi / Bluetooth LE SoC Module
SOP-16 · 16P
LQFP-48(7x7) · 48P
SOP-16 · 16P
SOT-223 · 4P
4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V
Low-Dropout Linear Voltage Regulator (LDO)
0805 · 2P
2P2.0×1.2×0.50mmP=1.9mm
Standard Electronic & Interconnect Component
LQFN-56(7x7) · 57P
SMD-38P · 39P
39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V
Wireless Wi-Fi / Bluetooth LE SoC Module
Components by Package Family (IPC-7351B & IPC-7525)
Each package links to a dedicated directory with IPC pad calculation rules, 60% stencil grids, and copper keepoutsQFN / DFN / LGAQFN
IPC-7351B · 60% Paste WindowHigh-density MCUs & SoCs (RP2040, ESP32-S3, STM32) with 60% segmented paste windows on EPAD to prevent reflow voiding.
LQFP / TQFP (4-Side Gull-Wing)QFP
IPC-7351B Toe/Heel Fillet4-sided gull-wing microcontrollers (STM32F103C8T6 LQFP-48, LQFP-64, LQFP-100) verified for JLCPCB minimum DFM clearance.
Castellated RF ModuleMODULE
IPC-7351B · Antenna KeepoutCastellated Wi-Fi/BLE modules (ESP32-WROOM, MINI-1U, S3) with strictly defined antenna copper keepout zones.
SOIC / SOP / TSSOP / MSOPSOIC
IPC-7351B Level A / B / CUSB-UART, Timer, Op-Amp & SPI Flash ICs (CH340G, NE555, W25Q128, TSSOP-20) supporting live Span C/G/Z toggling.
BGA / WLCSP (2D Ball Grid)BGA
JEDEC MO-275 / MO-211 NSMDUltra-high-density MCUs & SoCs (STM32H7, STM32G0 WLCSP-25, UFBGA-176) with circular NSMD pads and 3D solder ball arrays.
SOT-23 / SOT-223 / TO-252SOT
IPC-7351B Asymmetric TabLDO voltage regulators & power MOSFETs featuring asymmetric heatsink tabs (AMS1117-3.3, SOT-23-5, TO-252).
Through-Hole DIP / HeaderTHT
IPC-2221 / IPC-7251 Plated HoleThrough-hole components, industrial terminal blocks & DIP ICs (NE555P DIP-8) with square Pin 1 polarity pad.