LQFP-48(7x7) · 48P
Electronic Component Library & IPC-7351B CAD Models — Page 311
Look up datasheet specifications, verify synchronized IEEE-315 Symbols / IPC-7351B Footprints / STEP AP214 3D models, and download directly for KiCad 8, Fusion 360 (.lbr), and Altium.
Verified ComponentsDRC PASS
3728
2D ECAD LibrariesIEEE-315 / IPC
11184
3D MCAD ModelsAP214 / GLB
7448
Land Pattern NormalizationIPC-7351B
100%
Split by MPN (3733 · Page 311/312)
Showing 3721–3732 of 3733 componentsSOP-16 · 16P
SOT-223 · 4P
4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V
Low-Dropout Linear Voltage Regulator (LDO)
0805 · 2P
2P2.0×1.2×0.50mmP=1.9mm
Standard Electronic & Interconnect Component
LQFN-56(7x7) · 57P
SMD-38P · 39P
39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V
Wireless Wi-Fi / Bluetooth LE SoC Module
DIP-8 · 8P
TQFP-32(7x7) · 32P
VFQFPN-68(8x8) · 8P
8P
32位Arm Cortex-M33 MCU，带TrustZone、FPU、数学加速器，低功耗，支持安全固件升级，具备多种通信接口
LQFP-48(7x7) · 8P
8P
主流超值系列ARM Cortex-M3 MCU，具有64 KB Flash、24 MHz CPU、运动控制和CEC功能
LQFP-100(14x14) · 8P
8P
主流增强型ARM Cortex-M3 MCU，具有1 MB Flash、72 MHz CPU、电机控制、USB和CAN
Through Hole,Right Angle,P=2mm · 8P
8P
Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃
Components by Package Family (IPC-7351B & IPC-7525)
Each package links to a dedicated directory with IPC pad calculation rules, 60% stencil grids, and copper keepoutsQFN / DFN / LGAQFN
IPC-7351B · 60% Paste WindowHigh-density MCUs & SoCs (RP2040, ESP32-S3, STM32) with 60% segmented paste windows on EPAD to prevent reflow voiding.
LQFP / TQFP (4-Side Gull-Wing)QFP
IPC-7351B Toe/Heel Fillet4-sided gull-wing microcontrollers (STM32F103C8T6 LQFP-48, LQFP-64, LQFP-100) verified for JLCPCB minimum DFM clearance.
Castellated RF ModuleMODULE
IPC-7351B · Antenna KeepoutCastellated Wi-Fi/BLE modules (ESP32-WROOM, MINI-1U, S3) with strictly defined antenna copper keepout zones.
SOIC / SOP / TSSOP / MSOPSOIC
IPC-7351B Level A / B / CUSB-UART, Timer, Op-Amp & SPI Flash ICs (CH340G, NE555, W25Q128, TSSOP-20) supporting live Span C/G/Z toggling.
BGA / WLCSP (2D Ball Grid)BGA
JEDEC MO-275 / MO-211 NSMDUltra-high-density MCUs & SoCs (STM32H7, STM32G0 WLCSP-25, UFBGA-176) with circular NSMD pads and 3D solder ball arrays.
SOT-23 / SOT-223 / TO-252SOT
IPC-7351B Asymmetric TabLDO voltage regulators & power MOSFETs featuring asymmetric heatsink tabs (AMS1117-3.3, SOT-23-5, TO-252).
Through-Hole DIP / HeaderTHT
IPC-2221 / IPC-7251 Plated HoleThrough-hole components, industrial terminal blocks & DIP ICs (NE555P DIP-8) with square Pin 1 polarity pad.